Kenneth A Neidert

US Patent:

20090236328, Sep 24, 2009

Filed:

Mar 20, 2009

Appl. No.:

12/408054

Inventors:

Brad M. Dingle - Red Lion PA, US
Brian S. Micciche - York PA, US
Shawn M. Sidelinger - York PA, US
Thomas R. Correll - Harrisburg PA, US
Kenneth A. Neidert - Lewisberry PA, US

International Classification:

B23K 1/002
H05B 6/10
H05B 6/40

US Classification:

219616

Abstract:

A soldering apparatus for connecting solar cells includes an induction heat source to connect cell conducting tracks, provided with soldering medium, with electric conductors. The heat source has a high-frequency generator and an inductor loop in which the flow of a high-frequency current causes a high-frequency magnetic field to induce in the conducting track and in the electric conductor arranged along the conducting track eddy currents that generate the heat that is necessary for the soldering operation. The U-shaped inductor loop has narrowings and widenings that serve to optimize the heat development in the soldering zone and thus also save energy. Each widening affords access to the soldering point for a magnetic-field-neutral pressure foot that presses the conductor onto the conducting track. The inductor loop extends the entire length of the conducting track of the cell upper and lower sides to solder to the conductor in one soldering operation.

US Patent:

20100038358, Feb 18, 2010

Filed:

Jul 31, 2009

Appl. No.:

12/533234

Inventors:

Brad M. Dingle - Red Lion PA, US
Brian S. Micciche - York PA, US
Shawn M. Sidelinger - York PA, US
Kenneth A. Neidert - Lewisberry PA, US
Claudio Meisser - Cham, CH

International Classification:

B23K 1/002

US Classification:

219616

Abstract:

A soldering apparatus for connecting solar cells includes an induction heat source to connect cell conducting tracks, provided with soldering medium, with electric conductors. The heat source has a high-frequency generator and an inductor loop in which the flow of a high-frequency current causes a high-frequency magnetic field to induce in the conducting track and in the electric conductor arranged along the conducting track eddy currents that generate the heat that is necessary for the soldering operation. The inductor loop includes a U-shaped loop element that has narrowings and widening in one arm that is positioned closer to the conductor. Ferrite beads and ferrite tubes at the widening concentrate the magnetic field to optimize the heat development in the soldering zone and thus also save energy.

US Patent:

60930357, Jul 25, 2000

Filed:

Dec 31, 1996

Appl. No.:

8/778398

Inventors:

Timothy A. Lemke - Dillsburg PA
Timothy W. Houtz - Etters PA
Charles M. Gross - York PA
Kenneth A. Neidert - Lewisberry PA

Assignee:

Berg Technology, Inc. - Reno NV

International Classification:

H01R 909

US Classification:

439 83

Abstract:

Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also disclosed is a method for manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side of the into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portion of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the housing, thereby reducing warpage. Solder resist areas are formed on central portions of the contacts to promote uniformity of solder volume. As a result of these features, substantial coplanarity of the BGA array along the mounting interface of the connector is achieved.

US Patent:

59662670, Oct 12, 1999

Filed:

Jun 25, 1996

Appl. No.:

8/671805

Inventors:

Robert W. Hooley - Harrisburg PA
Samuel Radanovic - Etters PA
Mark S. Robertson - York PA
Kenneth A. Neidert - Etters PA
Alan Raistrick - Harrisburg PA

Assignee:

FCI Americas Technology, Inc. - Reno NV

International Classification:

G11B 3314
H01R 909
H01R 2372

US Classification:

360 9701

Abstract:

A compression arm connector for connecting two circuit substrates in a disk drive and a method of producing the same are provided. The compression arm connector replaces the need for two vertical connectors and a base plate header traditionally used in disk drives for connecting the two circuit substrates. Another compression arm connector for connecting wires to solder pads on a circuit substrate are also provided. The contacts of this compression arm connector are bent through an angle of more than about 90. degree. to form a deflectable member and a solder member. The solder member may be exposed through the connector housing through the use of solder windows or passageways formed in the housing. Both connectors are capable of exhibiting large wipe and deflection capabilities. Additionally, both connectors can be used in a low-cost disk drive provided by the invention.