Kathleen B Virga

US Patent:

54611962, Oct 24, 1995

Filed:

Dec 2, 1992

Appl. No.:

7/984401

Inventors:

Kathleen Virga - Redondo Beach CA
Terry Cisco - Glendale CA
Joseph N. Owens - Santa Monica CA
Craig Shoda - Torrance CA

Assignee:

Hughes Aircraft Company - Los Angeles CA

International Classification:

H01L 2302

US Classification:

174 524

Abstract:

A unitized integrally fused multilayer circuit package having a substrate, walls disposed on the substrate to form a central circuit package cavity, and circuit traces contained in the walls.

US Patent:

51840952, Feb 2, 1993

Filed:

Jul 31, 1991

Appl. No.:

7/739009

Inventors:

Curtis L. Hanz - Redondo Beach CA
Jon J. Gulick - Hawthorne CA
Kathleen L. Virga - Redondo Beach CA
Allen Podell - Palo Alto CA

Assignee:

Hughes Aircraft Company - Los Angeles CA

International Classification:

H01P 500

US Classification:

333 33

Abstract:

A microstrip transmission line structure a series of connected microstrip strip sections having different widths disposed on an outside layer of a unitized multilayer circuit structure and forming a microstrip line, respective ground planes for each of the strip sections formed between insulating layers of the untilized multilayer circuit structure and respectively spaced from the associated strip sections to provide a substantially constant impedance along the length of the microstrip line, and a plurality of conductive vias for electrically interconnecting the respective ground planes.

US Patent:

51500884, Sep 22, 1992

Filed:

Mar 27, 1991

Appl. No.:

7/675763

Inventors:

Kathleen L. Virga - Redondo Beach CA
Craig Shoda - Torrance CA
Joseph N. Owens - Santa Monica CA

Assignee:

Hughes Aircraft Company - Los Angeles CA

International Classification:

H01P 308

US Classification:

333238

Abstract:

Stripline shielding structures for stripline conductors implemented in unitized multilayer circuit structures are disclosed. The stripline structures generally include a lower ground plane below the stripline conductor, one or more embedded ground planes above the stripline conductor, and conductive elements laterally spaced from the stripline conductor for electrically connecting the ground planes. Resistive layers may be included above the embedded ground plane(s) for additional shielding.