Kenneth C Struven

US Patent:

6523557, Feb 25, 2003

Filed:

Dec 13, 2000

Appl. No.:

09/738463

Inventors:

Kenneth C. Struven - San Carlos CA

Assignee:

Imtec Acculine, Inc. - Sunnyvale CA

International Classification:

B08B 312

US Classification:

134184, 134186, 134137, 134138, 134902, 310321, 310322

Abstract:

In a substrate bath that processes substrate wafers using megasonic energy, a tank that is provided with reflecting surfaces that direct the megasonic energy to those portions of the substrates that would otherwise be sonically shadowed by the cassette that supports the substrates. In one aspect, a pair of curved wall surfaces are formed within the tank, each extending from one side wall to the bottom wall in curvilinear fashion and oriented longitudinally, the paired curved wall surfaces being disposed in laterally spaced, enantiomorpic relationship. The curved surfaces are arranged so that a significant amount of the megasonic energy impinges at an angle less than the critical angle, so that the energy is reflected in a diverging field that intersects the substrates and strikes those portions of the substrates that are shadowed by the cassette structure. Thus the megasonic cleaning, (etching or processing of the substrate) process is improved significantly.

US Patent:

20050252522, Nov 17, 2005

Filed:

May 11, 2004

Appl. No.:

10/844138

Inventors:

Kenneth Struven - San Carlos CA, US
Michael Olesen - Yorba Linda CA, US

International Classification:

B08B003/12

US Classification:

134001000, 13416600R

Abstract:

A method and apparatus for megasonic bath cleaning of wafers employs a megasonic resonator that is directed obliquely toward the front, active surface of the wafer, so that higher acoustic energy levels may be used without causing structural damage to the wafer. In one embodiment four transducers are coupled to a resonating plate, the four transducers being spaced apart to uniformly radiate separate portions of the wafer that total a portion of the wafer surface. When the wafer is rotated, the wafer receives equal megasonic power across the entire surface. In a further embodiment, a resonating plate is driven by an acoustic transducer at an angle to the wafer and coupled to a refracting plate to result in an off-normal axis impingement angle. In another embodiment, a resonating plate is translated radially with respect to a wafer. The radiating surface of the plate may be rotated from normal to radiate obliquely to the wafer surface.

US Patent:

20070006892, Jan 11, 2007

Filed:

Jan 26, 2006

Appl. No.:

11/341401

Inventors:

Michael Olesen - Brentwood CA, US
Mario Bran - Tustin CA, US
Kenneth Struven - San Carlos CA, US
Paul Mendes - Morgan Hill CA, US

International Classification:

B08B 3/12
B08B 6/00

US Classification:

134001000, 134184000

Abstract:

A method and apparatus for megasonic cleaning of substrates by placing the wafers in the far-field megasonic zone to eliminate sonic-induced damage to highly sensitive small-scale device structures that occurs in the near-field megasonic zone. Folded acoustic beam paths are defined by at least one reflector to achieve sufficient path length to the wafers. A reciprocally rotating reflector may be used to sweep the acoustic beam across the substrate surfaces.

US Patent:

20070215173, Sep 20, 2007

Filed:

Mar 16, 2007

Appl. No.:

11/725105

Inventors:

Paul V. Mendes - Sunnyvale CA, US
Kenneth C. Struven - Sunnyvale CA, US
Michael Olesen - Sunnyvale CA, US

International Classification:

B08B 3/12
B08B 6/00
C23G 1/00

US Classification:

134 1, 134 13, 134 2

Abstract:

A method and apparatus for heating a megasonic wafer processing plate to approximate the temperature of the processing liquid, whereby the chemical processing of the wafer is optimized. Heater blankets may be secured to the back side of the megasonic plate, or internal heating elements or passages may be disposed within the plate.

US Patent:

20080029125, Feb 7, 2008

Filed:

Jul 31, 2007

Appl. No.:

11/888598

Inventors:

Michael B. Olesen - Brentwood CA, US
Kenneth C. Struven - San Carlos CA, US
Paul Mendes - Morgan Hill CA, US

International Classification:

B08B 3/12

US Classification:

134 13, 134184

Abstract:

A method and apparatus for megasonic cleaning of semiconductor wafers. The wafer is positioned so that the surface to be cleansed is parallel to and faces the radiating surface of a quartz or similar resonator which receives sonic waves through a liquid medium from a transducer. The sonic waves striking the wafer are preferably at about a 5 to 30 offset angle from a normally directed wave to the plane of the wafer. The layered medium is gasified and serves to couple the transducer to the resonator. A layer of degasified cleaning fluid is positioned between the resonator and the wafer.

US Patent:

62095552, Apr 3, 2001

Filed:

Apr 27, 1999

Appl. No.:

9/299990

Inventors:

Kenneth C. Struven - San Carlos CA

Assignee:

Imtec Acculine, Inc. - Sunnyvale CA

International Classification:

B08B 310

US Classification:

134182

Abstract:

A cassette for supporting electrical component substrates in a megasonic processing bath includes a pair of end panels spaced apart longitudinally, a pair of side rails extending longitudinally along opposed sides of the substrate cassette, and at least one bottom support extending between lower portions of the end panels. The supports include a plurality of shallow channels extending laterally therein and spaced regularly therealong to receive edge portions of the substrates. The side rails and bottom supports of the cassette are all formed of plate components that are dimensioned to transmit the maximum amount of the megasonic energy projected into the processing bath, so that the components do not cause sound-shadowing of the substrates supported in the cassette. The side rails and bottom supports are formed of narrow plates having a thickness equal to an integer multiple (i. e. , 1, 2, 3, etc.

US Patent:

52050823, Apr 27, 1993

Filed:

Dec 20, 1991

Appl. No.:

7/811568

Inventors:

Norm Shendon - San Carlos CA
Kenneth C. Struven - San Carlos CA
Robert J. Kolenkow - Berkeley CA

Assignee:

Cybeq Systems, Inc. - Menlo Park CA

International Classification:

B24B 100

US Classification:

51283R

Abstract:

A polishing head for polishing a semiconductor wafer is described. The head design enables a wafer retainer to float during polishing and yet extend beyond a wafer carrier to define a pocket for the wafer and thereby facilitate wafer changing. The head construction also enables the carrier to be selectively projected beyond the retainer so that the surface of the carrier is easily accessible for changing an insert or the like. The head uses a positive air pressure to press the wafer against the polishing pad and the head includes interfering mechanical constructions which provide the positions mentioned above.

US Patent:

53834887, Jan 24, 1995

Filed:

Jan 31, 1994

Appl. No.:

8/188817

Inventors:

Kenneth C. Struven - San Carlos CA

Assignee:

Imtec Products, Inc. - Sunnyvale CA

International Classification:

F16K 4900

US Classification:

137340

Abstract:

A bath in which articles are processed by immersion in hot liquid chemicals has a chemical receptacle seated in a casing. Wetting of internal components in the casing, such as heating elements and thermal insulation, is prevented by a seal between the receptacle and the rim of the casing. The otherwise exposed seal is isolated from the external environment of the bath by a barrier of flowing water. The water flow shields the sealing material from corrosive chemical drips and fumes and also has a cooling effect which decreases thermal expansion of components in the region of the seal and thereby reduces structural stresses.