Kevin L Lin

US Patent:

6496334, Dec 17, 2002

Filed:

May 26, 2000

Appl. No.:

09/579663

Inventors:

Song Pang - Fremont CA
Lijun Tong - Fremont CA
Kevin Lin - San Ramon CA
Joyce Hsiang - San Ramon CA

Assignee:

Read-Rite Corportion - Fremont CA

International Classification:

G11B 539

US Classification:

360319

Abstract:

In at least one embodiment, the apparatus of the invention is a read sensor comprising a shield, a sensor element, an extra shield between the shield and the sensor element, an extra gap between the shield and the sensor and adjacent the extra shield, and a gap layer between the sensor element and the extra shield. The sensor element is positioned in a sensor layer. With the extra shield adjacent to the sensor element and separated by only the relatively thin gap layer, high areal recording density and excellent instability of the sensor element is obtained. At the same time, by fabricating the extra shield to be not significantly wider than the sensor element, the potential for shorting is minimized by placing both the gap and the thicker extra gap between the sensor lead elements and the shield. In at least one embodiment, the method of the invention is for fabricating a read sensor and comprises depositing an extra gap layer onto a shield, removing a portion of the extra gap layer to form a cavity, depositing an extra shield into the cavity, planarizing the extra gap and the extra shield, depositing a gap layer onto the extra gap and the extra shield, and depositing a sensor element onto the gap layer and adjacent to the extra shield.

US Patent:

6776891, Aug 17, 2004

Filed:

May 18, 2001

Appl. No.:

09/859363

Inventors:

Chaopeng Chen - Fremont CA
Kevin Lin - San Ramon CA
Jei Wei Chang - Cupertino CA

Assignee:

Headway Technologies, Inc. - Milpitas CA

International Classification:

C25D 356

US Classification:

205 89, 205103, 205104, 205119, 205148, 205259

Abstract:

A method for forming a plated magnetic thin film of high saturation magnetization and low coercivity having the general form Co Fe M , where M can be Mo, Cr, W, Ni or Rh, which is suitable for use in magnetic recording heads that write on narrow trackwidth, high coercivity media. The plating method includes four current application processes: direct current, pulsed current, pulse reversed current and conditioned pulse reversed current.

US Patent:

6859997, Mar 1, 2005

Filed:

Sep 19, 2000

Appl. No.:

09/665431

Inventors:

Lijun Tong - San Jose CA, US
Kevin Lin - San Ramon CA, US
Joyce Hsiang - San Ramon CA, US
Yirong Hu - Sunnyvale CA, US

Assignee:

Western Digital (Fremont), Inc. - Lake Forest CA

International Classification:

G11B005/127
H04R031/00

US Classification:

2960313, 2960307, 2960313, 2960314, 2960315, 2960325, 360121, 360123, 360126, 360317, 427127, 427128, 261 22, 261 38, 261 41

Abstract:

The present invention provides a magnetic write element for use in a magnetic data recording system such as a disk drive. The invention provides a method of manufacturing a well defined coil, which avoids the problem of shallow wall angle problems exhibited by prior art methods due to coil mask shrinkage during high temperature bake. A series of trenches are provided in the coil mask, the trenches being shallower than the coil pattern, and not extending completely through the coil pattern. During the high temperature baking process shrinkage of the coil mask will be absorbed by the trenches and not transferred to the coil pattern, preventing deformation of the coil wall portion of the mask.

US Patent:

6973712, Dec 13, 2005

Filed:

Mar 7, 2002

Appl. No.:

10/093106

Inventors:

Chao-Peng Chen - Fremont CA, US
Kevin Lin - San Ramon CA, US
Kochan Ju - Fremont CA, US
Hui-Chuan Wang - Pleasanton CA, US

Assignee:

Headway Technologies, Inc. - Milpitas CA

International Classification:

G11B005/127
H04R031/00

US Classification:

2960314, 2960307, 2960315, 2960316, 2960318, 205119, 205122, 3602341, 36032411, 36032412, 3603242, 427127, 427128, 438369, 438396, 438706, 438720, 438722, 451 5, 451 41

Abstract:

A major problem in Lead Overlay design for GMR structures is that the magnetic read track width is wider than the physical read track width. This is due to high interfacial resistance between the leads and the GMR layer which is an unavoidable side effect of prior art methods. The present invention uses electroplating preceded by a wet etch to fabricate the leads. This approach requires only a thin protection layer over the GMR layer to ensure that interface resistance is minimal. Using wet surface cleaning avoids sputtering defects and plating is compatible with this so the cleaned surface is preserved Only a single lithography step is needed to define the track since there is no re-deposition involved.

