Joseph M Stevens

US Patent:

6494219, Dec 17, 2002

Filed:

Jul 12, 2000

Appl. No.:

09/614406

Inventors:

Radha Nayak - Redwood City CA
Yezdi Dordi - Palo Alto CA
Joseph Stevens - San Jose CA
Peter Hey - Sunnyvale CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B08B 308

US Classification:

134 56R, 134153, 134902, 156345, 438748

Abstract:

Embodiments of the invention generally provide an etchant mixing assembly for a semiconductor processing system. The etchant mixing assembly includes at least one acid source, at least one oxidizer source, a mixing tank selectively in fluid communication with the at least one acid source and the at least one oxidizer source, and a mixed etchant tank in fluid communication with the mixing tank. Additionally, a system controller configured to sense a low level of fluid in the mixed etchant tank, cause a fresh fluid solution to be mixed in the mixing tank, and cause the fresh fluid solution to the communicated to the mixed etchant tank is also provided in the etchant mixing assembly.

US Patent:

6582578, Jun 24, 2003

Filed:

Oct 3, 2000

Appl. No.:

09/678947

Inventors:

Yezdi N. Dordi - Palo Alto CA
Joseph J. Stevens - San Jose CA
Michael N. Sugarman - San Francisco CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C25D 500

US Classification:

205 80, 205134, 205669, 204224 R, 204225, 204212, 4274301

Abstract:

An electro-chemical plating system is described. A method is performed by the electro-chemical plating system in which a seed layer formed on a substrate is immersed into an electrolyte solution. In one aspect, a substrate is immersed in the electrochemical plating system by tilting the substrate as it enters the electrolyte solution to limit the trapping or formation of air bubbles in the electrolyte solution between the substrate and the substrate holder. In another aspect, an apparatus is provided for electroplating that comprises a cell, a substrate holder, and an actuator. The actuator can displace the substrate holder assembly in the x and z directions and also tilt the substrate. In another aspect, a method is provided of driving a meniscus formed by electrolyte solution across a surface of a substrate. The method comprises enhancing the interaction between the electrolyte solution meniscus and the surface as the substrate is immersed into the electrolyte solution.

US Patent:

6613214, Sep 2, 2003

Filed:

Dec 5, 2000

Appl. No.:

09/730968

Inventors:

Yezdi N. Dordi - Palo Alto CA
Joseph J. Stevens - San Jose CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C25D 502

US Classification:

205118, 205137, 204212, 204224 R, 20429701

Abstract:

An apparatus and associated method for deposition of metal ions contained in an electrolyte solution to form a metal film primarily on a seed layer formed on at least a first side of a substrate. The substrate has a second side that is opposed the first side and an edge joining the first side and the second side. The apparatus comprises a substrate holder system and an electric contact element. The electric contact element physically contacts one of the second side or the edge of the substrate. In one aspect, the substrate is rotated about its vertical axis when the seed layer of substrate is immersed in the electrolyte solution during the metal film deposition. In another aspect, the substrate is not rotated about its vertical axis when the seed layer on the substrate is immersed in the electrolyte solution during the metal film deposition. In different embodiments, the electric contact element contacts the seed layer on the second side of the substrate, a diffusion barrier layer on the second side of the substrate, or the seed layer on the edge of the substrate.

US Patent:

6635157, Oct 21, 2003

Filed:

May 29, 2001

Appl. No.:

09/867780

Inventors:

Yezdi Dordi - Palo Alto CA
Donald J. Olgado - Palo Alto CA
Ratson Morad - Palo Alto CA
Peter Hey - Sunnyvale CA
Mark Denome - San Jose CA
Michael Sugarman - San Francisco CA
Mark Lloyd - late of Fremont CA
Joseph Stevens - San Jose CA
Dan Marohl - San Jose CA
Ho Seon Shin - Mountain View CA
Eugene Ravinovich - Fremont CA
Robin Cheung - Cupertino CA
Ashok K. Sinha - Palo Alto CA
Avi Tepman - Cupertino CA
Dan Carl - Pleasanton CA
George Birkmaier - Cupertino CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C25D 1700

US Classification:

204198, 204212, 204224 R, 204270, 204276, 204278, 204282, 204292, 20429703

Abstract:

The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes a spin-rinse-dry (SRD) station disposed between the loading station and the mainframe, a rapid thermal anneal chamber attached to the loading station, and a system controller for controlling the electro-chemical deposition process and the components of the electro-chemical deposition system.

