Joseph M Link

Address:

1871 W Chestnut St APT B, Lancaster, OH 43130

VIN:

1HD1CX3177K417315

Make:

Cadillac

Model:

Escalade ESV AWD 4dr

Year:

2007

US Patent:

6687980, Feb 10, 2004

Filed:

Aug 11, 2000

Appl. No.:

09/636664

Inventors:

Joseph Link - Pleasanton CA
Kurt Raab - San Jose CA

Assignee:

Tessera, Inc. - San Jose CA

International Classification:

B23P 1900

US Classification:

29760, 29827, 292811, 292815, 361736

Abstract:

An apparatus for processing flexible tape for microelectronic assemblies includes a base having a top surface, a bottom surface and an aperture extending between the top and bottom surfaces, and a platform having a top surface for engaging a flexible tape used for making microelectronic assemblies, such as semiconductor chip packages. The platform is sized to fit within the aperture extending between the top and bottom surfaces of the base. The base is pivotally secured at one end of the platform so that when the base pivots with respect to the platform, the flexible tape engaged by the platform remains on the platform. The assembly also includes a carrier frame having a slot and a clamp sized to pass through the slot and the carrier frame and the aperture in the base for securing the flexible tape to the top surface of the platform as the base pivots with respect to the platform.

US Patent:

6709469, Mar 23, 2004

Filed:

Aug 30, 2000

Appl. No.:

09/650834

Inventors:

Joseph Link - Pleasanton CA

Assignee:

Tessera, Inc. - San Jose CA

International Classification:

H01L 2100

US Classification:

29 2501

Abstract:

A stencil assembly for placing conductive elements over conductive pads accessible at a first surface of a microelectronic element includes a main body having a top surface and a bottom surface and a plurality of openings extending between the top and bottom surfaces, the main body being adapted for overlying the first surface of the microelectronic element so that the openings are in substantial alignment with the pads of the microelectronic element. The stencil assembly also includes a spacer element under the bottom surface of the main body, the spacer element being adapted for maintaining the main body above the first surface of the microelectronic element and remote from the pads of the microelectronic element. The main body and the spacer element have a combined thickness that is substantially equivalent to the diameter of the conductive elements.

US Patent:

61626619, Dec 19, 2000

Filed:

May 29, 1998

Appl. No.:

9/086808

Inventors:

Joseph Link - Pleasanton CA

Assignee:

Tessera, Inc. - San Jose CA

International Classification:

H01L 2144
H01L 2148
H01L 2150

US Classification:

438108

Abstract:

A method placing conductive elements, such as solder balls, over terminals on a microelectronic assembly includes providing a microelectronic element having a first surface and one or more terminals accessible at the first surface, and securing a spacer plate having a top surface, a bottom surface and at least one opening extending therethrough over the first surface of the microelectronic element so that the at least one opening is in substantial alignment with the terminals. After the spacer plate has been secured over the first surface of the microelectronic element, a stencil for placing conductive elements is then secured over the spacer plate. The stencil has a top surface and a bottom surface and a plurality of openings extending therethrough. When the stencil is secured over the spacer plate, the plurality of openings in the stencil are in substantial alignment with the terminals. As a result, the spacer plate maintains the stencil remote from the terminals.

US Patent:

61701513, Jan 9, 2001

Filed:

Nov 19, 1999

Appl. No.:

9/443530

Inventors:

Joseph Link - Pleasanton CA
Kurt Raab - San Jose CA

Assignee:

Tessera, Inc. - San Jose CA

International Classification:

B23P 1904

US Classification:

29740

Abstract:

An assembly for processing a flexible tape comprises a carrier frame having a slot and a cut-out region contiguous with one end of the slot for selectively transferring the flexible tape from the top surface of the carrier frame to the bottom surface of the carrier frame. An apparatus for processing the flexible tape is also disclosed and includes the carrier frame, a base having an aperture and a platform sized to fit within the aperture of the base. The base is pivotable around one end of the platform.

US Patent:

60499729, Apr 18, 2000

Filed:

Jan 23, 1998

Appl. No.:

9/012590

Inventors:

Joseph Link - Pleasanton CA
Kurt Raab - San Jose CA

Assignee:

Tessera, Inc. - San Jose CA

International Classification:

H01R 4300

US Classification:

29827

Abstract:

A method of making a microelectronic assembly includes providing a flexible tape having first and second surfaces with a plurality of connection components in a central region of the flexible tape, providing a carrier frame having top and bottom surfaces and a slot extending therebetween and placing the flexible tape in contact with the top surface of the carrier frame. Next a resilient element is provided on each connection component and the flexible tape is passed through the slot so that the flexible tape disengages from the top surface of the carrier frame, passes through the slot and engages the bottom surface of the carrier frame. The carrier frame includes one or more interior edges defining the slot and a cut-out region contiguous with one end of the slot. The cut-out region also extends between the top and bottom surfaces of the carrier frame and the width of the cut-out region is greater than the width of the flexible tape so that at least one side border region of the flexible tape is pivotally secured to the carrier frame.