Skills:
SPC, JMP, Datapower, Spotfire, Etch, Plating, Bump, RDL, WLCSP, DOE, 8D, FMEA, Control Plan, Technology Transfer, FAB startup, Factory Startup, Sapphire Growth, Post Etch Cleans, Electroplating, Wafer Level Packaging, Control Plans, Process Maps, 5-Why, Lean Manufacturing, DOE Modeling,