Joseph W Schaefer

US Patent:

51307790, Jul 14, 1992

Filed:

Jun 19, 1990

Appl. No.:

7/540256

Inventors:

Birendra N. Agarwala - Hopewell Junction NY
Aziz M. Ahsan - Hopewell Junction NY
Arthur Bross - Poughkeepsie NY
Mark F. Chadurjian - Essex Junction VT
Nicholas G. Koopman - Hopewell Junction NY
Li-Chung Lee - Saratoga CA
Karl J. Puttlitz - Wappingers Falls NY
Sudipta K. Ray - Wappingers Falls NY
James G. Ryan - Essex Junction VT
Joseph G. Schaefer - Berkshire NY
Kamalesh K. Srivastava - Wappingers Falls NY
Paul A. Totta - Poughkeepsie NY
Erick G. Walton - South Burlington VT
Adolf E. Wirsing - South Hero VT

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2348
H01L 2350
H01L 2354

US Classification:

357 67

Abstract:

The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer, thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a sidewall spacer formed on the sidewalls of the solder mass.

US Patent:

52518060, Oct 12, 1993

Filed:

Apr 16, 1992

Appl. No.:

7/870647

Inventors:

Birendra N. Agarwala - Hopewell Junction NY
Aziz M. Ahsan - Hopewell Junction NY
Arthur Bross - Poughkeepsie NY
Mark F. Chadurjian - Essex Junction VT
Nicholas G. Koopman - Hopewell Junction NY
Li-Chung Lee - Saratoga CA
Karl J. Puttlitz - Wappingers Falls NY
Sudipta K. Ray - Wappingers Falls NY
James G. Ryan - Essex Junction VT
Joseph G. Schaefer - Berkshire NY
Kamalesh K. Srivastava - Wappingers Falls NY
Paul A. Totta - Poughkeepsie NY
Erick G. Walton - South Burlington VT
Adolf E. Wirsing - South Hero VT

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 21283

US Classification:

22818022

Abstract:

The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer, thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a sidewall spacer formed on the sidewalls of the solder mass.