Kevin Y Lin

US Patent:

7109635, Sep 19, 2006

Filed:

Jun 14, 2004

Appl. No.:

10/867172

Inventors:

Michael T. McClure - Winter Park FL, US
Jack Chocola - Lake Mary FL, US
Kevin K. Lin - Apopka FL, US
George Grama - Oviedo FL, US

Assignee:

Sawtek, Inc. - Orlando FL

International Classification:

H01L 41/08

US Classification:

310313R, 310340, 310344

Abstract:

An electro-mechanical device package includes a cap material permanently bonded to a device wafer encapsulating an electromechanical device. An intermediate material is used to bond the device and capping material together at a low temperature, and a structure including the intermediate material emanating from either the device or cap material, or both, provides an interlocking at the bonding interface. One package includes a reusable carrier wafer with a similar coefficient of thermal expansion as a mating material and a low cost cap wafer of different material than the device wafer. A method for temporarily bonding the cap material to the carrier wafer includes attaching the cap material to the carrier wafer and is then singulated to mitigate thermal expansion mismatch with the device wafer.

US Patent:

7230512, Jun 12, 2007

Filed:

Aug 19, 2004

Appl. No.:

10/921479

Inventors:

Charles Carpenter - Orlando FL, US
Jack Chocola - Lake Mary FL, US
Kevin K. Lin - Orlando FL, US
Phillip Welsh - Maitland FL, US

Assignee:

Triquint, Inc. - Orlando FL

International Classification:

H03H 9/00
H03H 9/10

US Classification:

333193, 333133

Abstract:

A SAW filter is fabricated at a wafer level for providing desirable temperature characteristics. The filter includes a piezoelectric substrate bonded to a carrier substrate, wherein the coefficient of thermal expansion of the carrier substrate is less than the coefficient of thermal expansion of the piezoelectric substrate. Interdigital transducers are formed on the piezoelectric substrate so as to form a SAW composite die structure. A cap substrate having a coefficient of thermal expansion similar to that of the carrier substrate is bonded to the SAW composite die structure for enclosing the interdigital transducers. Plated vias form signal pad interconnects to input and output pads of the interdigital transducer and a sealing pad formed on the surface of the piezoelectric substrate bonds the SAW composite die structure to the cap substrate.

US Patent:

7596849, Oct 6, 2009

Filed:

Jan 17, 2007

Appl. No.:

11/623884

Inventors:

Charles Carpenter - Orlando FL, US
George Grama - Sanford FL, US
Kevin K. Lin - Fremont CA, US

Assignee:

Triquint Semiconductor, Inc. - Orlando FL

International Classification:

H01S 4/00

US Classification:

295921, 29729, 29739, 29758, 29764, 29876, 310348, 310340, 310344, 439133, 439306, 439307, 439546, 439578

Abstract:

A wafer level package filter includes a device wafer having an acoustic wave device disposed on its surface, the acoustic wave device including at least an acoustic wave resonator associated with a piezoelectric substrate and a connecting pad. A capped substrate includes circuitry having inductors and capacitors. The capped substrate has a coefficient of thermal expansion significantly unequal to a coefficient of thermal expansion for the piezoelectric substrate. An adhesive bond connects the capped substrate to the device wafer for encapsulating the acoustic wave device within a cavity. A dielectric overcoat is deposited over a portion of the capped substrate, and a metallization layer extends over a portion of the dielectric layer connecting the capped substrate circuitry to a connecting pad of the acoustic wave device. Optionally, a bond connecting the capped substrate to the device wafer may provide an interlocking connection.

US Patent:

7635636, Dec 22, 2009

Filed:

Aug 1, 2006

Appl. No.:

11/461587

Inventors:

Michael T. McClure - Winter Park FL, US
Jack Chocola - Lake Mary FL, US
Kevin K. Lin - Apopka FL, US
George Grama - Oviedo FL, US

Assignee:

Triquint Semiconductor, Inc. - Orlando FL

International Classification:

H01L 21/46
H01L 21/30

US Classification:

438455, 438106, 438456, 438458, 438459, 438464

Abstract:

An electro-mechanical device package includes a cap material permanently bonded to a device wafer encapsulating an electromechanical device. An intermediate material is used to bond the device and capping material together at a low temperature, and a structure including the intermediate material emanating from either the device or cap material, or both, provides an interlocking at the bonding interface. One package includes a reusable carrier wafer with a similar coefficient of thermal expansion as a mating material and a low cost cap wafer of different material than the device wafer. A method for temporarily bonding the cap material to the carrier wafer includes attaching the cap material to the carrier wafer and is then singulated to mitigate thermal expansion mismatch with the device wafer.