Joseph K. Fauty - Mesa AZ Jay Allen Yoder - Glendale AZ
Assignee:
Semiconductor Components Industries, L.L.C. - Phoenix AZ
International Classification:
H01L 23495
US Classification:
257666, 257783, 257775, 257787, 257781, 257784
Abstract:
An semiconductor device ( ) comprising a first semiconductor die ( ) and a leadframe ( ). The leadframe includes a first laminate ( ) having a bottom surface formed with a lead ( ) of the semiconductor device, a second laminate ( ) overlying the first laminate for mounting the semiconductor die, and an adhesive tape ( ) for attaching the first and second laminates.
Method Of Forming A Semiconductor Package And Leadframe Therefor
Joseph K. Fauty - Mesa AZ, US James Howard Knapp - Gilbert AZ, US
Assignee:
Semiconductor Components Industries, L.L.C. - Phoenix AZ
International Classification:
H01L 21/44 H01L 21/48 H01L 21/50
US Classification:
438123, 438124
Abstract:
A method of forming a leadframe and a semiconductor package using the leadframe facilitates selectively forming leads for the package. The leadframe is formed with a first portion of the leads extending from a panel of the leadframe into a molding cavity section of the leadframe. After encapsultaion, a portion of the leadframe panel is used to form a second portion of the leads that is external to the package body.
Francis J. Carney - Gilbert AZ, US Phillip Celaya - Gilbert AZ, US Joseph K. Fauty - Mesa AZ, US James P. Letterman - Mesa AZ, US Stephen St. Germain - Scottsdale AZ, US Jay A. Yoder - Phoenix AZ, US
Assignee:
Semiconductor Components Industries, L.L.C. - Phoenix AZ
International Classification:
H01L 23/495
US Classification:
438107, 257E23042
Abstract:
In one exemplary embodiment, a multi-chip connector is formed to have a first conductive strip that is attached to a first semiconductor die and a second conductive strip that is attached to a second semiconductor die.
Francis J. Carney - Gilbert AZ, US Phillip Celaya - Gilbert AZ, US Joseph K. Fauty - Mesa AZ, US James P. Letterman - Mesa AZ, US Stephen St. Germain - Scottsdale AZ, US Jay A. Yoder - Phoenix AZ, US
Assignee:
Semiconductor Components Industries, L.L.C. - Phoenix AZ
International Classification:
H01L 21/44 H01L 21/50
US Classification:
438107, 438121, 257E21499
Abstract:
In one exemplary embodiment, a multi-chip connector is formed to have a first conductive strip that is suitable for attaching to a first semiconductor die and a second conductive strip that is attached suitable for attaching to a second semiconductor die.
Francis J. Carney - Gilbert AZ, US Phillip Celaya - Gilbert AZ, US Joseph K. Fauty - Mesa AZ, US James P. Letterman - Mesa AZ, US Stephen St. Germain - Scottsdale AZ, US Jay A. Yoder - Phoenix AZ, US
Assignee:
Semiconductor Components Industries, L.L.C. - Phoenix AZ
In one exemplary embodiment, a multi-chip semiconductor connector is utilized for forming a semiconductor package having a plurality of semiconductor die. The multi-chip semiconductor connector is utilized to mechanically attach the plurality of semiconductor die together and to provide electrical connection to the plurality of semiconductor die.
Encapsulated Chip Scale Package Having Flip-Chip On Lead Frame Structure And Method
Joseph K. Fauty - Mesa AZ, US Denise Thienpont - Scottsdale AZ, US
Assignee:
Semiconductor Components Industries, L.L.C. - Phoenix AZ
International Classification:
H01L 21/00
US Classification:
438123, 438108
Abstract:
In one embodiment, an encapsulated electronic package includes a semiconductor chip having patterned solderable pads formed on a major surface. During an assembly process, the patterned solderable pads are directly affixed to conductive leads. The assembly is encapsulated using, for example, a MAP over-molding process, and then placed through a separation process to provide individual chip scale packages having flip-chip on lead frame interconnects.
Francis J. Carney - Gilbert AZ, US Phillip Celaya - Gilbert AZ, US Joseph K. Fauty - Mesa AZ, US James P. Letterman - Mesa AZ, US Stephen St. Germain - Scottsdale AZ, US Jay A. Yoder - Phoenix AZ, US
Assignee:
Semiconductor Components Industries, L.L.C. - Phoenix AZ
International Classification:
H01L 21/00
US Classification:
438107, 438111, 257E21615
Abstract:
In one exemplary embodiment, a multi-chip connector is formed to have a first conductive strip that is attached to a first semiconductor die and a second conductive strip that is attached to a second semiconductor die.
Francis J. Carney - Gilbert AZ, US Phillip Celaya - Gilbert AZ, US Joseph K. Fauty - Mesa AZ, US James P. Letterman - Mesa AZ, US Stephen St. Germain - Scottsdale AZ, US Jay A. Yoder - Phoenix AZ, US
Assignee:
Semiconductor Components Industries, L.L.C. - Phoenix AZ
International Classification:
H01L 23/52
US Classification:
257686
Abstract:
In one exemplary embodiment, a multi-chip semiconductor connector is utilized for forming a semiconductor package having a plurality of semiconductor die. The multi-chip semiconductor connector is utilized to mechanically attach the plurality of semiconductor die together and to provide electrical connection to the plurality of semiconductor die.