Julia Marie Roe

US Patent:

8643177, Feb 4, 2014

Filed:

Dec 15, 2010

Appl. No.:

12/968794

Inventors:

Glenn A. Rinne - Apex NC, US
Kevin Engel - Gilbert AZ, US
Julia Roe - Hillsborough NC, US
Christopher John Berry - Chandler AZ, US

Assignee:

Amkor Technology, Inc. - Chandler AZ

International Classification:

H01L 23/498

US Classification:

257734, 438460, 438462, 438464, 438465

Abstract:

A method of processing a wafer including a plurality of integrated circuit devices on a front side of the wafer, may include thinning the wafer from a back side opposite the front side. After thinning the wafer, a back side layer may be provided on the back side of the thinned wafer opposite the front side, and the back side layer may be configured to counter stress on the front side of the wafer including the plurality of integrated circuit devices thereon. After providing the back side layer, the plurality of integrated circuit devices may be separated. Related structures are also discussed.

US Patent:

20070161234, Jul 12, 2007

Filed:

Jan 10, 2007

Appl. No.:

11/621630

Inventors:

Glenn Rinne - Apex NC, US
Kevin Engel - Gilbert AZ, US
Julia Roe - Hillsborough NC, US
Christopher Berry - Chandler AZ, US

International Classification:

H01L 21/44

US Classification:

438659000

Abstract:

A method of processing a wafer including a plurality of integrated circuit devices on a front side of the wafer, may include thinning the wafer from a back side opposite the front side. After thinning the wafer, a back side layer may be provided on the back side of the thinned wafer opposite the front side, and the back side layer may be configured to counter stress on the front side of the wafer including the plurality of integrated circuit devices thereon. After providing the back side layer, the plurality of integrated circuit devices may be separated. Related structures are also discussed.