Joseph L Walker

US Patent:

6505892, Jan 14, 2003

Filed:

Jun 30, 2000

Appl. No.:

09/609568

Inventors:

Joseph Chryst Walker - Albany CA 94710-1211
Randall D. Peterson - Sandy UT 84092
Brandon H. Woolley - Provo UT 84606
Jonathan Wayne Wittwer - Provo UT 84604
Joel Brian Mundt - Provo UT 84601
Jesse Tate Olson - Provo UT 84604
Brian Douglas Gate - Provo UT 84606
Nathan L. Baker - Lehi UT 84043
K. S. Mortensen - Provo UT 84602-4102

International Classification:

E21C 2740

US Classification:

299 32, 299 31, 299 33, 405145

Abstract:

A softwall mining method and device. Each of a plurality of mining devices comprise a supporting portion, an earth moving portion and a coupling mechanism for advancing the earth moving portion into a mining face, and for advancing the supporting portion toward the earth moving portion. Supporting portions of the devices are locked together to anchor movement of the earth moving portions, and earth moving portions of the devices are separately locked together to anchor the movement of the supporting portions.

US Patent:

20110165330, Jul 7, 2011

Filed:

Jan 5, 2011

Appl. No.:

12/984850

Inventors:

Keith A. Rawlins - Cedar Lake IN, US
Wai-Kwong Ho - North Olmsted OH, US
Joseph K. Walker - Mentor OH, US
Charles H. Simpson - Avon OH, US
Frank K. Bonney - Gary IN, US

Assignee:

The Sherwin-Williams Company - Cleveland OH

International Classification:

B05D 3/02
C23F 11/18

US Classification:

427386, 2523892

Abstract:

A coating composition comprising:wherein the coating composition is free of hexavalent chromium.

US Patent:

20110171388, Jul 14, 2011

Filed:

Jan 5, 2011

Appl. No.:

12/984866

Inventors:

Keith A. Rawlins - Cedar Lake IN, US
Wai-Kwong Ho - North Olmsted OH, US
Joseph K. Walker - Mentor OH, US
Charles H. Simpson - Avon OH, US
Frank K. Bonney - Gary IN, US

Assignee:

THE SHERWIN-WILLIAMS COMPANY - Cleveland OH

International Classification:

B05D 5/00
C09D 163/00
B05D 1/38
B05D 3/00

US Classification:

427386, 523402

Abstract:

A coating composition comprising:

US Patent:

20210212228, Jul 8, 2021

Filed:

Mar 23, 2021

Appl. No.:

17/210388

Inventors:

- Cupertino CA, US
John J. Baker - Santa Clara CA, US
Peter F. Coxeter - Sunnyvale CA, US
Benjamin M. Rappoport - Santa Barbara CA, US
Joseph B. Walker - Campbell CA, US

International Classification:

H05K 5/03
B32B 37/12
B32B 37/18
B32B 38/00
B32B 3/26
B32B 5/02

Abstract:

Electronic equipment may include structured fabric. Structured fabric may be used as a protective case or cosmetic cover for an electronic device, may be used to form a band that holds an electronic device against a user's body, or may be used to cover one or more openings in an electronic device. Structured fabrics may be soft and pliable while maintaining the ability to hold a given shape without added support. Structured fabric may be formed by laminating fabric such as warp-knit fabric with a stiffener such as polymer film. Structured fabrics may include openings through which signals such as optical or audio signals pass. To maintain the geometry and shape of the openings in the structured fabric without covering the openings, the stiffener and adhesive that are attached to the fabric may be cut to form a pattern of openings that align with the openings in the fabric.

US Patent:

20200283935, Sep 10, 2020

Filed:

Mar 4, 2020

Appl. No.:

16/809445

Inventors:

- Cupertino CA, US
Kathryn P. Crews - Menlo Park CA, US
Didio V. Gomes - Sunnyvale CA, US
Benjamin J. Grena - Sunnyvale CA, US
Storrs T. Hoen - Brisbane CA, US
Steven J. Keating - Sunnyvale CA, US
David M. Kindlon - Felton CA, US
Daniel A. Podhajny - San Jose CA, US
Andrew L. Rosenberg - Sunnyvale CA, US
Daniel D. Sunshine - Sunnyvale CA, US
Lia M. Uesato - San Jose CA, US
Joseph B. Walker - Campbell CA, US
Felix Binder - Frick, CH
Bertram Wendisch - Stein, CH
Martin Latta - Zurich, CH
Ulrich Schläpfer - Affoltern am Albis, CH
Franck Robin - Lenzburg, CH
Michael Baumann - Zurich, CH
Helen Wächter Fischer - Schliern bei Köniz, CH

