Joseph M Poole

US Patent:

6432511, Aug 13, 2002

Filed:

Jun 6, 1997

Appl. No.:

08/864726

Inventors:

John G. Davis - Charlotte NC
Michael A. Gaynes - Vestal NY
Joseph D. Poole - Troutman NC

Assignee:

International Business Machines Corp. - Armonk NY

International Classification:

B32B 300

US Classification:

428156, 156 87, 1563066, 165 802, 165138, 264163

Abstract:

Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.

US Patent:

6457631, Oct 1, 2002

Filed:

Jan 31, 2001

Appl. No.:

09/774971

Inventors:

Wilton L. Cox - Charlotte NC
Joseph D. Poole - Troutman NC
Kris A. Slesinger - Charlotte NC

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B23K 120

US Classification:

228214, 228175, 228265

Abstract:

A method and apparatus for desoldering electronic components from a substrate. A vacuum is used, to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections. A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.

US Patent:

6464125, Oct 15, 2002

Filed:

Feb 14, 2001

Appl. No.:

09/783642

Inventors:

Wilton L. Cox - Charlotte NC
Joseph D. Poole - Troutman NC
Kris A. Slesinger - Charlotte NC

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B23K 100

US Classification:

228 33, 228 8, 228 11

Abstract:

A method and apparatus for desoldering electronic components from a substrate. A vacuum is used to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections. A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.

US Patent:

6499644, Dec 31, 2002

Filed:

Feb 14, 2001

Appl. No.:

09/783643

Inventors:

Wilton L. Cox - Charlotte NC
Joseph D. Poole - Troutman NC
Kris A. Slesinger - Charlotte NC

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B23K 100

US Classification:

228 19, 228 201, 228 205, 228264

Abstract:

A method and apparatus for desoldering electronic components from a substrate. A vacuum is used to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections. A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.

US Patent:

6589376, Jul 8, 2003

Filed:

Apr 28, 1998

Appl. No.:

09/067940

Inventors:

John G. Davis - Charlotte NC
Joseph D. Poole - Troutman NC
Kris A. Slesinger - Charlotte NC
Michael C. Weller - Harrisburg NC

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2144

US Classification:

156 64, 156247, 156249, 156299, 438119, 29834, 29740, 29741

Abstract:

A method of mounting a component on a substrate includes applying a conductive adhesive on a contact pad joined to a substrate, aligning a component with the substrate such that at least one lead of the component is juxtaposed with the conductive adhesive, performing a partial cure of the conductive adhesive, testing performance of the component, and performing a full cure of the conductive adhesive. Another method includes the additional steps of applying a tacky film to the substrate and juxtaposing the component with the tacky film. When the testing in either embodiment shows a defective or misaligned component, the component may be replaced or repositioned by cold separation of the at least one component lead from the partially cured conductive adhesive. Optionally, additional conductive adhesive may be applied, when needed, before replacement or repositioning of a component. A composition for mounting a component on a circuit board includes a conductive adhesive screened on a contact pad, the conductive adhesive being partially cured, wherein the composition allows cold separation of the component from the substrate and may be fully cured by heat exposure.

US Patent:

6590285, Jul 8, 2003

Filed:

Nov 28, 2000

Appl. No.:

09/723706

Inventors:

John G. Davis - Charlotte NC
Joseph D. Poole - Troutman NC
Kris A. Slesinger - Charlotte NC
Michael C. Weller - Harrisburg NC

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2348

US Classification:

257735, 257737, 257778, 257783

Abstract:

A method of mounting a component on a substrate includes applying a conductive adhesive on a contact pad joined to a substrate, aligning a component with the substrate such that at least one lead of the component is juxtaposed with the conductive adhesive, performing a partial cure of the conductive adhesive, testing performance of the component, and performing a full cure of the conductive adhesive. Another method includes the additional steps of applying a tacky film to the substrate and juxtaposing the component with the tacky film. When the testing in either embodiment shows a defective or misaligned component, the component may be replaced or repositioned by cold separation of the at least one component lead from the partially cured conductive adhesive. Optionally, additional conductive adhesive may be applied, when needed, before replacement or repositioning of a component. A composition for mounting a component on a circuit board includes a conductive adhesive screened on a contact pad, the conductive adhesive being partially cured, wherein the composition allows cold separation of the component from the substrate and may be fully cured by heat exposure.

US Patent:

6893591, May 17, 2005

Filed:

Jul 10, 2002

Appl. No.:

10/191061

Inventors:

John G. Davis - Charlotte NC, US
Michael A. Gaynes - Vestal NY, US
Joseph D. Poole - Troutman NC, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B28B007/14

US Classification:

264153, 264163, 264320, 2643281

Abstract:

Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.

US Patent:

7645410, Jan 12, 2010

Filed:

Aug 11, 2004

Appl. No.:

10/915374

Inventors:

John G. Davis - Charlotte NC, US
Michael A. Gaynes - Vestal NY, US
Joseph D. Poole - Troutman NC, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B29C 51/02

US Classification:

264319, 264153, 264154, 264155

Abstract:

Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.