John J Westerman

US Patent:

20200211950, Jul 2, 2020

Filed:

Aug 27, 2019

Appl. No.:

16/552055

Inventors:

- Santa Clara CA, US
Colin March - Santa Rosa CA, US
John Westerman - Santa Rosa CA, US

International Classification:

H01L 23/498
H01L 23/00
H01L 23/055

Abstract:

An integrated circuit package includes a transmission line structure, wire bonds, a first post and a second post. The transmission line structure runs from a printed circuit board (PCB) to an integrated circuit (IC) and includes a center transmission line between two ground lines and sealed from exposure to air. The wire bonds connect the transmission line structure to pads on the integrated circuit from where the center transmission line exits the integrated circuit package. The wire bonds are selected to have an impedance matched to impedance of the integrated circuit. The first post supports the center transmission line where the center transmission line enters the integrated circuit package from the printed circuit board. The second post supports the center transmission line where the center transmission line exits the integrated circuit package to connect to the wire bonds.