Keshav B Prasad
age ~63
from Saratoga, CA
- Also known as:
-
- Keshav P Prasad
- Kashev Prasad
- Prasad Keshav
Keshav Prasad Phones & Addresses
- Saratoga, CA
- Santa Clara, CA
- Poughkeepsie, NY
- San Jose, CA
- Wappingers Falls, NY
Us Patents
-
Thin Film Wiring Scheme Utilizing Inter-Chip Site Surface Wiring
view source -
US Patent:6444919, Sep 3, 2002
-
Filed:Jun 7, 1995
-
Appl. No.:08/477054
-
Inventors:Laertis Economikos - Wappingers Falls NY
Mukta Shaji Farooq - Hopewell Junction NY
Michael Ford McAllister - Clintondale NY
Eric Daniel Perfecto - Poughkeepsie NY
Chandrika Prasad - Wappingers Falls NY
Keshav Prasad - San Jose CA
Madhavan Swaminathan - Marietta GA
Thomas Anthony Wassick - Wappingers Falls NY
George White - Hoffman Estates IL -
Assignee:International Business Machines Corporation - Armonk NY
-
International Classification:H05K 103
-
US Classification:174255, 174262, 174261
-
Abstract:A thin film wiring scheme on a substrate. The thin film wiring scheme includes a plurality of chip connection pads at each of a first and second chip site on the substrate, a plurality of directional wiring lines interspersed between the chip connection pads at each of the first and second chip sites, at least one of the directional wiring lines being orthogonal to at least one of the other directional wiring lines at each of the first and second chip sites, and a plurality of chip site interconnection lines connecting directional wiring lines at the first chip site with the directional wiring lines at the second chip site.
-
Method For Repairing Defective Electrical Connections On Multi-Layer Thin Film (Mltf) Electronic Packages And The Resulting Mltf Structure
view source -
US Patent:57570795, May 26, 1998
-
Filed:Dec 21, 1995
-
Appl. No.:8/577677
-
Inventors:Michael McAllister - Clintondale NY
James McDonald - Newburgh NY
Eric Daniel Perfecto - Poughkeepsie NY
Chandrika Prasad - Wappingers Falls NY
Keshav Prasad - San Jose CA
Gordon J. Robbins - Austin TX
Madhavan Swaminathan - Marietta GA
George Eugene White - Marietta GA -
Assignee:International Business Machines Corporation - Armonk NY
-
International Classification:H01L 2348
H01L 2352
H01L 2940
H01L 2358 -
US Classification:257776
-
Abstract:A multi-layer thin film structure having defined repair lines thereon and a method for repairing interconnections in the multi-layer thin film structure (MLTF) and/or making engineering charges (EC) are provided. The method comprises determining any interconnection defects in the MLTF at a thin film layer adjacent the top metal layer of the structure, using lithography, e. g. , direct write expose technology, to define the top surface connections needed to repair the interconnections and/or make EC's, and forming the top surface metallization and repair lines using additive or substractive metallization techniques.
-
Method For Repairing Defective Electrical Connections On Multi-Layer Thin Film (Mltf) Electronic Packages
view source -
US Patent:57470952, May 5, 1998
-
Filed:Feb 14, 1997
-
Appl. No.:8/800945
-
Inventors:Michael McAllister - Clintondale NY
Eric Daniel Perfecto - Poughkeepsie NY
James McDonald - Newburgh NY
Keshav Prasad - San Jose CA
Gordon J. Robbins - Austin TX
Chandrika Prasad - Wappingers Falls NY
Madhavan Swaminathan - Marietta GA
George Eugene White - Marietta GA -
Assignee:International Business Machines Corporation - Armonk NY
-
International Classification:B05D 512
-
US Classification:427 8
-
Abstract:A multi-layer thin film structure having defined repair lines thereon and a method for repairing interconnections in the multi-layer thin film structure (MLTF) and/or making engineering charges (EC) are provided. The method comprises determining any interconnection defects in the MLTF at a thin film layer adjacent the top metal layer of the structure, using lithography, e. g. , direct write expose technology, to define the top surface connections needed to repair the interconnections and/or make EC's, and forming the top surface metallization and repair lines using additive or substractive metallization techniques.
