Kaiser Hoi Wong from 14577 W Medlock Dr, Litchfield Park, AZ 85340, age 79

Us Patents

Ballistic Aerosol Marking Apparatus With Stacked Electrode Structure
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US Patent:

6416158, Jul 9, 2002
Filed:

Sep 29, 1999
Appl. No.:

09/407908
Inventors:

Philip D. Floyd - Sunnyvale CA
Tuan Anh Vo - Hawthorne CA
Kaiser H. Wong - Torrance CA
Gregory B. Anderson - Woodside CA
Eric Peeters - Fremont CA
Jaan Noolandi - Mississauga, CA
Meng H. Lean - Briarcliff Manor NY
Armin R. Volkel - Mississauga, CA
John E. Northrup - Palo Alto CA
Jurgen Daniel - Mountain View CA
G. A. Neville Connell - Alpine CA
Assignee:

Xerox Corporation - Stamford CT
International Classification:

B41J 2035
US Classification:

347 21
Abstract:

A device for the transport and/or metering of marking material includes a plurality of phased electrodes, for example formed on a substrate. An electrostatic traveling wave may be generated along the electrodes to sequentially attract particles of marking material, and thereby transport them to a desired location. The electrodes may be formed in a planar structure. A matrix interconnection scheme allows for reduced lead count.

Solid Bi-Layer Structures For Use With High Viscosity Inks In Acoustic Ink Printing And Methods Of Fabrication
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US Patent:

6416678, Jul 9, 2002
Filed:

Dec 22, 1998
Appl. No.:

09/218924
Inventors:

Babur B. Hadimioglu - Mountain View CA
Scott A. Elrod - La Honda CA
David Steinmetz - Linnwood WA
Kaiser H. Wong - Torrance CA
Assignee:

Xerox Corporation - Stamford CT
International Classification:

B44C 122
US Classification:

216 26, 216 24, 216 49, 216 79, 156150, 156242, 164 6, 438 21
Abstract:

Low acoustic solid wave attenuation structures are formed with an electroformed nickel mold, and are incorporated within acoustic ink emitters, between the focusing lens and surface of an ink layer. The structures have characteristics of low attenuation of acoustic waves to increase the efficiency of acoustic wave transmission within the acoustic ink emitter. Using the described structures, acoustic ink printers can accurately emit materials having high viscosity, including hot melt inks.

Solid Bi-Layer Structures For Use With High Viscosity Inks In Acoustic Ink In Acoustic Ink Printing And Methods Of Fabrication
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US Patent:

6644785, Nov 11, 2003
Filed:

Sep 19, 2001
Appl. No.:

09/957710
Inventors:

Scott A. Elrod - La Honda CA
Babur B. Hadimioglu - Mountain View CA
David Steinmetz - Linnwood WA
Kaiser H. Wong - Torrance CA
Assignee:

Xerox Corporation - Stamford CT
International Classification:

B41J 2135
US Classification:

347 46
Abstract:

Low acoustic solid wave attenuation structures are formed with an electroformed nickel mold, and are incorporated within acoustic ink emitters, between the focusing lens and surface of an ink layer. The structures have characteristics of low attenuation of acoustic waves to increase the efficiency of acoustic wave transmission within the acoustic ink emitter. Using the described structures, acoustic ink printers can accurately emit materials having high viscosity, including hot melt inks.

Estimation Of Toner Usage
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US Patent:

6810218, Oct 26, 2004
Filed:

Sep 15, 2003
Appl. No.:

10/662252
Inventors:

Kaiser H. Wong - Torrance CA
Lawrence P. Chen - Torrance CA
Walter F. Filbrich - Manhattan Beach CA
Philip G. Hardjadinata - Fullerton CA
Assignee:

Xerox Corporation - Stamford CT
International Classification:

G03G 1508
US Classification:

399 27
Abstract:

A method for estimation of toner usage in digital xerographic process is disclosed. The method calculates a ratio of transition count/pixel count using a pixel transition count and a pixel count for a printed image and provides an estimate of toner consumption based on the ratio of transition count/pixel count.

