Ken S Matsubayashi

US Patent:

7071714, Jul 4, 2006

Filed:

Nov 2, 2001

Appl. No.:

10/003012

Inventors:

Benjamin N. Eldridge - Danville CA, US
Gary W. Grube - Pleasanton CA, US
Ken S. Matsubayashi - Fremont CA, US
Richard A. Larder - Livermore CA, US
Makarand Shinde - Dublin CA, US
Gaetan L. Mathieu - Livermore CA, US

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

G01R 31/02

US Classification:

324754, 324760

Abstract:

The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

US Patent:

7119564, Oct 10, 2006

Filed:

Aug 30, 2005

Appl. No.:

11/216579

Inventors:

Rod Martens - Livermore CA, US
Benjamin N. Eldridge - Danville CA, US
Gary W. Grube - Pleasanton CA, US
Ken S. Matsubayashi - Fremont CA, US
Richard A. Larder - Livermore CA, US
Makarand Shinde - Livermore CA, US
Gaetan L. Mathieu - Varenness, CA

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

G01R 31/02

US Classification:

324754, 3241581

Abstract:

The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

US Patent:

7312618, Dec 25, 2007

Filed:

Jul 3, 2006

Appl. No.:

11/428423

Inventors:

Benjamin N. Eldridge - Danville CA, US
Gary W. Grube - Pleasanton CA, US
Ken S. Matsubayashi - Fremont CA, US
Richard A. Larder - Livermore CA, US
Makarand S. Shinde - Livermore CA, US
Gaetan L. Mathieu - Varennes, CA

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

G01R 31/02

US Classification:

324754, 324760

Abstract:

A method and system for compensating for thermally induced motion of probe cards used in testing die on a wafer are disclosed. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced movement of the probe card is disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

US Patent:

7560941, Jul 14, 2009

Filed:

Oct 10, 2006

Appl. No.:

11/548183

Inventors:

Rod Martens - Livermore CA, US
Benjamin N. Eldridge - Danville CA, US
Gary W. Grube - Pleasanton CA, US
Ken S. Matsubayashi - Fremont CA, US
Richard A. Larder - Livermore CA, US
Makarand S. Shinde - Livermore CA, US
Gaetan L. Mathieu - Varennes, CA

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

G01R 31/02

US Classification:

324754, 3241581

Abstract:

The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

US Patent:

7642794, Jan 5, 2010

Filed:

Dec 21, 2007

Appl. No.:

11/963575

Inventors:

Benjamin N. Eldridge - Danville CA, US
Gary W. Grube - Pleasanton CA, US
Ken S. Matsubayashi - Fremont CA, US
Richard A. Larder - Livermore CA, US
Makarand S. Shinde - Livermore CA, US
Gaetan L. Mathieu - Vareness CA, US

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

G01R 31/02

US Classification:

324754, 324760

Abstract:

The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

US Patent:

20030085723, May 8, 2003

Filed:

May 31, 2002

Appl. No.:

10/159560

Inventors:

Rod Martens - Livermore CA, US
Benjamin Eldridge - Danville CA, US
Gary Grube - Pleasanton CA, US
Ken Matsubayashi - Fremont CA, US
Richard Larder - Livermore CA, US
Makarand Shinde - Dublin CA, US
Gaetan Mathieu - Livermore CA, US

International Classification:

G01R031/02

US Classification:

324/754000

Abstract:

The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

US Patent:

20200350633, Nov 5, 2020

Filed:

Nov 15, 2018

Appl. No.:

16/763078

Inventors:

