Joseph G Schaefer

US Patent:

7072393, Jul 4, 2006

Filed:

Jun 25, 2001

Appl. No.:

09/888964

Inventors:

Charles Boice - Endicott NY, US
Joseph G Schaefer - Berkshire NY, US
Brian J Cascarino - Apalachin NY, US
Charles C Stein - Peckville PA, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H04N 7/18
H04B 1/66

US Classification:

37524001

Abstract:

System and method are provided for optimally encoding a sequence of video frames using image statistics collected from multiple encoders connected in parallel, each encoder employing a different set of encode parameters. The image statistics are used to select an optimum set of encode parameters for use in encoding the sequence of video frames in a subsequent encode subsystem stage. As an alternative, multiple buffers are connected to the outputs of the multiple, parallel connected encoders, with the encoded stream from the encoder employing the optimum set of encode parameters selected for output as the bitstream of encoded video data.

US Patent:

7474701, Jan 6, 2009

Filed:

Sep 23, 2004

Appl. No.:

10/948772

Inventors:

Charles E. Boice - Endicott NY, US
Krishna C. Ratakonda - Yorktown Heights NY, US
Joseph G. Schaefer - Berkshire NY, US
Joseph H. Underwood - Apalachin NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H04N 7/12
H04N 11/02

US Classification:

37524026, 37524001

Abstract:

An encode control strategy is provided for variable bit rate encoding of a sequence of video frames in a single pass. The control strategy includes determining whether a video frame has a complexity level statistically outside a defined range from a complexity level of at least one preceding frame of the sequence of video frames, and if so, determining a new average bit rate target for the video frame. The new average bit rate for the video frame is determined employing at least one of spatial complexity and temporal complexity of the video frame. The new average bit rate target for the video frame is used to set frame level bit rate control parameter(s), and the video frame is encoded using the set frame level bit rate control parameter(s).

US Patent:

7512181, Mar 31, 2009

Filed:

May 27, 2008

Appl. No.:

12/127119

Inventors:

Charles E. Boice - Endicott NY, US
Krishna C. Ratakonda - Yorktown Heights NY, US
Joseph G. Schaefer - Berkshire NY, US
Joseph H. Underwood - Apalachin NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H04N 7/12
H04N 11/02

US Classification:

37524026, 37524002

Abstract:

An encode control strategy is provided for variable bit rate encoding of a sequence of video frames in a single pass. The control strategy includes determining whether a video frame has a complexity level statistically outside a defined range from a complexity level of at least one preceding frame of the sequence of video frames, and if so, determining a new average bit rate target for the video frame. The new average bit rate for the video frame is determined employing at least one of spatial complexity and temporal complexity of the video frame. The new average bit rate target for the video frame is used to set frame level bit rate control parameter(s), and the video frame is encoded using the set frame level bit rate control parameter(s).

US Patent:

20060126737, Jun 15, 2006

Filed:

Dec 15, 2004

Appl. No.:

11/012904

Inventors:

Charles Boice - Endicott NY, US
Adrian Butter - Binghamton NY, US
Joseph Schaefer - Berkshire NY, US
Edward Westermann - Endicott NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H04N 11/02
H04N 5/225
H04N 11/04
H04N 7/12
H04B 1/66

US Classification:

375240160, 375240240, 348169000

Abstract:

A method, system and program product in accordance with the preferred embodiments use motion vector data to track an object being monitored by a video camera. Motion vector data are used to calculate pan, tilt and/or zoom adjustment data. For example, motion vector data may be provided to a motion tracking processor at a macroblock level by an MPEG compression processor. Alternatively, motion vector data may be provided to a motion tracking processor at a pixel level by a pre-processor. The pan, tilt and/or zoom adjustment data is sent to the camera. For example, the pan, tilt and/or zoom adjustment data may be sent to a PTZ adjustment mechanism of the camera. Because the preferred embodiments use a closed loop system, tracking the object is made easier and does not require a skilled operator.