Copper Interconnect By Immersion/Electroless Plating In Dual Damascene Process
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US Patent:

6821879, Nov 23, 2004
Filed:

Oct 30, 2002
Appl. No.:

10/284538
Inventors:

Kaiser H. Wong - Torrance CA
Assignee:

Xerox Corporation - Stamford CT
International Classification:

H01L 214763
US Classification:

438618, 438597, 438620, 438622, 438627, 438637, 438642, 438643, 438647, 438650, 438651, 438652, 438653, 438657, 438660, 438672, 438675, 438678, 438686, 438687
Abstract:

The invention is directed to a fabrication method of copper interconnects using dual damascene processing. Using silicon to provide an active surface, palladium can be selectively deposited on silicon by an immersion plating technique. After palladium deposition (about 1000 thick), either a layer of cobalt phosphorus or alloy cobalt/nickel phosphorus or nickel phosphorus is deposited on the palladium layer using an electroless plating technique. This cobalt phosphorus, cobalt/nickel phosphorus alloy, or nickel phosphorus layer serves as a copper diffusion barrier. The via and trenches are filled with copper by an electroless copper plating method and CMP is used to remove the excess copper and planarize-/-polish the copper/dielectric surface.

Metal Alloy 42 Liquid Level Control/Aperture Plate For Acoustic Ink Printing Printhead
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US Patent:

6846425, Jan 25, 2005
Filed:

Sep 27, 2002
Appl. No.:

10/260509
Inventors:

Kaiser H. Wong - Torrance CA, US
Assignee:

Xerox Corporation - Stamford CT
International Classification:

G01D 1500
G11B 5127
US Classification:

216 27
Abstract:

An acoustic ink printing print head utilizing metal alloy is disclosed. Additionally, a process for incorporating the metal alloy (alloy with approximately 42% nickel and 58% iron) to build the liquid level control/aperture plate defining an AIP print head is disclosed. The process consists of fabricating a channel plate and an aperture plate from the metal alloy and bonding the two structures together thereby defining the liquid level control/aperture plate.

Fabrication Of Embedded Vertical Spiral Inductor For Multichip Module (Mcm) Package
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US Patent:

6972081, Dec 6, 2005
Filed:

Feb 5, 2003
Appl. No.:

10/284513
Inventors:

Kaiser H. Wong - Torrance CA, US
Assignee:

Xerox Corporation - Stamford CT
International Classification:

C25D005/02
C25D011/32
C25D005/54
C25D005/56
US Classification:

205119, 205118, 205123, 205157, 205162, 205164
Abstract:

A process for fabricating a vertical spiral inductor within a multichip module package is disclosed. The process consists of depositing a pattern of bottom lines by electroplating copper on a substrate and then depositing an insulation pattern. Next, depositing a pattern of permeable material to form a core and then depositing polyimide to define vias and permeable core insulation. The vias are filled by electroplating copper. The vertical spiral inductor is formed and defined by next depositing a pattern of top metal (e. g. copper) lines by electroplating wherein the top metal lines are staggered with respect to the bottom metal lines. Lastly a top protective layer is deposited. The core is made from a permeable or non-permeable material.

Toner Dispensing System And Method For Controlling The Same
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US Patent:

7761015, Jul 20, 2010
Filed:

Nov 6, 2007
Appl. No.:

11/935624
Inventors:

Kaiser Wong - Torrance CA, US
Assignee:

Samsung Electronics Co., Ltd. - Suwon
International Classification:

G03G 15/08
US Classification:

399 27, 399224, 399258
Abstract:

A toner dispensing system and a method for controlling the same. A toner dispensing amount is determined using a pixel dispensing time related to a pixel count adjusted according to the ratio of a transition count to a pixel count per page, a Δ automatic concentration control dispensing time relating to the difference between the toner concentration of a developer material and target concentration, and a dispensing rate corresponding to a print job length. The determined amount of toner is dispensed into a developer housing. This method can maintain a toner concentration in order to obtain an accurate image density. A remaining toner ratio (%) determined from a total dispensing time, a dispensing rate, and a toner capacity can also be displayed so that the user can monitor the remaining amount of toner, the used amount of toner, etc. , during the life of the toner cartridge.