Lawrence Schloss - Palo Alto CA, US Julie Casperson Brewer - Santa Clara CA, US Wayne Kinney - Emmett ID, US Rene Meyer - Mountain View CA, US
International Classification:
G11C 11/00
US Classification:
365148, 365163
Abstract:
A memory cell including a memory element comprising an electrolytic insulator in contact with a conductive metal oxide (CMO) is disclosed. The CMO includes a crystalline structure and can comprise a pyrochlore oxide, a conductive binary oxide, a multiple B-site perovskite, and a Ruddlesden-Popper structure. The CMO includes mobile ions that can be transported to/from the electrolytic insulator in response to an electric field of appropriate magnitude and direction generated by a write voltage applied across the electrolytic insulator and CMO. The memory cell can include a non-ohmic device (NOD) that is electrically in series with the memory element. The memory cell can be positioned between a cross-point of conductive array lines in a two-terminal cross-point memory array in a single layer of memory or multiple vertically stacked layers of memory that are fabricated over a substrate that includes active circuitry for data operations on the array layer(s).
Lawrence Schloss - Palo Alto CA, US Rene Meyer - Mountain View CA, US Wayne Kinney - Emmett ID, US Roy Lambertson - Los Altos CA, US Julie Casperson Brewer - Santa Clara CA, US
International Classification:
G11C 11/00
US Classification:
365148
Abstract:
An ion barrier layer made from a dielectric material in contact with an electronically insulating layer is operative to prevent mobile ions transported into the electronically insulating layer from passing through the ion barrier layer and into adjacent layers during data operations on a non-volatile memory cell. A conductive oxide layer in contact with the electronically insulating layer is the source of the mobile ions. A programming data operation is operative to transport a portion of the mobile ions into the electronically insulating layer and an erase data operation is operative to transport the mobile ions back into the conductive oxide layer. When the portion is positioned in the electronically insulating layer the memory cell stores data as a programmed conductivity profile and when a substantial majority of the mobile ions are positioned in the conductive oxide layer the memory cell stores data as an erased conductivity profile.
Lawrence Schloss - Palo Alto CA, US Julie Casperson Brewer - New York NY, US Wayne Kinney - Emmett CA, US Roy Lambertson - Los Altos CA, US Rene Meyer - Atherton CA, US
Assignee:
Unity Semiconductor Corporation - Sunnyvale CA
International Classification:
G11C 11/00
US Classification:
365148, 365171
Abstract:
An ion barrier layer made from a dielectric material in contact with an electronically insulating layer is operative to prevent mobile ions transported into the electronically insulating layer from passing through the ion barrier layer and into adjacent layers during data operations on a non-volatile memory cell. A conductive oxide layer in contact with the electronically insulating layer is the source of the mobile ions. A programming data operation is operative to transport a portion of the mobile ions into the electronically insulating layer and an erase data operation is operative to transport the mobile ions back into the conductive oxide layer. When the portion is positioned in the electronically insulating layer the memory cell stores data as a programmed conductivity profile and when a substantial majority of the mobile ions are positioned in the conductive oxide layer the memory cell stores data as an erased conductivity profile.
Conductive Metal Oxide Structures In Non Volatile Re Writable Memory Devices
Lawrence Schloss - Palo Alto CA, US Julie Casperson Brewer - New York NY, US Wayne Kinney - Emmett CA, US Rene Meyer - Atherton CA, US
Assignee:
Unity Semiconductor Corporation - Sunnyvale CA
International Classification:
G11C 11/21
US Classification:
365148, 365163
Abstract:
A memory cell including a memory element comprising an electrolytic insulator in contact with a conductive metal oxide (CMO) is disclosed. The CMO includes a crystalline structure and can comprise a pyrochlore oxide, a conductive binary oxide, a multiple B-site perovskite, and a Ruddlesden-Popper structure. The CMO includes mobile ions that can be transported to/from the electrolytic insulator in response to an electric field of appropriate magnitude and direction generated by a write voltage applied across the electrolytic insulator and CMO. The memory cell can include a non-ohmic device (NOD) that is electrically in series with the memory element. The memory cell can be positioned between a cross-point of conductive array lines in a two-terminal cross-point memory array in a single layer of memory or multiple vertically stacked layers of memory that are fabricated over a substrate that includes active circuitry for data operations on the array layer(s).
Conductive Metal Oxide Structures In Non-Volatile Re-Writable Memory Devices
Lawrence Schloss - Palo Alto CA, US Julie Casperson Brewer - Santa Clara CA, US Wayne Kinney - Emmett ID, US Rene Meyer - Atherton CA, US
Assignee:
Unity Semiconductor Corporation - Sunnyvale CA
International Classification:
G11C 11/00
US Classification:
365148, 257 4
Abstract:
A memory cell including a memory element comprising an electrolytic insulator in contact with a conductive metal oxide (CMO) is disclosed. The CMO includes a crystalline structure and can comprise a pyrochlore oxide, a conductive binary oxide, a multiple B-site perovskite, and a Ruddlesden-Popper structure. The CMO includes mobile ions that can be transported to/from the electrolytic insulator in response to an electric field of appropriate magnitude and direction generated by a write voltage applied across the electrolytic insulator and CMO. The memory cell can include a non-ohmic device (NOD) that is electrically in series with the memory element. The memory cell can be positioned between a cross-point of conductive array lines in a two-terminal cross-point memory array in a single layer of memory or multiple vertically stacked layers of memory that are fabricated over a substrate that includes active circuitry for data operations on the array layer(s).
