Harry Roman - East Orange NJ, US Kenneth Farmer - Lake Elmo MN, US Xiaodong Wang - East Newark NJ, US Baoqing Li - Harrison NJ, US
International Classification:
G01R031/08 G01R031/12 H01H009/50
US Classification:
324536000
Abstract:
An approved method and apparatus for detecting partial discharge events within a transformer comprises asserting a MEMS acoustical probe through the wall of the transformer to optically measure partial discharge events. In an enhanced embodiment, temperature compensation is also possible, and detection may be confirmed via an independent electromagnetic or other sensor.
Method Of Formation Of Thin Bonded Ultra-Thin Wafers
Kenneth R. Farmer - Newark NJ Thomas G. Digges - Fredericksburg VA N. Perry Cook - Fredericksburg VA
Assignee:
Virginia Semiconductor, Inc. - Fredericksburg VA
International Classification:
H01L 2176
US Classification:
438406
Abstract:
A technique of bonding a thin wafer layer to a substrate. The wafer is blown dry using an inert gas to prevent it from being damaged, while still ensuring that it dries completely. The initial bonding is done by orienting crystallographic axes, and then allowing the wafers to adhere to one another slowly. The contact wave is prevented from spreading, by a divider between the two wafers. The wafers are allowed to adhere to one another slowly to form a bond. The bond is strengthened by annealing.