Joseph M Schaefer

US Patent:

20230049264, Feb 16, 2023

Filed:

Aug 11, 2021

Appl. No.:

17/399815

Inventors:

- Chicago IL, US
Joseph D. Schaefer - Richmond Heights MO, US

International Classification:

D05B 19/12
G05B 15/02
G01B 21/08

Abstract:

An example method includes determining, by a computing system, a dry thickness of a fabric preform. The method also includes determining, by the computing system, a debulked thickness of the fabric preform using the dry thickness of the fabric preform. In addition, the method includes determining, by the computing system, a stitch tension using the dry thickness of the fabric preform and the debulked thickness of the fabric preform. And the method includes causing, by the computing system, a stitching machine to apply a through-the-thickness stitch having the stitch tension to the fabric preform.

US Patent:

20200257768, Aug 13, 2020

Filed:

Feb 13, 2019

Appl. No.:

16/274868

Inventors:

- Chicago IL, US
Joseph D. Schaefer - Richmond Heights MO, US
Matthew Jeffrey Molitor - O'Fallon MO, US

International Classification:

G06F 17/50

Abstract:

A method includes obtaining failure initiation characteristics of a bonding layer of one or more bonded structures and determining, based on the failure initiation characteristics, a first characteristic dimension for each analysis element of a first portion of a finite element analysis model. The method includes obtaining failure propagation characteristics of the bonding layer and determining, based on the failure propagation characteristics, a second characteristic dimension for each analysis element of a second portion of the model. The method includes assigning a first set of material parameters to analysis elements of the first portion of the model and assigning a second set of material parameters to analysis elements of the second portion of the model. The method includes evaluating failure modes of the one or more bonded structures based on a solution to the model, the first set of material parameters, and the second set of material parameters.