Ki Wook Lee

US Patent:

20220310530, Sep 29, 2022

Filed:

Mar 22, 2022

Appl. No.:

17/655801

Inventors:

- Irvine CA, US
Hoang Mong Nguyen - Fountain Valley CA, US
Matthew Sean Read - Foothill Ranch CA, US
Howard E. Chen - Anaheim CA, US
Ki Wook Lee - Irvine CA, US
Yi Liu - San Diego CA, US

International Classification:

H01L 23/552
H01L 23/31
H01L 25/065
H01L 23/498
H01L 21/56
H01L 21/48
H01L 25/00

Abstract:

A packaged semiconductor module comprises a substrate having a ground plane, an electronic device mounted on a surface of the substrate, a bond pad disposed on the surface of the substrate and electrically connected to the ground plane, a mold compound covering the electronic device, a conductive post disposed on a side of the electronic device, the conductive post extending from the bond pad and at least partially through the mold compound, and a conductive layer disposed on the mold compound and electrically coupled to the conductive post and to the ground plane, the conductive post, the conductive layer, and the ground plane together forming the integrated electromagnetic interference shield, the conductive post extending from the bond pad to the conductive layer in a direction perpendicular to a plane defined by the surface of the substrate.

US Patent:

20230115846, Apr 13, 2023

Filed:

Oct 19, 2021

Appl. No.:

17/504911

Inventors:

- Irvine CA, US
Anthony James LoBianco - Irvine CA, US
Howard E. Chen - Anaheim CA, US
Ki Wook Lee - Irvine CA, US
Yi Liu - San Diego CA, US

International Classification:

H01L 23/498
H01L 21/56
H01L 21/48
H01L 23/31
H01L 25/10
H01L 25/00

Abstract:

An electronic package is provided. The electronic package comprises a substrate having a first side and a second side, the substrate configured to receive one or more electronic components; a first electronic component mounted to the first side of the substrate; a first mold structure extending over at least part of the first side of the substrate; a group of through-mold connections provided on the first side of the substrate, the through-mold connections substantially formed of non-reflowable electrically conductive material; the first mold structure substantially encapsulating the group of through-mold connections; the group of through-mold connections exposed through the first mold structure. An electronic device comprising such an electronic package is also provided. A method of manufacturing such an electronic package is also provided.

US Patent:

20210399423, Dec 23, 2021

Filed:

Jul 12, 2021

Appl. No.:

17/305647

Inventors:

- Irvine CA, US
Robert Francis Darveaux - Corona Del Mar CA, US
Anthony James LoBianco - Irvine CA, US
Lori Ann DeOrio - Irvine CA, US
Hoang Mong Nguyen - , US
Ki Wook Lee - Irvine CA, US
Hardik Bhupendra Modi - Irvine CA, US
Foad Arfaei Malekzadeh - Irvine CA, US
Stephen Joseph Kovacic - Newport Beach CA, US
René Rodriguez - Rancho Santa Margarita CA, US

International Classification:

H01Q 9/04
B29C 41/42
H01Q 5/35
H01Q 9/06

Abstract:

An antenna structure can include a printed circuit board module and a mold compound disposed on a side of the printed circuit board module. A planar antenna is defined by a conformal shield layer disposed on a first surface of the mold compound such that the mold compound is disposed between the printed circuit board module and the conformal shield layer. The thickness of the mold compound layer and the shape of the conformal shield layer can be varied to optimize a performance of the antenna.

US Patent:

20210315109, Oct 7, 2021

Filed:

Apr 14, 2021

Appl. No.:

17/230367

Inventors:

- Irvine CA, US
Ki Wook Lee - Irvine CA, US

International Classification:

H05K 3/46
H01Q 1/38
H05K 1/16

Abstract:

A method of making a printed circuit board structure including a closed cavity is provided. The method can include the steps of forming a cavity in a core structure of a core layer, laminating each of a top surface and a bottom surface of the core structure with an adhesive layer and a metal layer to prepare a laminate structure and cover the cavity to define a closed cavity. The method also includes forming vias through the laminate structure, and patterning the metal layers in the laminate structure.

US Patent:

20210315110, Oct 7, 2021

Filed:

Apr 14, 2021

Appl. No.:

17/230584

Inventors:

- Irvine CA, US
Ki Wook Lee - Irvine CA, US

International Classification:

H05K 3/46
H01Q 1/38
H05K 1/16

Abstract:

A method of making a printed circuit board structure including a closed cavity is provided. The method can include the steps of forming a cavity in a core structure of a core layer, laminating each of a top surface and a bottom surface of the core structure with an adhesive layer and a metal layer to prepare a laminate structure and cover the cavity to define a closed cavity. The method also includes forming vias through the laminate structure, and patterning the metal layers in the laminate structure.

US Patent:

20200395659, Dec 17, 2020

Filed:

May 26, 2020

Appl. No.:

16/883631

Inventors:

- Woburn MA, US
Ki Wook Lee - Irvine CA, US

International Classification:

H01Q 1/38
H05K 3/46
H05K 3/42
H05K 1/11
H05K 1/02
H01Q 9/04
H01Q 1/24
H01Q 1/22
H01Q 1/36

Abstract:

A printed circuit board can include a substrate layer, a first metal layer disposed over the substrate layer, a core layer disposed over the first metal layer, and a second metal layer disposed over the core layer, where the core layer defines a closed cavity between the first and second metal layers. Optionally, the cavity is filled with air and operates as an antenna.

US Patent:

20200077510, Mar 5, 2020

Filed:

Aug 31, 2019

Appl. No.:

16/558056

Inventors:

- Woburn MA, US
Ki Wook LEE - Irvine CA, US
Takeshi FURUSAWA - Toyonaka-Shi, JP
Sundeep Nand NANGALIA - Raleigh NC, US
Russ Alan REISNER - Oxnard CA, US
John C. BALDWIN - Simi Valley CA, US

International Classification:

H05K 1/02
H05K 1/18
H05K 1/11
H01Q 1/22
H04B 1/10

Abstract:

Devices and methods related to nested filters. In some embodiments, a radio-frequency device can include a substrate, and first and second filter devices mounted on the substrate with respective support structures, such that at least a portion of the second filter device is positioned in a space defined by an underside of the first filter device and the support structures for the first filter device. Such a radio-frequency device can be, for example, a packaged module for use in an electronic device such as a wireless device.

US Patent:

20180323502, Nov 8, 2018

Filed:

May 1, 2018

Appl. No.:

15/967976

Inventors:

- Woburn MA, US
Ki Wook Lee - Irvine CA, US

International Classification:

H01Q 1/38
H05K 3/46
H05K 3/42
H05K 1/11
H05K 1/02
H01Q 9/04
H01Q 1/24

Abstract:

A printed circuit board can include a substrate layer, a first metal layer disposed over the substrate layer, a core layer disposed over the first metal layer, and a second metal layer disposed over the core layer, where the core layer defines a closed cavity between the first and second metal layers. Optionally, the cavity is filled with air and operates as an antenna.