Kenneth Christopher Haugan

US Patent:

6461494, Oct 8, 2002

Filed:

Sep 3, 1999

Appl. No.:

09/390091

Inventors:

Kenneth C. Haugan - Kalispell MT
Harry J. Geyer - Kalispell MT
Robert W. Berner - Kalispell MT

Assignee:

Semitool, Inc. - Kulispell MT

International Classification:

C25D 712

US Classification:

205123, 20429708, 205143, 205157

Abstract:

Methods used in semiconductor electroplating systems, such as for plating copper, onto a semiconductor wafer or other semiconductor workpiece. The methods apply to patterned metal layers plated onto seed layer which is partially protected by an overlying photoresist or other coating. The methods employ an electrode assembly which has a boot which seals about a contact face of the electrode. The sealing is performed by engaging the seal against photoresist to prevent corrosion of the seal layer. The area enclosed by the sealing includes a via which is surrounded by the seal. The electrode contact extends through the via to provide electrical contact with the metallic seed layer. Plating of copper or other metal proceeds at exposed seed layer areas.

US Patent:

6733649, May 11, 2004

Filed:

Mar 16, 2001

Appl. No.:

09/811261

Inventors:

Martin Bleck - Kalispell MT
Kenneth C. Haugan - Kalispell MT
Larry R. Radloff - Kalispell MT
Harry Geyer - Kalispell MT

Assignee:

Semitool, Inc. - Kalispell MT

International Classification:

C25D 500

US Classification:

205 80, 205 96, 205118, 205123, 205157, 205640, 205687, 205775

Abstract:

A semiconductor workpiece holder for use in processing a semiconductor workpiece includes a workpiece support operatively mounted to support a workpiece in position for processing. A finger assembly is operatively mounted upon the workpiece support and includes a finger tip. The finger assembly is movable between an engaged position in which the finger tip is engaged against the workpiece, and a disengaged position in which the finger tip is moved away from the workpiece. Preferably, at least one electrode forms part of the finger assembly and includes an electrode contact for contacting a surface of said workpiece. At least one protective sheath covers at least some of the electrode contact. According to one aspect of the invention, a sheathed electrode having a sheathed electrode tip is positioned against a semiconductor workpiece surface in a manner engaging the workpiece surface with said sheathed electrode tip. A seal is formed about the periphery of the electrode tip, and with the electrode tip engaging the workpiece, a desired electrical contact is made to the workpiece.

US Patent:

6805778, Oct 19, 2004

Filed:

Sep 3, 1999

Appl. No.:

09/390501

Inventors:

Kenneth C. Haugan - Kalispell MT
Harry J. Geyer - Kalispell MT
Robert W. Berner - Eagle ID

Assignee:

Semitool, Inc. - Kalispell MT

International Classification:

C25D 1706

US Classification:

2042971, 2042881, 20429714

Abstract:

Methods used in semiconductor electroplating systems, such as for plating copper, onto a semiconductor wafer or other semiconductor workpiece. The methods apply to patterned metal layers plated onto a seed layer which is partially protected by an overlying photoresist or other coating. The methods employ an electrode assembly which has a boot which seals about a contact face of the electrode. The sealing is performed by engaging the seal against photoresist to prevent corrosion of the seal layer. The area enclosed by the sealing includes a via which is surrounded by the seal. The electrode contact extends through the via to provide electrical contact with the metallic seed layer. Plating of copper or other metal proceeds at exposed seed layer areas.

US Patent:

20040035707, Feb 26, 2004

Filed:

Apr 7, 2003

Appl. No.:

10/409689

Inventors:

Robert Batz - Kalispell MT, US
Kenneth Haugan - Kalispell MT, US
Harry Geyer - Kalispell MT, US
Robert Berner - San Jose CA, US

International Classification:

C25D007/12

US Classification:

205/123000, 205/157000

Abstract:

Methods used in semiconductor electroplating systems, such as for plating copper, onto a semiconductor wafer or other semiconductor workpiece. The methods apply to patterned metal layers plated onto a seed layer which is partially protected by an overlying photoresist or other coating. The methods employ an electrode assembly which has a boot which seals about a contact face of the electrode. The sealing is performed by engaging the seal against photoresist to prevent corrosion of the seal layer. The area enclosed by the sealing includes a via which is surrounded by the seal. The electrode contact extends through the via to provide electrical contact with the metallic seed layer. Plating of copper or other metal proceeds at exposed seed layer areas.

