Jonathan T Robbins

US Patent:

8028537, Oct 4, 2011

Filed:

May 1, 2009

Appl. No.:

12/434248

Inventors:

Roger T. Hanley - Great Falls VA, US
Robert M. Becker - Centerville VA, US
Steven S. Lyons - Herndon VA, US
David P. Ramer - Reston VA, US
Jonathan A. Robbins - Ashburn VA, US
Chad N. Sanders - Ashburn VA, US
J. Michael Phipps - Springfield VA, US

Assignee:

ABL IP Holding LLC - Conyers GA

International Classification:

F21V 7/00
F21V 3/00
F21V 5/00
F21V 21/00
F21V 7/04
F21S 4/00

US Classification:

62298, 36231106, 362631, 36224902, 36231102, 362302

Abstract:

Disclosed exemplary solid state light fixtures use optical cavities to combine or integrate light from LEDs or the like. In such a fixture, the cavity is formed by a light transmissive structure having a volume, and a diffuse reflector that covers a contoured portion of the structure. A heat sink member supports a flexible circuit board so as to position the light emitters to couple light to the transmissive structure and provide effective heat dissipation. The circuit board has flexible tabs mounting the emitters. When installed in the fixture, the tabs bend and the emitters press against a sufficiently rigid periphery of the light transmissive structure. TIM may be compressed between the heat sink member and the opposite surface of each tab. Heat conductive surface pads and heat conductors through vias through the tabs conduct heat from the emitters to the heat sink member, e. g. through the TIM.

US Patent:

20120268890, Oct 25, 2012

Filed:

Apr 19, 2011

Appl. No.:

13/089623

Inventors:

Michael STOCK - Fairfax VA, US
Brenda Campbell - Woodbridge VA, US
Jonathan Robbins - Richmond VA, US

International Classification:

G06F 1/20

US Classification:

36167953, 361691

Abstract:

A plenum for guiding a flow of cooling air through the interior of a computer is designed to maximize the airflow over those electrical components within the computer which are most sensitive to temperature, and/or which require the greatest amount of cooling. The plenum is designed to be mounted over top of a computer motherboard which includes a plurality of electrical components mounted thereon. One or more apertures are formed in the lower wall of the plenum so that electrical components mounted on the computer motherboard can protrude through the apertures and into the interior of the plenum. The lower surface of the plenum is designed to prevent the flow of cooling air passing through the plenum from escaping through the apertures on the lower wall. Also, upper and lower protrusions on the plenum can extend into the interior of the plenum to concentrate the flow of cooling air onto the electrical components which are protruding through the apertures and into plenum.