Julie Casperson Brewer - Santa Clara CA, US Christophe Chevallier - Palo Alto CA, US Wayne Kinney - Emmett CA, US Roy Lambertson - Los Altos CA, US Darrell Rinerson - Cupertino CA, US Lawrence Schloss - Palo Alto CA, US
Assignee:
Unity Semiconductor Corporation - Sunnyvale CA
International Classification:
G11C 11/36
US Classification:
365148, 257 4, 257E45003
Abstract:
A threshold device including a plurality of adjacent tunnel barrier layers that are in contact with one another and are made from a plurality of different dielectric materials is disclosed. A memory plug having first and second terminals includes, electrically in series with the first and second terminals, the threshold device and a memory element that stores data as a plurality of conductivity profiles. The threshold device is operative to impart a characteristic I-V curve that defines current flow through the memory element as a function of applied voltage across the terminals during data operations. The threshold device substantially reduces or eliminates current flow through half-selected or un-selected memory plugs and allows a sufficient magnitude of current to flow through memory plugs that are selected for read and write operations. The threshold device reduces or eliminates data disturb in half-selected memory plugs and increases S/N ratio during read operations.
Lawrence Schloss - Palo Alto CA, US Julie Casperson Brewer - New York NY, US Wayne Kinney - Emmett ID, US Roy Lambertson - Los Altos CA, US Rene Meyer - Atherton CA, US
Assignee:
Unity Semiconductor Corporation - Sunnyvale CA
International Classification:
G11C 11/21
US Classification:
365148, 365163
Abstract:
An ion barrier layer made from a dielectric material in contact with an electronically insulating layer is operative to prevent mobile ions transported into the electronically insulating layer from passing through the ion barrier layer and into adjacent layers during data operations on a non-volatile memory cell. A conductive oxide layer in contact with the electronically insulating layer is the source of the mobile ions. A programming data operation is operative to transport a portion of the mobile ions into the electronically insulating layer and an erase data operation is operative to transport the mobile ions back into the conductive oxide layer. When the portion is positioned in the electronically insulating layer the memory cell stores data as a programmed conductivity profile and when a substantial majority of the mobile ions are positioned in the conductive oxide layer the memory cell stores data as an erased conductivity profile.
Conductive Metal Oxide Structures In Non Volatile Re Writable Memory Devices
Lawrence Schloss - Palo Alto CA, US Julie Casperson Brewer - New York NY, US Wayne Kinney - Emmett ID, US Rene Meyer - Atherton CA, US
Assignee:
Unity Semiconductor Corporation - Sunnyvale CA
International Classification:
G11C 13/00
US Classification:
365148, 365163
Abstract:
A memory cell including a memory element comprising an electrolytic insulator in contact with a conductive metal oxide (CMO) is disclosed. The CMO includes a crystalline structure and can comprise a pyrochlore oxide, a conductive binary oxide, a multiple B-site perovskite, and a Ruddlesden-Popper structure. The CMO includes mobile ions that can be transported to/from the electrolytic insulator in response to an electric field of appropriate magnitude and direction generated by a write voltage applied across the electrolytic insulator and CMO. The memory cell can include a non-ohmic device (NOD) that is electrically in series with the memory element. The memory cell can be positioned between a cross-point of conductive array lines in a two-terminal cross-point memory array in a single layer of memory or multiple vertically stacked layers of memory that are fabricated over a substrate that includes active circuitry for data operations on the array layer(s).
Name / Title
Company / Classification
Phones & Addresses
Julie Brewer Principal
Juls Business Services at Non-Commercial Site
9311 Highrock Dr, Waxhaw, NC 28173
Julie Brewer Director of Engineering
Unity Semiconductor Corp Computer Systems Design
255 Santa Ana Ct, Sunnyvale, CA 94085 (408)7377200
Julie Brewer Director of Engineering, Device Technology Engineer
Unity Semiconductor Semiconductors · Computer Systems Design
255 Santa Ana Ct, Sunnyvale, CA 94085 1050 Enterprise Way SUITE 700, Sunnyvale, CA 94089 (408)7377200
JFLOCI since 2006
Asst. Manager
CEGCYRA May 2011 - May 2012
Temporary Programs Director
Citizens Real Estate & Property Mgt Oct 2009 - Jul 2010
Secretary/Personal Assistant
Education:
Morton High School
Interests:
I enjoy an office environment involving communication with clients/customers and co-workers. I have worked in a variety of jobs over the years and learned numerous skills along the way. My passion is sports, youth sports especially. There is no greater feeling in the world, than at the end of the day, going home and having the knowledge you did something that made a difference in someone life!