Joseph Madak

US Patent:

62797018, Aug 28, 2001

Filed:

Sep 13, 1999

Appl. No.:

9/394726

Inventors:

Chandra Sekhar Namuduri - Sterling Heights MI
Alexander Apostolos Alexandridis - Orchard Lake Village MI
Joseph Madak - Madison Heights MI
David S. Rule - Orchard Lake MI

Assignee:

Delphi Technologies, Inc. - Troy MI

International Classification:

F16F 953

US Classification:

1882672

Abstract:

An improved magnetorheological fluid damper is provided which closely approximates ideal performance requirements by providing an increased turn-up ratio and improving the linearity of damping force response. The MR damper includes a plurality of concentric annular flow gaps formed between concentrically mounted flux rings positioned on a piston core. By utilizing multiple flow gaps, the present damper increases the overall magnetorheological damping affect thereby creating a higher damping force and an increased tun-up ratio for a given piston size. Alternatively, the present multiple flow gap design permits a given damping force requirement to be achieved with a piston having a significantly reduced length thereby permitting a longer piston stroke. Also, multiple flow gaps permit greater design optimization for controlling damping force linearity.

US Patent:

54539110, Sep 26, 1995

Filed:

Feb 17, 1994

Appl. No.:

8/197989

Inventors:

James H. Wolgemuth - Rochester Hills MI
Joseph Madak - Madison Heights MI

Assignee:

General Motors Corporation - Detroit MI

International Classification:

H05K 720

US Classification:

361689

Abstract:

A heatsink or cold plate is provided with which power electronic components mounted to a surface of the cold plate can be cooled with a cooling fluid flowing through the cold plate. The cold plate generally consists of a relatively planar structure through which one or more passages are formed for directing the cooling fluid through the cold plate. The passages direct the cooling fluid to recesses in the surface of the cold plate which are enclosed by the power electronic components. As such, cooling of the power electronic components is achieved by directly impinging the cooling fluid at their lower surfaces, preferably at an acute angle, such that enhanced heat transfer characteristics result.