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Khristopher E Alvarez

age ~52

from Midland, MI

Also known as:
  • Khristopher Adn Laura Alvarez
  • Khris E Alvarez
  • Khristophe E Alvarez
  • Kristopher E Alvarez
  • Chris Alvarez
  • R Alvarez
  • Kristopher Alverez
Phone and address:
1316 N North Pkwy, Midland, MI 48640
(989)8372858

Khristopher Alvarez Phones & Addresses

  • 1316 N North Pkwy, Midland, MI 48640 • (989)8372858
  • Buckley, MI
  • Vicksburg, MI
  • Traverse City, MI
  • Chase, MI
  • Saginaw, MI
  • Grawn, MI

Work

  • Position:
    Professional/Technical

Education

  • Degree:
    Graduate or professional degree

Emails

Us Patents

  • Dual Curing Polymers And Methods For Their Preparation And Use

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  • US Patent:
    8168737, May 1, 2012
  • Filed:
    Dec 10, 2007
  • Appl. No.:
    12/517220
  • Inventors:
    Khristopher Edward Alvarez - Midland MI, US
    Nick Evan Shephard - Midland MI, US
    James Tonge - Midland MI, US
  • Assignee:
    Dow Corning Corporation - Midland MI
  • International Classification:
    C08G 77/08
  • US Classification:
    528 15, 528 31, 525476
  • Abstract:
    A polymer cures by both radiation and moisture curing mechanisms. The polymer is prepared by hydrosilylation. The polymer is useful in adhesive compositions. The polymer includes units of formulae (I), (R2Si0)b, (RSi0)c, (Si0)d, (R)f, and (R3SiO)g, where each Ris independently an oxygen atom or a divalent hydrocarbon group; each Ris independently divalent hydrocarbon group; each Ris independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.
  • Process For Minimizing Electromigration In An Electronic Device

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  • US Patent:
    8450931, May 28, 2013
  • Filed:
    May 9, 2006
  • Appl. No.:
    11/883992
  • Inventors:
    Khristopher Edward Alvarez - Midland MI, US
    Nick Evan Shephard - Midland MI, US
    James Steven Tonge - Sanford MI, US
  • Assignee:
    Dow Corning Corporation - Midland MI
  • International Classification:
    H01J 17/49
  • US Classification:
    313586, 445 23
  • Abstract:
    A process for reducing Ag electromigration in electronic circuitry includes the step of treating the electronic circuitry with an electromigration resistant composition. This process is useful in fabricating electronic devices having electronic circuitry that is close together, such as resistors, capacitors, and displays, e. g. , a plasma display panel (PDP) or a liquid crystal display (LCD).
  • Dual Curing Polymers And Methods For Their Preparation And Use

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  • US Patent:
    8618233, Dec 31, 2013
  • Filed:
    Nov 7, 2007
  • Appl. No.:
    12/517211
  • Inventors:
    Khristopher Alvarez - Midland MI, US
    Nick Shephard - Midland MI, US
    James Tonge - Sanford MI, US
  • Assignee:
    Dow Corning Corporation - Midland MI
  • International Classification:
    C08G 77/08
  • US Classification:
    528 15, 528 31, 528 35, 428447, 427387, 522148
  • Abstract:
    A polymer cures by either radiation or moisture curing mechanisms, or both. The polymer is prepared by hydrosilylation. The polymer includes units of formula: (RSi0), (RSi0), (SiO), (R′), and (RSi0), where each Ris independently an oxygen atom or a divalent hydrocarbon group; each R is independently divalent hydrocarbon group; each Ris independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.
  • Fire Resistant Sealant Composition