US Patent:

20060126738, Jun 15, 2006

Filed:

Dec 15, 2004

Appl. No.:

11/013271

Inventors:

Charles Boice - Endicott NY, US
Adrian Butter - Binghamton NY, US
Joseph Schaefer - Berkshire NY, US
Edward Westermann - Endicott NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H04N 11/02
H04N 5/33
H04N 7/12
H04N 11/04
H04B 1/66

US Classification:

375240160, 348168000, 375240240

Abstract:

A method, system and program product in accordance with the preferred embodiments use motion vector data to track an object moving between areas being monitored by a plurality of video cameras. Motion vector data are used to predict whether an object in a first field of view covered by a first camera system will enter a second field of view covered by a second camera system. If the prediction is that the object will enter the second field of view, tracking data are provided to the second camera system. The tracking data may include pan, tilt and/or zoom adjustment data, which may be provided to a PTZ adjustment mechanism of the second camera system, for example. Alternatively, or in addition, the tracking data may include pan/tilt motion vector data, zoom factor data and/or shrinkage/expansion data, which are provided to a motion tracking processor of the second camera system.

US Patent:

20090110081, Apr 30, 2009

Filed:

Jan 12, 2009

Appl. No.:

12/352135

Inventors:

Charles E. BOICE - Endicott NY, US
Krishna C. RATAKONDA - Yorktown Heights NY, US
Joseph G. SCHAEFER - Berkshire NY, US
Joseph H. UNDERWOOD - Apalachin NY, US

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

H04N 7/12

US Classification:

37524026, 375E07154

Abstract:

An encode control strategy is provided for variable bit rate encoding of a sequence of video frames in a single pass. The control strategy includes determining whether a video frame has a complexity level statistically outside a defined range from a complexity level of at least one preceding frame of the sequence of video frames, and if so, determining a new average bit rate target for the video frame. The new average bit rate for the video frame is determined employing at least one of spatial complexity and temporal complexity of the video frame. The new average bit rate target for the video frame is used to set frame level bit rate control parameter(s), and the video frame is encoded using the set frame level bit rate control parameter(s).

US Patent:

51307790, Jul 14, 1992

Filed:

Jun 19, 1990

Appl. No.:

7/540256

Inventors:

Birendra N. Agarwala - Hopewell Junction NY
Aziz M. Ahsan - Hopewell Junction NY
Arthur Bross - Poughkeepsie NY
Mark F. Chadurjian - Essex Junction VT
Nicholas G. Koopman - Hopewell Junction NY
Li-Chung Lee - Saratoga CA
Karl J. Puttlitz - Wappingers Falls NY
Sudipta K. Ray - Wappingers Falls NY
James G. Ryan - Essex Junction VT
Joseph G. Schaefer - Berkshire NY
Kamalesh K. Srivastava - Wappingers Falls NY
Paul A. Totta - Poughkeepsie NY
Erick G. Walton - South Burlington VT
Adolf E. Wirsing - South Hero VT

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2348
H01L 2350
H01L 2354

US Classification:

357 67

Abstract:

The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer, thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a sidewall spacer formed on the sidewalls of the solder mass.

US Patent:

52518060, Oct 12, 1993

Filed:

Apr 16, 1992

Appl. No.:

7/870647

Inventors:

Birendra N. Agarwala - Hopewell Junction NY
Aziz M. Ahsan - Hopewell Junction NY
Arthur Bross - Poughkeepsie NY
Mark F. Chadurjian - Essex Junction VT
Nicholas G. Koopman - Hopewell Junction NY
Li-Chung Lee - Saratoga CA
Karl J. Puttlitz - Wappingers Falls NY
Sudipta K. Ray - Wappingers Falls NY
James G. Ryan - Essex Junction VT
Joseph G. Schaefer - Berkshire NY
Kamalesh K. Srivastava - Wappingers Falls NY
Paul A. Totta - Poughkeepsie NY
Erick G. Walton - South Burlington VT
Adolf E. Wirsing - South Hero VT

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 21283

US Classification:

22818022

Abstract:

The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer, thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a sidewall spacer formed on the sidewalls of the solder mass.