Kong Boon Yeap

US Patent:

20180269275, Sep 20, 2018

Filed:

Mar 20, 2017

Appl. No.:

15/463465

Inventors:

- Grand Cayman, KY
Vikrant Chauhan - Cohoes NY, US
Kong Boon Yeap - Clifton Park NY, US
Ahmed Hassan - Clifton Park NY, US

International Classification:

H01L 49/02

Abstract:

Structures for an on-chip capacitor and methods of forming an on-chip capacitor. A metal terminal is formed that has a side edge. Metal fingers are formed that have a parallel arrangement. Floating islands comprised of a metal are formed and are electrically isolated from the metal fingers. Each of the metal fingers has an end and extends from the side edge of the metal terminal toward the end. Each of the floating islands is arranged in a spaced relationship with the end of a respective one of the metal fingers.