Kevin C Lin

US Patent:

6496334, Dec 17, 2002

Filed:

May 26, 2000

Appl. No.:

09/579663

Inventors:

Song Pang - Fremont CA
Lijun Tong - Fremont CA
Kevin Lin - San Ramon CA
Joyce Hsiang - San Ramon CA

Assignee:

Read-Rite Corportion - Fremont CA

International Classification:

G11B 539

US Classification:

360319

Abstract:

In at least one embodiment, the apparatus of the invention is a read sensor comprising a shield, a sensor element, an extra shield between the shield and the sensor element, an extra gap between the shield and the sensor and adjacent the extra shield, and a gap layer between the sensor element and the extra shield. The sensor element is positioned in a sensor layer. With the extra shield adjacent to the sensor element and separated by only the relatively thin gap layer, high areal recording density and excellent instability of the sensor element is obtained. At the same time, by fabricating the extra shield to be not significantly wider than the sensor element, the potential for shorting is minimized by placing both the gap and the thicker extra gap between the sensor lead elements and the shield. In at least one embodiment, the method of the invention is for fabricating a read sensor and comprises depositing an extra gap layer onto a shield, removing a portion of the extra gap layer to form a cavity, depositing an extra shield into the cavity, planarizing the extra gap and the extra shield, depositing a gap layer onto the extra gap and the extra shield, and depositing a sensor element onto the gap layer and adjacent to the extra shield.

US Patent:

6776891, Aug 17, 2004

Filed:

May 18, 2001

Appl. No.:

09/859363

Inventors:

Chaopeng Chen - Fremont CA
Kevin Lin - San Ramon CA
Jei Wei Chang - Cupertino CA

Assignee:

Headway Technologies, Inc. - Milpitas CA

International Classification:

C25D 356

US Classification:

205 89, 205103, 205104, 205119, 205148, 205259

Abstract:

A method for forming a plated magnetic thin film of high saturation magnetization and low coercivity having the general form Co Fe M , where M can be Mo, Cr, W, Ni or Rh, which is suitable for use in magnetic recording heads that write on narrow trackwidth, high coercivity media. The plating method includes four current application processes: direct current, pulsed current, pulse reversed current and conditioned pulse reversed current.

US Patent:

6973712, Dec 13, 2005

Filed:

Mar 7, 2002

Appl. No.:

10/093106

Inventors:

Chao-Peng Chen - Fremont CA, US
Kevin Lin - San Ramon CA, US
Kochan Ju - Fremont CA, US
Hui-Chuan Wang - Pleasanton CA, US

Assignee:

Headway Technologies, Inc. - Milpitas CA

International Classification:

G11B005/127
H04R031/00

US Classification:

2960314, 2960307, 2960315, 2960316, 2960318, 205119, 205122, 3602341, 36032411, 36032412, 3603242, 427127, 427128, 438369, 438396, 438706, 438720, 438722, 451 5, 451 41

Abstract:

A major problem in Lead Overlay design for GMR structures is that the magnetic read track width is wider than the physical read track width. This is due to high interfacial resistance between the leads and the GMR layer which is an unavoidable side effect of prior art methods. The present invention uses electroplating preceded by a wet etch to fabricate the leads. This approach requires only a thin protection layer over the GMR layer to ensure that interface resistance is minimal. Using wet surface cleaning avoids sputtering defects and plating is compatible with this so the cleaned surface is preserved Only a single lithography step is needed to define the track since there is no re-deposition involved.