- Fremont CA, US
Ashok LAHIRI - Cupertino CA, US
Murali RAMASUBRAMANIAN - Fremont CA, US
Bruno A. VALDES - Sunnyvale CA, US
Gardner Cameron DALES - Los Gatos CA, US
Christopher J. SPINDT - Menlo Park CA, US
Geoffrey Matthew HO - San Ramon CA, US
James D. WILCOX - Pleasanton CA, US
John F. VARNI - Los Gatos CA, US
Kim Han LEE - Pleasanton CA, US
Nirav S. SHAH - Pleasanton CA, US
Richard J. CONTRERAS - Campbell CA, US
Lynn VAN ERDEN - Pollock Pines CA, US
Ken S. MATSUBAYASHI - Fremont CA, US
Jeremie J. DALTON - San Jose CA, US
Jason Newton HOWARD - Alpharetta CA, US
Robert Keith ROSEN - Rocklin CA, US
Jonathan C. DOAN - Pleasanton, US
Michael J. ARMSTRONG - Danville CA, US
Anthony CALCATERRA - Milpitas CA, US
Benjamin L. CARDOZO - Palo Alto CA, US
Joshua David WINANS - Mountain View CA, US
Neelam SINGH - Fremont CA, US
Jeffrey Glenn BUCK - Salinas CA, US
Thomas John SCHUERLEIN - Pleasanton CA, US
Kim Lester FORTUNATI - Pleasanton CA, US
Neal SARSWAT - Pleasanton CA, US

International Classification:

H01M 10/0585
H01M 2/02
H01M 2/26
H01M 10/04
H01M 10/0525
H01M 10/054

Abstract:

Secondary batteries and methods of manufacture thereof are provided. A secondary battery can comprise an offset between electrode and counter-electrode layers in a unit cell. Secondary batteries can be prepared by removing a population of negative electrode subunits from a negative electrode sheet, the negative electrode sheet comprising a negative electrode sheet edge margin and at least one negative electrode sheet weakened region that is internal to the negative electrode sheet edge margin, removing a population of separator layer subunits from a separator sheet, and removing a population of positive electrode subunits from a positive electrode sheet, the positive electrode sheet comprising a positive electrode edge margin and at least one positive electrode sheet weakened region that is internal to the positive electrode sheet edge margin, and stacking members of the negative electrode subunit population, the separator layer subunit population and the positive electrode subunit population.

US Patent:

20200313146, Oct 1, 2020

Filed:

Nov 15, 2018

Appl. No.:

16/763110

Inventors:

- Fremont CA, US
Ashok LAHIRI - Cupertino CA, US
Murali RAMASUBRAMANIAN - Fremont CA, US
Bruno A. VALDES - Sunnyvale CA, US
Gardner Cameron DALES - Los Gatos CA, US
Christopher J. SPINDT - Menlo Park CA, US
Geoffrey Matthew HO - San Ramon CA, US
James D. WILCOX - Pleasanton CA, US
John F. VARNI - Los Gatos CA, US
Kim Han LEE - Pleasanton CA, US
Nirav S. SHAH - Pleasanton CA, US
Richard J. CONTRERAS - Campbell CA, US
Lynn VAN ERDEN - Pollock Pines CA, US
Ken S. MATSUBAYASHI - Fremont CA, US
Jeremie J. DALTON - San Jose CA, US
Jason Newton HOWARD - Alpharetta CA, US
Robert Keith ROSEN - Rocklin CA, US
Jonathan C. DOAN - Pleasanton CA, US
Michael J. ARMSTRONG - Danville CA, US
Anthony CALCATERRA - Milpitas CA, US
Benjamin L. CARDOZO - Palo Alto CA, US
Joshua David WINANS - Mountain View CA, US
Neelam SINGH - Fremont CA, US
Jeffrey Glenn BUCK - Salinas CA, US
Thomas John SCHUERLEIN - Pleasanton CA, US
Kim Lester FORTUNATI - Pleasanton CA, US
Neal SARSWAT - Pleasanton CA, US

International Classification:

H01M 2/26
H01M 10/0525
H01M 4/48
H01M 4/66
H01M 4/525
H01M 2/16
H01M 4/38
H01M 4/134
H01M 10/0565

Abstract:

Embodiments of secondary batteries having electrode assemblies are provided. A secondary battery can comprise an electrode assembly having a stacked series of layers, the stacked series of layers having an offset between electrode and counter-electrode layers in a unit cell member of the stacked series. A set of constraints can be provided with a primary constraint system with first and second primary growth constraints separated from each other in a longitudinal direction, and connected by at least one primary connecting member, and a secondary constraint system comprises first and second secondary growth constraints separated in a second direction and connected by members of the stacked series of layers. The primary constraint system may at least partially restrain growth of the electrode assembly in the longitudinal direction, and the secondary constraint system may at least partially restrain growth in the second direction that is orthogonal to the longitudinal direction.