US Patent:

7111386, Sep 26, 2006

Filed:

Nov 3, 2005

Appl. No.:

11/266418

Inventors:

Chao-Peng Chen - Fremont CA, US
Kevin Lin - San Ramon CA, US
Kochan Ju - Fremont CA, US
Hui-Chuan Wang - Pleasanton CA, US

Assignee:

Headway Technologies, Inc. - Milpitas CA

International Classification:

G11B 5/127
H04R 31/00

US Classification:

2960314, 2960307, 2960315, 2960316, 2960318, 205119, 205122, 3602341, 36032411, 36032412, 3603242, 427127, 427128, 438369, 438396, 438706, 438720, 438722, 451 5, 451 41

Abstract:

A major problem in Lead Overlay design for GMR structures is that the magnetic read track width is wider than the physical read track width. This is due to high interfacial resistance between the leads and the GMR layer which is an unavoidable side effect of prior art methods. The present invention uses electroplating preceded by a wet etch to fabricate the leads. This approach requires only a thin protection layer over the GMR layer to ensure that interface resistance is minimal. Using wet surface cleaning avoids sputtering defects and plating is compatible with this so the cleaned surface is preserved Only a single lithography step is needed to define the track since there is no re-deposition involved.

US Patent:

7192662, Mar 20, 2007

Filed:

Aug 2, 2004

Appl. No.:

10/909529

Inventors:

Chaopeng Chen - Fremont CA, US
Kevin Lin - San Ramon CA, US
Jei Wei Chang - Cupertino CA, US

Assignee:

Headway Technologies, Inc. - Milpitas CA

International Classification:

G11B 5/33

US Classification:

428812, 148312, 148311

Abstract:

A plated magnetic thin film of high saturation magnetization and low coercivity having the general form CoFeM, where M can be Mo, Cr, W, Ni or Rh, which is suitable for use in magnetic recording heads that write on narrow trackwidth, high coercivity media. The plating method that produces the alloy includes four current application processes: direct current, pulsed current, pulse reversed current and conditioned pulse reversed current.

US Patent:

7523973, Apr 28, 2009

Filed:

Aug 8, 2007

Appl. No.:

11/835591

Inventors:

Kevin Lin - Berkeley CA, US
Jorge Robles - Stockton CA, US
Jessica A. Scott - Dublin CA, US

Assignee:

The Clorox Company - Oakland CA

International Classification:

A01K 29/00
B07B 1/02

US Classification:

294 13, 294 55, 209418

Abstract:

The present invention provides a thermoformed litter scoop comprising a generally concave scoop portion, and a handle portion attached to the scoop portion. The scoop portion has a bottom, sides and a rear and a plurality of openings therein. The openings are defined to allow the passage of litter granules therethrough. The handle portion has reinforcing ribs and the scoop portion has reinforcing ribs. The invention also describes a method of making a thermoformed scoop.

US Patent:

7596849, Oct 6, 2009

Filed:

Jan 17, 2007

Appl. No.:

11/623884

Inventors:

Charles Carpenter - Orlando FL, US
George Grama - Sanford FL, US
Kevin K. Lin - Fremont CA, US

Assignee:

Triquint Semiconductor, Inc. - Orlando FL

International Classification:

H01S 4/00

US Classification:

295921, 29729, 29739, 29758, 29764, 29876, 310348, 310340, 310344, 439133, 439306, 439307, 439546, 439578

Abstract:

A wafer level package filter includes a device wafer having an acoustic wave device disposed on its surface, the acoustic wave device including at least an acoustic wave resonator associated with a piezoelectric substrate and a connecting pad. A capped substrate includes circuitry having inductors and capacitors. The capped substrate has a coefficient of thermal expansion significantly unequal to a coefficient of thermal expansion for the piezoelectric substrate. An adhesive bond connects the capped substrate to the device wafer for encapsulating the acoustic wave device within a cavity. A dielectric overcoat is deposited over a portion of the capped substrate, and a metallization layer extends over a portion of the dielectric layer connecting the capped substrate circuitry to a connecting pad of the acoustic wave device. Optionally, a bond connecting the capped substrate to the device wafer may provide an interlocking connection.