International Classification:

D03D 1/00
H05K 1/03

Abstract:

Interlacing equipment may be used to form fabric and to create a gap in the fabric. The fabric may include one or more conductive strands. An insertion tool may be used to align an electrical component with the conductive strands during interlacing operations. A soldering tool may be used to remove insulation from the conductive strands to expose conductive segments on the conductive strands. The soldering tool may be used to solder the conductive segments to the electrical component. The solder connections may be located in grooves in the electrical component. An encapsulation tool may dispense encapsulation material in the grooves to encapsulate the solder connections. After the electrical component is electrically connected to the conductive strands, the insertion tool may position and release the electrical component in the gap. A component retention tool may temporarily be used to retain the electrical component in the gap as interlacing operations continue.

US Patent:

20200123683, Apr 23, 2020

Filed:

Dec 18, 2019

Appl. No.:

16/719770

Inventors:

- Cupertino CA, US
Yohji Hamada - Wakayama-shi, JP
Kathryn P. Crews - Menlo Park CA, US
Joseph B. Walker - Campbell CA, US
Daniel D. Sunshine - Sunnyvale CA, US

International Classification:

D03D 1/00
G06F 3/044
D03D 3/00
D03D 13/00

Abstract:

Weaving equipment may include strand positioning equipment that positions warp strands and that inserts weft strands among the warp strands to form fabric. The weaving equipment may include one or more guide arms that pushes warp strands in the weft direction during weaving. Fabrics having warp strands that extend in both the warp direction and the weft direction may be used in forming circuitry in fabrics such as touch sensor circuitry. For example, a touch sensor in a fabric may be formed using first conductive warp strands that form first touch sensor electrodes and second conductive warp strands that form second touch sensor electrodes that overlap with the first touch sensor electrodes. The second conductive warp strands may each have a first portion that extends in the warp direction and a second portion that extends in the weft direction across the first touch sensor electrodes.

US Patent:

20180195218, Jul 12, 2018

Filed:

Mar 6, 2018

Appl. No.:

15/913653

Inventors:

- Cupertino CA, US
Daniel A. Podhajny - San Jose CA, US
Daniel D. Sunshine - Sunnyvale CA, US
Kathryn P. Crews - Menlo Park CA, US
Joseph B. Walker - Campbell CA, US

International Classification:

D04B 21/14
D04B 21/06
D04B 37/06
D04B 27/10

Abstract:

An item may include fabric or other materials formed from intertwined strands of material. The strands of material may include non-conductive strands and conductive strands. The strands may be intertwined by a warp knitting machine to produce a warp knit fabric. The warp knit fabric may include intertwined warp strands and weft insertion strands that are inserted amongst the warp strands. The weft insertion strands may extend across less than all of the warp strands. The weft insertion strands may include parallel segments that each extend across a different portion of the warp strands. The segments of weft insertion strands may have different widths relative to one another and relative to the width of the fabric. The weft insertion strands may be inserted into the warp knitting machine across the warp strands using a weft insertion device that is positioned by a computer-controlled positioner.

US Patent:

20180168059, Jun 14, 2018

Filed:

Feb 8, 2018

Appl. No.:

15/891533

Inventors:

- Cupertino CA, US
John J. Baker - Campbell CA, US
Peter F. Coxeter - Sunnyvale CA, US
Benjamin M. Rappoport - Santa Barbara CA, US
Joseph B. Walker - Campbell CA, US

International Classification:

H05K 5/03
B32B 37/12
B32B 38/00
B32B 3/26
B32B 5/02
B32B 37/18

Abstract:

Electronic equipment may include structured fabric. Structured fabric may be used as a protective case or cosmetic cover for an electronic device, may be used to form a band that holds an electronic device against a user's body, or may be used to cover one or more openings in an electronic device. Structured fabrics may be soft and pliable while maintaining the ability to hold a given shape without added support. Structured fabric may be formed by laminating fabric such as warp-knit fabric with a stiffener such as polymer film. Structured fabrics may include openings through which signals such as optical or audio signals pass. To maintain the geometry and shape of the openings in the structured fabric without covering the openings, the stiffener and adhesive that are attached to the fabric may be cut to form a pattern of openings that align with the openings in the fabric.