Joo Ok Kim

US Patent:

20070202321, Aug 30, 2007

Filed:

Nov 9, 2005

Appl. No.:

11/272332

Inventors:

Seung Mun You - Arlington TX, US
Joo Han Kim - Fort Worth TX, US

Assignee:

Board of Regents, The University of Texas System - Austin TX

International Classification:

B32B 5/16

US Classification:

428328000

Abstract:

A microporous surface is created using particles of various sizes in conjunction with a thermally conductive binder. Advantages to a mixture batch type application of the coating include that it is an inexpensive and easy process which does not require extremely high operating temperatures. The disclosed coating technique is efficient for various types of working liquids simply by changing the size of metal particle sizes since different surface tension of liquids requires different size range of porous cavities to optimize boiling heat transfer performance. In one embodiment, the coating is applied to an electronic component surface.

US Patent:

20080236795, Oct 2, 2008

Filed:

Mar 26, 2007

Appl. No.:

11/690937

Inventors:

Seung Mun You - Arlington TX, US
Joo Han Kim - Arlington TX, US
Sang M. Kwark - Grand Prairie TX, US
Jesse Jaejin Kim - Sunnyvale CA, US

International Classification:

H05K 7/20

US Classification:

16510421, 361700

Abstract:

Systems and fabrication methods are disclosed for a heat spreader to cool a device. The heat spreader has first and second opposing proximal surfaces defining a chamber having a liquid therein; and one or more structures mounted in the chamber to induce a liquid flow pattern during a boiling of the liquid to distribute heat.

US Patent:

20130020053, Jan 24, 2013

Filed:

Jun 6, 2012

Appl. No.:

13/489697

Inventors:

Seung Mun You - Arlington TX, US
Joo Han Kim - Arlington TX, US
Sang M. Kwark - Grand Prairie TX, US
Jesse Jaejin Kim - Sunnyvale CA, US

International Classification:

F28D 15/02
F28F 13/18

US Classification:

16510421, 16510429, 165133

Abstract:

Systems and fabrication methods are disclosed for a heat spreader to cool a device. The heat spreader has first and second opposing proximal surfaces defining a chamber having a liquid therein; and one or more structures mounted in the chamber to induce a liquid flow pattern during a boiling of the liquid to distribute heat.