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  • US Patent:
    62712993, Aug 7, 2001
  • Filed:
    Feb 2, 1999
  • Appl. No.:
    9/244226
  • Inventors:
    Khristopher Edward Alvarez - Midland MI
    Kiersten Lynn Shephard - Midland MI
  • Assignee:
    Dow Corning Corporation - Midland MI
  • International Classification:
    C08J 334
  • US Classification:
    524456
  • Abstract:
    Curable liquid silicone rubber compositions that are curable to form silicone elastomers which are useable as fire resistant sealants. These compositions have low heat release and form hard chars on burning, and comprise: (A) a liquid polyorganosiloxane polymer described by the formula ##STR1## where each R. sup. 1 is independently selected from the group consisting of alkyl, alkenyl, aryl, and halogenated alkyl groups having from 1 to 18 carbon atoms, each R. sup. 2 is independently selected from the group consisting of hydroxyl, alkoxy, alkenyl, and alkynyl groups, and x is an integer having a value of from about 10 to 1500, (B) a cross-linking organosilicon compound having at least 3 silicon-bonded reactive groups, (C) a catalyst capable of promoting the reaction between the silicon-bonded R. sup. 2 groups of Component A and the silicon-bonded reactive group of Component B, (D) wollastonite, and (E) an optional reinforcing filler.
  • Silicone Gel Composition And Silicone Gel Produced Therefrom

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  • US Patent:
    61691550, Jan 2, 2001
  • Filed:
    Jan 14, 1999
  • Appl. No.:
    9/231447
  • Inventors:
    Khristopher Edward Alvarez - Midland MI
    Paul Anthony Berry - Bay City MI
    Michael Allen Stanga - Midland MI
    Michael Raymond Strong - Midland MI
  • Assignee:
    Dow Corning Corporation - Midland MI
  • International Classification:
    C08G 7720
    C08G 7712
  • US Classification:
    528 15
  • Abstract:
    A silicone gel composition, (A) 100 parts by weight of a first polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule and having a viscosity of from 0. 2 to 10 Pa. multidot. s at 25. degree. C. ; (B) at least about 0. 5 part by weight of a second polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, wherein the second polydiorganosiloxane has a viscosity at 25. degree. C. of at least four times the viscosity of the first polydiorganosiloxane at 25. degree. C. ; (C) an organohydrogensiloxane having the average formula R. sup. 7 Si(SiOR. sup. 8. sub. 2 H). sub. 3 wherein R. sup. 7 is an alkyl group having 1 to 18 carbon atoms or aryl, R. sup. 8 is an alkyl group having 1 to 4 carbon atoms, in an amount sufficient to provide from 0. 1 to 1. 5 silicon-bonded hydrogen atoms per alkenyl group in components (A) and (B) combined; and (D) a hydrosilylation catalyst in an amount sufficient to cure the composition.
  • Routes To Dielectric Gel For Protection Of Electronic Modules

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  • US Patent:
    60204095, Feb 1, 2000
  • Filed:
    Sep 19, 1997
  • Appl. No.:
    8/934180
  • Inventors:
    Khristopher Edward Alvarez - Midland MI
    Roger Allen Frazer - Midland MI
    Myron Timothy Maxson - Sanford MI
    Ann Walstrom Norris - Midland MI
    Michael Raymond Strong - Midland MI
    Beth Ann Witucki - Bay City MI
    Shizhong Zhang - Midland MI
  • Assignee:
    Dow Corning Corporation - Midland MI
  • International Classification:
    C08K 554
  • US Classification:
    524267
  • Abstract:
    Polyorganosiloxane gels are prepared using compositions curable by a platinum catalyzed hydrosilation reaction that are characterized by the presence of a non-functional silicone fluid. The gel may contain additional components and may also be formulated into a multi-part system.
  • Firewall Sealant

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  • US Patent:
    58801944, Mar 9, 1999
  • Filed:
    Sep 9, 1997
  • Appl. No.:
    8/926107
  • Inventors:
    Khristopher E. Alvarez - Midland MI
    Ann W. Norris - Midland MI
    Michael J. Watson - Midland MI
  • Assignee:
    Dow Corning Corporation - Midland MI
  • International Classification:
    C08K 340
  • US Classification:
    524400
  • Abstract:
    A curable composition which contains an alkenyl group containing polyorganosiloxane, an organosilicon compound having two silicon-bonded hydrogen atoms, a hydrosilylation reaction catalyst, and a glass frit, which is suitable, upon cure, for use as a firewall sealant.

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