-
Selective Plating Method For Forming Integral Via And Wiring Layers
view source -
US Patent:52098176, May 11, 1993
-
Filed:Aug 22, 1991
-
Appl. No.:7/748445
-
Inventors:Umar M. Ahmad - Hopewell Junction NY
Daniel G. Berger - Poughkeepsie NY
Ananda Kumar - Hopewell Junction NY
Susan J. LaMaire - Yorktown Heights NY
Keshav B. Prasad - New Paltz NY
Sudipta K. Ray - Wappingers Falls NY
Kwong H. Wong - Croton-On-Hudson NY -
Assignee:International Business Machines Corporation - Armonk NY
-
International Classification:B44C 122
B29C 3700
C23F 100 -
US Classification:156643
-
Abstract:In a multi-level wiring structure wires and vias are formed by an isotropic deposition of a conductive material, such as copper, on a dielectric base, such as a polyimide. In a preferred embodiment of the invention copper is electroplated to a thin seed conducting layer deposited on the surface of the dielectric base in which via openings have been formed. Openings in a resist formed on the surface of the dielectric base over the seed layer forms a pattern defining the wiring and via conductor features. Electroplated copper fills the via openings and wire pattern openings in the resist isotropically so that the upper surfaces of the wiring and vias are co-planar when the plating step is complete. In adding subsequent wiring levels, the resist is removed and the via conductor and wiring pattern covered with another dielectric layer which both encapsulates the conductors of the previous layer and serves as the base for the next level which is formed in the same manner as the previous level.
-
Thin-Film Wiring Layout For A Non-Planar Thin-Film Structure
view source -
US Patent:53789270, Jan 3, 1995
-
Filed:May 24, 1993
-
Appl. No.:8/065385
-
Inventors:Michael F. McAllister - Clintondale NY
James A. McDonald - Newburgh NY
Keshav Prasad - Poughkeepsie NY
Gordon J. Robbins - Wappingers Falls NY
Madhavan Swaminathan - Newburgh NY -
Assignee:International Business Machines Corporation - Armonk NY
-
International Classification:H01L 2350
H01L 2352 -
US Classification:257773
-
Abstract:A thin-film arrangement for a non-planar structure is described. The structure includes a substrate and a plurality of thin-film layers stacked on top of each other above the substrate. The layers contain conductive patterns and vias that provide connections between the conductive pattern in one of the layers to the conductive pattern in another layer. Vias that provide a connection between the conductive pattern of one layer to the conductive pattern in another remotely located layer are offset and in contact with respect to each other and are positioned in a non-linear arrangement, preferably in the form of a helix or a multiple helix.
-
Minimal Capture Pads Applied To Ceramic Vias In Ceramic Substrates
view source -
US Patent:54646820, Nov 7, 1995
-
Filed:Dec 14, 1993
-
Appl. No.:8/166424
-
Inventors:Eric D. Perfecto - Wappingers Falls NY
Chandrika Prasad - Wappingers Falls NY
Keshav Prasad - Poughkeepsie NY
Gordon J. Robbins - Wappingers Falls NY
Madhavan Swaminathan - Wappingers Falls NY
George E. White - Fishkill NY -
Assignee:International Business Machines Corporation - Armonk NY
-
International Classification:B32B 900
-
US Classification:428210
-
Abstract:A device includes a ceramic substrate. A ceramic via is defined within the ceramic substrate at an actual location which differs from a designed desired location for the ceramic via. A minimal capture pad electrically communicates the actual location with the designed desired location. The minimal capture pad contains a ceramic via contact portion, a thin film stud contact portion, and a connecting portion; and each of the three is configured to be as small as permitted to limit the capacitances produced by the capture pad.
