Kevin M Kent

US Patent:

59258357, Jul 20, 1999

Filed:

Oct 13, 1997

Appl. No.:

8/949259

Inventors:

Ranvir Singh Solanki - Cary IL
Kevin Kent - Woodstock IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

G01N 1900
G01L 2700
B23P 2100

US Classification:

738659

Abstract:

An apparatus (200) and method are provided for testing a nozzle of a pick-and-place system (100). The apparatus (200) includes a reservoir (206) configured to carry a fluid, a membrane (204) covering an opening of the reservoir (206), and a reservoir pressure sensor. The apparatus may further include a processor (118) coupled to the reservoir pressure sensor (208) and an output device (116) coupled to the processor (118). The nozzle (104) is positioned to contact and displace the membrane (204), thus changing the pressure of the fluid within the reservoir (206). The reservoir pressure sensor (208) senses pressure changes within the reservoir (206) and generates a signal that varies in response to the displacement of the membrane. The signal is compared to a predetermined signal to detect whether the nozzle has the proper position, the proper alignment, sufficient vacuum, and other errors affecting pick-and-place systems.

US Patent:

52279588, Jul 13, 1993

Filed:

Mar 30, 1992

Appl. No.:

7/860624

Inventors:

Jacqueline D. Glomski - Arlington Heights IL
Richard H. Gosch - Westchester IL
Kevin Kent - Woodstock IL

Assignee:

Motorola Inc. - Schaumburg IL

International Classification:

H05K 500

US Classification:

361399

Abstract:

A carrier/insertion apparatus that has a U channel handle is improved to comprise an insertion portion, a stabilizer plate, and a deflector portion. The substrate that the carrier/insertion apparatus is mounted on comprises a carrier/insertion apparatus interface region that allows the carrier/insertion apparatus to mate thereto. As the carrier/insertion apparatus is slid into place, the deflector portion deflects the substrate a predetermined distance such that the carrier/insertion apparatus can be snapped into place. This arrangement allows for the carrier/insertion apparatus to be mounted on to a substrate without the use of mechanical hardware.