US Patent:

6720263, Apr 13, 2004

Filed:

Oct 16, 2001

Appl. No.:

09/981505

Inventors:

Donald J. K. Olgado - Palo Alto CA
Joseph J. Stevens - San Jose CA
Alexander Lerner - San Jose CA

Assignee:

Applied Materials Inc. - Santa Clara CA

International Classification:

H01L 21302

US Classification:

438690, 438748

Abstract:

A non-contact apparatus and method for removing a metal layer from a substrate are provided. The apparatus includes a rotatable anode substrate support member configured to support a substrate in a face-up position and to electrically contact the substrate positioned thereon. A pivotally mounted cathode fluid dispensing nozzle assembly positioned above the anode substrate support member is also provided. A power supply in electrical communication with the anode substrate support member and the cathode fluid dispensing nozzle is provided, and a system controller configured to regulate at least one of a rate of rotation of the anode substrate support member, a radial position of the cathode fluid dispensing nozzle, and an output power of the power supply is provided. The method provides for the removal of a metal layer from a substrate by rotating the substrate in a face up position on a rotatable substrate support member. A cathode fluid dispensing nozzle is positioned over a central portion of the substrate and a metal removing solution is dispensed from the cathode fluid dispensing nozzle onto the central portion of the substrate.

US Patent:

7497932, Mar 3, 2009

Filed:

Jun 27, 2006

Appl. No.:

11/476945

Inventors:

Yezdi Dordi - Palo Alto CA, US
Donald J. Olgado - Palo Alto CA, US
Ratson Morad - Palo Alto CA, US
Peter Hey - Sunnyvale CA, US
Mark Denome - San Jose CA, US
Michael Sugarman - San Francisco CA, US
Joseph Stevens - San Jose CA, US
Dan Marohl - San Jose CA, US
Ho Seon Shin - Mountain View CA, US
Eugene Ravinovich - Fremont CA, US
Robin Cheung - Cupertino CA, US
Ashok K. Sinha - Palo Alto CA, US
Avi Tepman - Cupertino CA, US
Dan Carl - Pleasanton CA, US
George Birkmaier - Cupertino CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C25D 5/00
C25D 17/06
C25D 7/12
C23C 14/00
C23C 18/16

US Classification:

204242, 20429802, 205157, 118428, 118503, 427 995

Abstract:

The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes a spin-rinse-dry (SRD) station disposed between the loading station and the mainframe, a rapid thermal anneal chamber attached to the loading station, and a system controller for controlling the electro-chemical deposition process and the components of the electro-chemical deposition system.

US Patent:

20030038107, Feb 27, 2003

Filed:

Oct 11, 2002

Appl. No.:

10/269250

Inventors:

Radha Nayak - Redwood City CA, US
Yezdi Dordi - Palo Alto CA, US
Joseph Stevens - San Jose CA, US
Peter Hey - Sunnyvale CA, US

Assignee:

Applied Materials, Inc.

International Classification:

C23F001/00
B08B003/00
H01L021/306
C03C015/00
B44C001/22

US Classification:

216/002000, 134/05600R, 156/345110, 156/345150, 156/345180, 156/345290, 216/083000

Abstract:

An apparatus and associated method for removing deposits from a substrate. In one aspect, a system is provided which supplies etchant to an edge bead removal chamber. The apparatus includes an etchant delivery system, an etchant tank, a sensor, and a mixing tank.

US Patent:

20030201184, Oct 30, 2003

Filed:

Apr 28, 2003

Appl. No.:

10/424479

Inventors:

Yezdi Dordi - Palo Alto CA, US
Joseph Stevens - San Jose CA, US
Michael Sugarman - San Francisco CA, US

Assignee:

Applied Materials, Inc.

International Classification:

C25D005/00

US Classification:

205/080000, 205/096000

Abstract:

An electro-chemical plating system is described. A method is performed by the electro-chemical plating system in which a seed layer formed on a substrate is immersed into an electrolyte solution. In one aspect, a substrate is immersed in the electrochemical plating system by tilting the substrate as it enters the electrolyte solution to limit the trapping or formation of air bubbles in the electrolyte solution between the substrate and the substrate holder. In another aspect, an apparatus is provided for electroplating that comprises a cell, a substrate holder, and an actuator. The actuator can displace the substrate holder assembly in the x and z directions and also tilt the substrate. In another aspect, a method is provided of driving a meniscus formed by electrolyte solution across a surface of a substrate. The method comprises enhancing the interaction between the electrolyte solution meniscus and the surface as the substrate is immersed into the electrolyte solution.