-
Method And Apparatus For Cleaning By-Products From Plasma Chamber Surfaces
view source -
US Patent:57564000, May 26, 1998
-
Filed:Dec 8, 1995
-
Appl. No.:8/568064
-
Inventors:Yan Ye - Campbell CA
Diana Xiaobing Ma - Saratoga CA
Gerald Zheyao Yin - Sunnyvale CA
Keshav Prasad - San Jose CA
Mark Siegel - Santa Clara CA
Paul Martinez - Milpitas CA
James S. Papanu - San Rafael CA
Danny Chien Lu - Milpitas CA -
Assignee:Applied Materials, Inc. - Santa Clara CA
-
International Classification:C23F 400
H01L 2100 -
US Classification:438710
-
Abstract:The present invention provides an apparatus and process for plasma cleaning the interior surfaces of semiconductor processing chambers. The method is directed to the dry etching of accumulated contaminant residues attached to the inner surfaces of the plasma processing chamber and includes introducing a cleaning gas mixture of a halogen-containing gas; activating a plasma in an environment substantially free of oxygen species; contacting the contaminant residues with the activated cleaning gas to volatilize the residues; and removing the gaseous by-products from the chamber. The etchant gaseous mixture comprises an even or greater amount of at least one fluorine-containing gas and an even or lesser amount of at least one chlorine-containing gas. The instant invention enables the intermittent use of the cleaning steps in an ongoing plasma processing of semiconductor wafers without chamber downtime and significant loss of wafer production.
-
Minimal Capture Pads Applied To Ceramic Vias In Ceramic Substrates
view source -
US Patent:59164514, Jun 29, 1999
-
Filed:May 25, 1995
-
Appl. No.:8/450113
-
Inventors:Eric Daniel Perfecto - Wappingers Falls NY
Chandrika Prasad - Wappingers Falls NY
Keshav Prasad - Poughkeepsie NY
Gordon Jay Robbins - Wappingers Falls NY
Madhavan Swaminathan - Wappingers Falls NY
George Eugene White - Fishkill NY -
Assignee:International Business Machines Corporation - Armonk NY
-
International Classification:H01B 1300
-
US Classification:216 18
-
Abstract:A device includes a ceramic substrate. A ceramic via is defined within the ceramic substrate at an actual location which differs from a designed desired location for the ceramic via. A minimal capture pad electrically communicates the actual location with the designed desired location. The minimal capture pad contains a ceramic via contact portion, a thin film stud contact portion, and a connecting portion; and each of the three is configured to be as small as permitted to limit the capacitances produced by the capture pad.
Resumes
Manager E & I At W.j Towell & Co Llc
view sourcePosition:
Manager E & I at W.J Towell & Co LLC
Location:
Other
Industry:
Oil & Energy
Work:
W.J Towell & Co LLC
Manager E & I
Manager E & I
Keshav Prasad
view sourceLocation:
United States
Keshav Prasad
view sourceLocation:
United States
Keshav Prasad
view sourceLocation:
United States
Medicine Doctors
Keshav Prasad
view sourceSpecialties:
Internal Medicine - Geriatrics, Family Medicine
Work:
Monroe Family Medicine
323 Spotswood Englishtown Rd, Monroe Township, NJ 08831
(732)7231000 (phone), (732)4160470 (fax)
323 Spotswood Englishtown Rd, Monroe Township, NJ 08831
(732)7231000 (phone), (732)4160470 (fax)
Education:
Medical School
Nalanda Med Coll, Magadh Univ, Patna, Bihar, India
Graduated: 1977
Nalanda Med Coll, Magadh Univ, Patna, Bihar, India
Graduated: 1977
Procedures:
Sigmoidoscopy
Arthrocentesis
Electrocardiogram (EKG or ECG)
Hearing Evaluation
Pulmonary Function Tests
Vaccine Administration
Arthrocentesis
Electrocardiogram (EKG or ECG)
Hearing Evaluation
Pulmonary Function Tests
Vaccine Administration
Conditions:
Acne
Acute Bronchitis
Acute Conjunctivitis
Acute Otitis Externa
Acute Pancreatitis
Acute Bronchitis
Acute Conjunctivitis
Acute Otitis Externa
Acute Pancreatitis
Languages:
English
Description:
Dr. Prasad graduated from the Nalanda Med Coll, Magadh Univ, Patna, Bihar, India in 1977. He works in Monroe Township, NJ and specializes in Internal Medicine - Geriatrics and Family Medicine. Dr. Prasad is affiliated with Centrastate Medical Center and Raritan Bay Medical Center Old Bridge Division.
Amazon
Effect of Edta versus Citric acid on smear layer removal-In vitro: A Scanning electron microscopic evaluation of the effect of Edta versus Citric acid on smear layer removal. In vitro
view sourceThe study was undertaken to compare the efficacy of smear layer removal by EDTA versus Citric acid at the apical third of the root canals. There have been various chelating agents utilised in Endodontics, apart from smear layer removing properties , a good chelating agent should be atleast biocompat...
