Kristina S Munoz

US Patent:

20180195950, Jul 12, 2018

Filed:

Dec 20, 2017

Appl. No.:

15/848450

Inventors:

- San Diego CA, US
- Essex, GB
David Heiner - Vista CA, US
Edwin Li - Los Angeles CA, US
Alexandre Richez - Cambridge, GB
John M. Beierle - Carlsbad CA, US
Kevan Samiee - San Diego CA, US
Kristina Munoz - Coronado CA, US
Leonid Malevanchik - San Diego CA, US
Ludovic Vincent - San Diego CA, US
Naiqian Zhan - San Diego CA, US
Peyton Shieh - San Diego CA, US
Robert Yang - San Diego CA, US
Samantha Schmitt - San Diego CA, US
Sang Park - San Diego CA, US
Scott Bailey - San Diego CA, US
Sean M. Ramirez - San Diego CA, US
Sunmin Ahn - San Diego CA, US
Valerie Uzzell - Solana Beach CA, US
Wei Wei - San Diego CA, US
Yuxiang Huang - San Diego CA, US
Tyler Jamison Dill - San Diego CA, US

International Classification:

G01N 15/14
C12Q 1/6874
B01L 3/00
C09D 133/24
C09D 133/26

Abstract:

A flow cell package includes first and second surface-modified patterned wafers and a spacer layer. The first surface-modified patterned wafer includes first depressions separated by first interstitial regions, a first functionalized molecule bound to a first silane or silane derivative in at least some of the first depressions, and a first primer grafted to the first functionalized molecule in the at least some of the first depressions. The second surface-modified patterned wafer includes second depressions separated by second interstitial regions, a second functionalized molecule bound to a second silane or silane derivative in at least some of the second depressions, and a second primer grafted to the second functionalized molecule in the at least some of the second depressions. The spacer layer bonds at least some first interstitial regions to at least some second interstitial regions, and at least partially defines respective fluidic chambers of the flow cell package.