Joseph M Stevens

US Patent:

6432282, Aug 13, 2002

Filed:

Mar 2, 2000

Appl. No.:

09/518182

Inventors:

Shamouil Shamouilian - San Jose CA
Anada H. Kumar - Milpitas CA
Donald J. Olgado - Palo Alto CA
Joseph J. Stevens - San Jose CA
Ricardo Leon - Palo Alto CA
Jon Clinton - San Jose CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B23H 704

US Classification:

2042281, 2042298, 2042302, 2042308, 2042861

Abstract:

The present invention relates to a device that supplies electricity to a substrate. In one embodiment, the device includes multiple contacts, a current sensor, and a current regulator. The current sensor is attached to each of the plurality of contacts to sense their electric current. A current regulator controls current applied to each of the multiple contacts in response to the current sensor. In another embodiment, a compliant ridge is formed about the periphery of each contact to seal the contact from undesired chemicals.

US Patent:

6444101, Sep 3, 2002

Filed:

Nov 12, 1999

Appl. No.:

09/439294

Inventors:

Joseph Stevens - San Jose CA
Norman Cowan - Fremont CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C25D 1700

US Classification:

204224R, 20429714, 204DIG 7

Abstract:

A contact ring applies electroplating to a substrate having an electrically conductive portion. The contact ring comprises an annular insulative body, a conductive biasing member, and a seal member. The annular insulative body defines a central opening. The conductive biasing member is configured to exert a biasing force upon the substrate.

US Patent:

6454927, Sep 24, 2002

Filed:

Jun 26, 2000

Appl. No.:

09/603791

Inventors:

Joseph J. Stevens - San Jose CA
Yevgeniy Rabinovich - Fremont CA
Sandy S. Chao - San Jose CA
Mark R. Denome - San Jose CA
Allen L. DAmbra - Millbrae CA
Donald J. Olgado - Palo Alto CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C25B 1500

US Classification:

205101, 205123, 204274, 2042751

Abstract:

A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electro-chemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be on a separate platform. The dosing unit in one embodiment comprises a pressurized flow line.

US Patent:

6494219, Dec 17, 2002

Filed:

Jul 12, 2000

Appl. No.:

09/614406

Inventors:

Radha Nayak - Redwood City CA
Yezdi Dordi - Palo Alto CA
Joseph Stevens - San Jose CA
Peter Hey - Sunnyvale CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B08B 308

US Classification:

134 56R, 134153, 134902, 156345, 438748

Abstract:

Embodiments of the invention generally provide an etchant mixing assembly for a semiconductor processing system. The etchant mixing assembly includes at least one acid source, at least one oxidizer source, a mixing tank selectively in fluid communication with the at least one acid source and the at least one oxidizer source, and a mixed etchant tank in fluid communication with the mixing tank. Additionally, a system controller configured to sense a low level of fluid in the mixed etchant tank, cause a fresh fluid solution to be mixed in the mixing tank, and cause the fresh fluid solution to the communicated to the mixed etchant tank is also provided in the etchant mixing assembly.

US Patent:

6517130, Feb 11, 2003

Filed:

Mar 14, 2000

Appl. No.:

09/524977

Inventors:

Bernardo Donoso - San Jose CA
Joseph J. Stevens - San Jose CA
Donald J. Olgado - Palo Alto CA
Mark Denome - San Jose CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B66C 102

US Classification:

294 641, 294 643, 414737, 414941, 901 40

Abstract:

In one aspect, a vacuum chuck supports a substrate on an end effector, the vacuum chuck comprising a position reference structure and a suction cup. The position reference structure is mounted to the surface and comprises a reference surface. The suction cup is located proximate the reference surface and comprising a suction mount. In another aspect, a method of chucking a substrate to a vacuum chuck is provided. The vacuum chuck comprises a suction cup and a position reference structure. The method comprises attaching the suction cup to the substrate to form a seal therebetween. The suction cup is deformed such that the substrate contacts the position reference structure. The substrate is then leveled on the position reference structure.

US Patent:

6538419, Mar 25, 2003

Filed:

Jan 11, 2000

Appl. No.:

09/481079

Inventors:

Rick Carl Allen - Beech Grove IN
Gautam Nath - Olympia WA
Sean Patrick McPeak - Indianapolis IN
Joseph Curt Stevens - Carmel IN

Assignee:

Thomson Licensing S.A. - Boulogne Cedex

International Classification:

G05F 140

US Classification:

323285, 363 16, 363 2101

Abstract:

A power supply operates in a run mode of operation and in a stand-by, burst mode of operation. When, for example, a user initiates a power-on request command, an on/off control signal is applied to an input terminal of a microprocessor. The microprocessor monitors an end time of a dead time interval of a burst mode cycle and generates a synchronized control signal for turning on a switch. The switch turns on immediately after the end of the dead time interval. The turned on switch couples a run mode load to a filter capacitor of the power supply.

US Patent:

6582578, Jun 24, 2003

Filed:

Oct 3, 2000

Appl. No.:

09/678947

Inventors:

Yezdi N. Dordi - Palo Alto CA
Joseph J. Stevens - San Jose CA
Michael N. Sugarman - San Francisco CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C25D 500

US Classification:

205 80, 205134, 205669, 204224 R, 204225, 204212, 4274301

Abstract:

An electro-chemical plating system is described. A method is performed by the electro-chemical plating system in which a seed layer formed on a substrate is immersed into an electrolyte solution. In one aspect, a substrate is immersed in the electrochemical plating system by tilting the substrate as it enters the electrolyte solution to limit the trapping or formation of air bubbles in the electrolyte solution between the substrate and the substrate holder. In another aspect, an apparatus is provided for electroplating that comprises a cell, a substrate holder, and an actuator. The actuator can displace the substrate holder assembly in the x and z directions and also tilt the substrate. In another aspect, a method is provided of driving a meniscus formed by electrolyte solution across a surface of a substrate. The method comprises enhancing the interaction between the electrolyte solution meniscus and the surface as the substrate is immersed into the electrolyte solution.

US Patent:

6585876, Jul 1, 2003

Filed:

Dec 5, 2000

Appl. No.:

09/731326

Inventors:

Yezdi N. Dordi - Palo Alt CA
Joseph J. Stevens - San Jose CA
H. Peter W. Hey - Sunnyvale CA
Donald J. K. Olgado - Palo Alto CA

Assignee:

Applied Materials Inc. - Santa Clara CA

International Classification:

C25D 520

US Classification:

205148, 204224 R, 204252, 2042751

Abstract:

An apparatus comprising an electrolyte cell, an anode, and a porous rigid diffuser. The electrolyte cell is configured to receive a substrate to have a metal film deposited thereon. An anode is contained within the electrolyte cell. A porous rigid diffuser is connected to the electrolyte cell and extends across the electrolyte cell. The diffuser is positioned between a location that the substrate is to be positioned when the metal film is deposited thereon and the anode.