Author
Dr.Sanaulla Arifulla, Dr.S.Jagadish, Dr.Keshav Prasad B.S
Binding
Paperback
Pages
64
Publisher
LAP LAMBERT Academic Publishing
ISBN #
3843371350
EAN Code
9783843371353
ISBN #
10
The Children of the Immortal: A Quest into the Hindu Identity
view source“Who is a Hindu?” This question mystifies both Hindus and non-Hindus around the world. Many Hindus, having lived in cosmopolitan cities across the globe, have not been brought up in a traditional Hindu society and are often at a loss to comprehend and describe their own identity. Their claim to bein...
Author
Keshav Prasad Varma
Binding
Hardcover
Pages
382
Publisher
Notion Press
ISBN #
9352061918
EAN Code
9789352061914
ISBN #
2
Ideas Travel - Origin of Dissonance Theory: A Kingsman's Son Discovers
view sourceThe Theory of Cognitive Dissonance developed by Leon Festinger is a classic in the study of psychology well-known in academic circles world-wide. Not much, however, is known how Festinger got started. This monograph is the story of origin of the theory that may interest many as an article by the lat...
Author
Mr. Keshav Prasad
Binding
Paperback
Pages
68
Publisher
CreateSpace Independent Publishing Platform
ISBN #
1535407859
EAN Code
9781535407854
ISBN #
1
Application Of Morphometry In Geomorphology
view sourceAuthor
Keshav Prasad Yadav
Binding
Hardcover
Publisher
Radha Publication
ISBN #
8174875689
EAN Code
9788174875686
ISBN #
9
Water Statistics and Information
view sourceAuthor
Keshav Prasad Sharma
Binding
Paperback
ISBN #
9937894433
EAN Code
9789937894432
ISBN #
8
Climate Change Trends and Instances of Socio-economic Effects in Nepal
view sourceAuthor
Keshav Prasad Sharma
Binding
Paperback
ISBN #
9994680358
EAN Code
9789994680351
ISBN #
7
Hindi Ke Sarvjanik Shetra Ke Nirmata Acharya Keshav Prasad Mishra
view sourceAuthor
Mahendra Nath Rai
Binding
Hardcover
Publisher
Naman Prakashan
ISBN #
8181292006
EAN Code
9788181292001
ISBN #
5
Kohbar Ki Shart (Hindi)
view sourceKohbar Ki Shart by Keshav Prasad Mishra is from Rajkamal Prakashan, a noted publishing house of Hindi literature.
Author
Keshav Prasad Mishra
Binding
Kindle Edition
Pages
136
Publisher
Rajkamal Prakashan
ISBN #
3
Myspace
Youtube
Flickr
Googleplus
Keshav Prasad
Keshav Prasad
Keshav Prasad
Tagline:
MIG-1/45 MP Nagar Korba
Keshav Prasad
Keshav Prasad
Keshav Prasad
Keshav Prasad
Keshav Prasad
News
UP Assembly Election 2017 Result LIVE: News18 gives win to BJP; counting underway, BJP leading in 224 seats
view source- In an exclusive interview to CNN-News18, Keshav Prasad Maurya said that he was not the CM candidate for the BJP. He said that being the president of the state unit he will stand strongly behind whoever the national leadership chooses as CM.Rajnath Singh,Manoj Sinha, Keshav Prasad maurya are some prominent faces in BJP, while Akhilesh Yadav is the undisputed leader in the event of an SP-Congress win. If BSP is able to prove pollsters wrong, then mayawati will ascend to the throne. Read full article here
- Date: Mar 10, 2017
- Source: Google
Success had no benchmark for takeover king
view source- Rama Prasads father Keshav Prasad carried the entrepreneurship spirit forward, making successful acquisitions in various fields, passing on his business empires to his three sons Rama Prasad, Jagdish Prasad and Gauri Prasad.
- Date: Apr 14, 2013
- Category: Business
- Source: Google
Keshav Prasad
view source
Keshav Prasad
view source
Keshav Prasad
view source
Keshav Prasad
view source
Keshav Prasad
view source
Keshav Prasad
view source
Keshav Prasad
view source
Keshav Prasad Bhattarai
view sourceGet Report for Keshav B Prasad from Saratoga, CA, age ~63