US Patent:

20040178065, Sep 16, 2004

Filed:

Mar 29, 2004

Appl. No.:

10/811710

Inventors:

Martin Bleck - Kalispell MT, US
Kenneth Haugan - Kalispell MT, US
Larry Radloff - Kalispell MT, US
Harry Geyer - Kalispell MT, US

Assignee:

Semitool, Inc. - Kalispell MT

International Classification:

C25D017/06

US Classification:

204/297060

Abstract:

A semiconductor workpiece holder for use in processing a semiconductor workpiece includes a workpiece support operatively mounted to support a workpiece in position for processing. A finger assembly is operatively mounted upon the workpiece support and includes a finger tip. The finger assembly is movable between an engaged position in which the finger tip is engaged against the workpiece, and a disengaged position in which the finger tip is moved away from the workpiece. Preferably, at least one electrode forms part of the finger assembly and includes an electrode contact for contacting a surface of said workpiece. At least one protective sheath covers at least some of the electrode contact. According to one aspect of the invention, a sheathed electrode having a sheathed electrode tip is positioned against a semiconductor workpiece surface in a manner engaging the workpiece surface with said sheathed electrode tip. A seal is formed about the periphery of the electrode tip, and with the electrode tip engaging the workpiece, a desired electrical contact is made to the workpiece. Thereafter, the workpiece is exposed to desired semiconductor processing conditions.

US Patent:

6274013, Aug 14, 2001

Filed:

Apr 27, 1999

Appl. No.:

9/300610

Inventors:

Martin Bleck - Kalispell MT
Kenneth C. Haugan - Kalispell MT
Larry R. Radloff - Kalispell MT
Harry Geyer - Kalispell MT

Assignee:

Semitool, Inc. - Kalispell MT

International Classification:

C25D 1706

US Classification:

20429708

Abstract:

A semiconductor workpiece holder for use in processing a semiconductor workpiece includes a workpiece support operatively mounted to support a workpiece in position for processing. A finger assembly is operatively mounted upon the workpiece support and includes a finger tip. The finger assembly is movable between an engaged position in which the finger tip is engaged against the workpiece, and a disengaged position in which the finger tip is moved away from the workpiece. Preferably, at least one electrode forms part of the finger assembly and includes an electrode contact for contacting a surface of said workpiece. At least one protective sheath covers at least some of the electrode contact. According to one aspect of the invention, a sheathed electrode having a sheathed electrode tip is positioned against a semiconductor workpiece surface in a manner engaging the workpiece surface with said sheathed electrode tip and forming a seal.

US Patent:

59807067, Nov 9, 1999

Filed:

Jul 15, 1996

Appl. No.:

8/680057

Inventors:

Martin Bleck - Kalispell MT
Kenneth C. Haugan - Kalispell MT
Larry R. Radloff - Kalispell MT
Harry Geyer - Kalispell MT

Assignee:

Semitool, Inc. - Kalispell MT

International Classification:

C25D 1706

US Classification:

204297R

Abstract:

A semiconductor workpiece holder for use in processing a semiconductor workpiece includes a workpiece support operatively mounted to support a workpiece in position for processing. A finger assembly is operatively mounted upon the workpiece support and includes a finger tip. The finger assembly is movable between an engaged position in which the finger tip is engaged against the workpiece, and a disengaged position in which the finger tip is moved away from the workpiece. Preferably, at least one electrode forms part of the finger assembly and includes an electrode contact for contacting a surface of said workpiece. At least one protective sheath covers at least some of the electrode contact. According to one aspect of the invention, a sheathed electrode having a sheathed electrode tip is positioned against a semiconductor workpiece surface in a manner engaging the workpiece surface with said sheathed electrode tip. A seal is formed about the periphery of the electrode tip, and with the electrode tip engaging the workpiece, a desired electrical contact is made to the workpiece.

US Patent:

6001234, Dec 14, 1999

Filed:

Sep 30, 1997

Appl. No.:

8/940685

Inventors:

Robert W. Batz - Kalispell MT
Kenneth C. Haugan - Kalispell MT
Harry J. Geyer - Kalispell MT
Robert W. Berner - Kalispell MT

Assignee:

Semitool, Inc. - Kalispell MT

International Classification:

C25D 502
C25D 1706
C25D 712

US Classification:

205123

Abstract:

Methods used in semiconductor electroplating systems, such as for plating copper, onto a semiconductor wafer or other semiconductor workpiece. The methods apply to patterned metal layers plated onto a seed layer which is partially protected by an overlying photoresist or other coating. The methods employ an electrode assembly which has a boot which seals about a contact face of the electrode. The sealing is performed by engaging the seal against photoresist to prevent corrosion of the seal layer. The area enclosed by the sealing includes a via which is surrounded by the seal. The electrode contact extends through the via to provide electrical contact with the metallic seed layer. Plating of copper or other metal proceeds at exposed seed layer areas.