Kevin L Kent

US Patent:

20010009202, Jul 26, 2001

Filed:

Mar 28, 2001

Appl. No.:

09/819383

Inventors:

Donald Metzelaar - Lindenhurst IL, US
Kevin Kent - Woodstock IL, US
Anthony Richter - Arlington Heights IL, US

International Classification:

H05K001/09
H05K001/11

US Classification:

174/255000

Abstract:

An interconnect for connecting two printed circuit boards () directly together and a method for achieving same. A through hole () is formed in a first printed circuit board (), which is surrounded by a conductive layer (). A conductive layer () is also deposited on a second printed circuit board () opposite the through hole (). The conductive layers () allow for the conduction of electrical signals between and about the two printed circuit boards (). In the preferred embodiment, the conductive layer () is copper metalization and the through hole () is plated with copper. A solder joint () is applied to fill the through hole () and establish electrical connection between the conductive layers () on the two printed circuit boards (). Electrical connection is established by applying the solder joint () to and between the conductive layers () on both boards (). In an alternative embodiment using a non-plated through hole (), the interconnect is achieved by either repetitious localized impact, induced vibration or ultrasonic vibration applied to the solder joint () after the solder () is deposited.

US Patent:

59258357, Jul 20, 1999

Filed:

Oct 13, 1997

Appl. No.:

8/949259

Inventors:

Ranvir Singh Solanki - Cary IL
Kevin Kent - Woodstock IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

G01N 1900
G01L 2700
B23P 2100

US Classification:

738659

Abstract:

An apparatus (200) and method are provided for testing a nozzle of a pick-and-place system (100). The apparatus (200) includes a reservoir (206) configured to carry a fluid, a membrane (204) covering an opening of the reservoir (206), and a reservoir pressure sensor. The apparatus may further include a processor (118) coupled to the reservoir pressure sensor (208) and an output device (116) coupled to the processor (118). The nozzle (104) is positioned to contact and displace the membrane (204), thus changing the pressure of the fluid within the reservoir (206). The reservoir pressure sensor (208) senses pressure changes within the reservoir (206) and generates a signal that varies in response to the displacement of the membrane. The signal is compared to a predetermined signal to detect whether the nozzle has the proper position, the proper alignment, sufficient vacuum, and other errors affecting pick-and-place systems.

US Patent:

57875774, Aug 4, 1998

Filed:

Aug 16, 1996

Appl. No.:

8/698632

Inventors:

Kevin L. Kent - Woodstock IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 330

US Classification:

29833

Abstract:

A method for adjusting an electronic part template corresponding to an electronic part that is to be placed on a substrate includes capturing an image of the electronic part, calculating a dimension of the electronic part from the image, and adjusting the electronic part template according to the dimension. This dynamic adjustment of the electronic part template helps to reduce excessive rejection rates due to slight mechanical differences among functionally equivalent electronic parts supplied by different suppliers.

US Patent:

52279588, Jul 13, 1993

Filed:

Mar 30, 1992

Appl. No.:

7/860624

Inventors:

Jacqueline D. Glomski - Arlington Heights IL
Richard H. Gosch - Westchester IL
Kevin Kent - Woodstock IL

Assignee:

Motorola Inc. - Schaumburg IL

International Classification:

H05K 500

US Classification:

361399

Abstract:

A carrier/insertion apparatus that has a U channel handle is improved to comprise an insertion portion, a stabilizer plate, and a deflector portion. The substrate that the carrier/insertion apparatus is mounted on comprises a carrier/insertion apparatus interface region that allows the carrier/insertion apparatus to mate thereto. As the carrier/insertion apparatus is slid into place, the deflector portion deflects the substrate a predetermined distance such that the carrier/insertion apparatus can be snapped into place. This arrangement allows for the carrier/insertion apparatus to be mounted on to a substrate without the use of mechanical hardware.

US Patent:

60470844, Apr 4, 2000

Filed:

Nov 18, 1997

Appl. No.:

8/972554

Inventors:

Kevin Kent - Woodstock IL
Gregory Rahn - Sugar Grove IL
Kenneth A. Tarbell - Bartlett IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

G06K 900

US Classification:

382147

Abstract:

Accuracy of a circuit assembly process (100) is determined by capturing an image (306, 1008) of an assembly formed on a substrate by the circuit assembly process (100), calculating coverage (310, 1012, 1024) of the assembly from the image, and comparing the coverage (312, 1016, 1026) to a threshold.

US Patent:

53653998, Nov 15, 1994

Filed:

Aug 3, 1992

Appl. No.:

7/923636

Inventors:

Kevin L. Kent - Woodstock IL
Jacqueline D. Glomski - Arlington Heights IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 720

US Classification:

361704

Abstract:

A heat sinking apparatus that dissipates heat generated by a surface mountable power device, which can be auto picked and placed, comprises a first planar surface, at least one gull wing mounting tab, and at least one connective leg. The at least one connective leg thermally couples the first planar surface to the gull wing tab and all three structures are comprised of a thermally conductive material. When the heat sinking apparatus is coupled to a substrate, heat generated by the surface mountable power device is thermally transferred through a thermal plane of the substrate to the heat sinking apparatus.

US Patent:

62406337, Jun 5, 2001

Filed:

Aug 11, 1999

Appl. No.:

9/372561

Inventors:

Kevin Kent - Woodstock IL
John Kivlin - Lake Geneva WI
Eric Gasmann - Round Lake Beach IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 330

US Classification:

29832

Abstract:

A method for manufacturing an electronic device includes placing a plurality of components on a printed wiring board (204), detecting a defect in a component (210) and, in response, producing a defect indication including a defect location on the printed wiring board. Subsequently, additional components are placed on the printed wiring board (220) but placement of all additional components having a location which has a predetermined relation with the defect location is suspended. The defective printed wiring board may then be repaired by a technician who subsequently places the additional components over the defect location. This reduces the need to apply a large amount of heat to the printed wiring board to remove subsequently placed components such as radio frequency shields. This further reduces the possibility of additional defects occurring during repair.