Jose Recio

US Patent:

7318325, Jan 15, 2008

Filed:

Jan 31, 2006

Appl. No.:

11/343431

Inventors:

Daniel P. Rini - Orlando FL, US
Louis Chow - Winter Park FL, US
H. Randolph Anderson - Clermont FL, US
Jayanta Sankar Kapat - Oviedo FL, US
Bradley Carman - Orlando FL, US
Brian Gulliver - Orange City FL, US
Jose Mauricio Recio - Parkland FL, US

Assignee:

Rini Technologies, Inc. - Oviedo FL

International Classification:

F25B 39/04

US Classification:

62507, 165154

Abstract:

The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface. In another specific embodiment, the heat transfer surface can incorporate surface enhancements which enhance the transfer of heat from the heat transfer surface to the external fluid.

US Patent:

7942642, May 17, 2011

Filed:

Jun 30, 2009

Appl. No.:

12/495279

Inventors:

Daniel P. Rini - Orlando FL, US
Louis Chow - Winter Park FL, US
H. Randolph Anderson - Clermont FL, US
Jayanta Sankar Kapat - Oviedo FL, US
Bradley Carman - Orlando FL, US
Brian Gulliver - Orange City FL, US
Jose Mauricio Recio - Parkland FL, US

Assignee:

Rini Technologies, Inc. - Oviedo FL

International Classification:

F04B 49/06
F04B 35/04
F01C 1/02

US Classification:

417 53, 4174103, 418 612

Abstract:

The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface. In another specific embodiment, the heat transfer surface can incorporate surface enhancements which enhance the transfer of heat from the heat transfer surface to the external fluid.

US Patent:

8024942, Sep 27, 2011

Filed:

Dec 21, 2007

Appl. No.:

11/963669

Inventors:

Daniel P. Rini - Orlando FL, US
Louis Chow - Winter Park FL, US
H. Randolph Anderson - Clermont FL, US
Jayanta Sankar Kapat - Oviedo FL, US
Bradley Carman - Orlando FL, US
Brian Gulliver - Orange City FL, US
Jose Mauricio Recio - Parkland FL, US

Assignee:

Rini Technologies, Inc. - Oviedo FL

International Classification:

F25B 39/04

US Classification:

62507, 62508

Abstract:

The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface. In another specific embodiment, the heat transfer surface can incorporate surface enhancements which enhance the transfer of heat from the heat transfer surface to the external fluid.

US Patent:

8371134, Feb 12, 2013

Filed:

Jun 30, 2009

Appl. No.:

12/495312

Inventors:

Daniel P. Rini - Orlando FL, US
Louis Chow - Orlando FL, US
H. Randolph Anderson - Clermont FL, US
Jayanta Sankar Kapat - Oviedo FL, US
Bradley Carman - Sanford FL, US
Brian Gulliver - Orange City FL, US
Jose Mauricio Recio - Oviedo FL, US

Assignee:

Rini Technologies, Inc. - Oviedo FL

International Classification:

F25D 17/02

US Classification:

62 98, 62515

Abstract:

The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface. In another specific embodiment, the heat transfer surface can incorporate surface enhancements which enhance the transfer of heat from the heat transfer surface to the external fluid.

US Patent:

20040129018, Jul 8, 2004

Filed:

Jul 22, 2003

Appl. No.:

10/625014

Inventors:

Daniel Rini - Orlando FL, US
Louis Chow - Winter Park FL, US
H. Anderson - Clermont FL, US
Jayanta Kapat - Oviedo FL, US
Bradley Carman - Orlando FL, US
Brian Gulliver - Orange City FL, US
Jose Recio - Parkland FL, US

International Classification:

F25B039/04

US Classification:

062/507000, 062/506000, 062/428000, 062/508000

Abstract:

The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface. In another specific embodiment, the heat transfer surface can incorporate surface enhancements which enhance the transfer of heat from the heat transfer surface to the external fluid. In another specific embodiment, an outer layer can be positioned above the heat transfer surface to create a volume between the heat transfer surface and the outer layer through which the external fluid can flow.

US Patent:

20070235170, Oct 11, 2007

Filed:

Apr 5, 2007

Appl. No.:

11/784264

Inventors:

Brian Zinck - Chuluota FL, US
Jose Mauricio Recio - Oviedo FL, US

International Classification:

F28F 13/18
F28F 19/02
F28F 3/00

US Classification:

165133, 1651341, 165 804, 165166

Abstract:

The subject invention pertains to a method and apparatus for heating exchanging. In various embodiments, the application of coating, plating, soldering, and brazing technologies can be used to create high performance heat exchangers. Specific embodiments of the subject heat exchanger can be lightweight and resistant or impervious to oxidation and/or corrosion. Specific embodiments of the subject heat exchanger can be highly manufacturable. Embodiments of the subject invention are directed to a heat exchanger that includes primarily, but not necessarily entirely, components or assemblies that are made from aluminum and/or aluminum alloys, and are coated or plated with a more oxidation and/or corrosion resistant metal. The coated or plated aluminum components or assemblies can be specifically resistant to corrosion or oxidation in the presence of water or water based solutions and mixtures. The metallic coating or plating materials can have excellent thermal conductivity so as to minimize the reduction of heat exchanger performance. Furthermore, these coated or plated components or assemblies can be highly assemblable and manufacturable as a result of the coating or plating process.

US Patent:

20090294097, Dec 3, 2009

Filed:

Feb 6, 2009

Appl. No.:

12/367230

Inventors:

Daniel P. Rini - Orlando FL, US
Benjamin A. Saarloos - Orlando FL, US
Jose Mauricio Recio - Oviedo FL, US
James R. Hughes - Winter Park FL, US

Assignee:

Rini Technologies, Inc. - Oviedo FL

International Classification:

F25B 29/00
F25B 27/00
F25B 41/00

US Classification:

165 63, 622387, 62113

Abstract:

Embodiments of the subject invention pertain to a method and apparatus for heating or cooling. Embodiments relate to a method and apparatus utilizing a vapor compression cycle to accomplish active heating or cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient heating or cooling system for underwater applications. The subject system can provide heating or cooling stress relief to individuals operating under, for example, hazardous conditions, or in low temperature underwater environments where passive protective clothing provides insufficient mitigation of cooling stress. Further embodiments can be utilized to provide heat stress relief to users who are working in thermally encapsulated ensembles that hinder the body's natural ability to expel heat. The subject system can be utilized in other applications that can benefit from this type of heating or cooling system. The performance of this system cannot be matched simply by using smaller versions of currently available designs or technologies.