US Patent:

7111386, Sep 26, 2006

Filed:

Nov 3, 2005

Appl. No.:

11/266418

Inventors:

Chao-Peng Chen - Fremont CA, US
Kevin Lin - San Ramon CA, US
Kochan Ju - Fremont CA, US
Hui-Chuan Wang - Pleasanton CA, US

Assignee:

Headway Technologies, Inc. - Milpitas CA

International Classification:

G11B 5/127
H04R 31/00

US Classification:

2960314, 2960307, 2960315, 2960316, 2960318, 205119, 205122, 3602341, 36032411, 36032412, 3603242, 427127, 427128, 438369, 438396, 438706, 438720, 438722, 451 5, 451 41

Abstract:

A major problem in Lead Overlay design for GMR structures is that the magnetic read track width is wider than the physical read track width. This is due to high interfacial resistance between the leads and the GMR layer which is an unavoidable side effect of prior art methods. The present invention uses electroplating preceded by a wet etch to fabricate the leads. This approach requires only a thin protection layer over the GMR layer to ensure that interface resistance is minimal. Using wet surface cleaning avoids sputtering defects and plating is compatible with this so the cleaned surface is preserved Only a single lithography step is needed to define the track since there is no re-deposition involved.

US Patent:

7192662, Mar 20, 2007

Filed:

Aug 2, 2004

Appl. No.:

10/909529

Inventors:

Chaopeng Chen - Fremont CA, US
Kevin Lin - San Ramon CA, US
Jei Wei Chang - Cupertino CA, US

Assignee:

Headway Technologies, Inc. - Milpitas CA

International Classification:

G11B 5/33

US Classification:

428812, 148312, 148311

Abstract:

A plated magnetic thin film of high saturation magnetization and low coercivity having the general form CoFeM, where M can be Mo, Cr, W, Ni or Rh, which is suitable for use in magnetic recording heads that write on narrow trackwidth, high coercivity media. The plating method that produces the alloy includes four current application processes: direct current, pulsed current, pulse reversed current and conditioned pulse reversed current.

US Patent:

7523973, Apr 28, 2009

Filed:

Aug 8, 2007

Appl. No.:

11/835591

Inventors:

Kevin Lin - Berkeley CA, US
Jorge Robles - Stockton CA, US
Jessica A. Scott - Dublin CA, US

Assignee:

The Clorox Company - Oakland CA

International Classification:

A01K 29/00
B07B 1/02

US Classification:

294 13, 294 55, 209418

Abstract:

The present invention provides a thermoformed litter scoop comprising a generally concave scoop portion, and a handle portion attached to the scoop portion. The scoop portion has a bottom, sides and a rear and a plurality of openings therein. The openings are defined to allow the passage of litter granules therethrough. The handle portion has reinforcing ribs and the scoop portion has reinforcing ribs. The invention also describes a method of making a thermoformed scoop.

US Patent:

20090238498, Sep 24, 2009

Filed:

Mar 18, 2008

Appl. No.:

12/050426

Inventors:

Kevin Lin - Berkeley CA, US

International Classification:

B65D 33/00

US Classification:

383105

Abstract:

Provided is a compaction package that includes a flexible film portion and a heat shrink film portion coupled to part of the flexible film portion. The compaction package has a bottom, a sidewall, and an open top that together define a hollow interior space adapted to receive and contain a granular material. In a first configuration prior to exposure to a heat source sufficient to raise the temperature of the compaction package to a certain critical heat shrink temperature, the interior space of the compaction package has a first volume. In a second configuration after exposure to the heat source, the interior space of the compaction package has a second volume that is less than the first volume.

US Patent:

20180253697, Sep 6, 2018

Filed:

May 3, 2018

Appl. No.:

15/970073

Inventors:

- New York NY, US
Barbara Marder - Baltimore MD, US
Jonathan Meyers - San Francisco CA, US
Aikaterini Rodriguez - Ossining NY, US
Kevin Lin - Elmhurst NY, US

International Classification:

G06Q 10/10

Abstract:

A candidate assessment system reviews gaming data from a plurality of players to determine how well those players fit a particular job opening. The system uses one or more interpretation metrics to derive skill sets for each player by analyzing game attribute data from game scenarios played by the player. Each interpretation metric is generally unique, allowing the candidate assessment engine to derive a player's skill sets in markedly different ways.