Kuang-Yu Wang

US Patent:

7009846, Mar 7, 2006

Filed:

Jul 30, 2004

Appl. No.:

10/903939

Inventors:

Kuang-Yu Wang - Saratoga CA, US
Jim Ni - San Jose CA, US
I-Kang Yu - Palo Alto CA, US

Assignee:

Super Talent Electronics, Inc. - San Jose CA

International Classification:

H05K 7/02

US Classification:

361737, 361752, 439945, 235492

Abstract:

A socket having thirteen contact springs arranged in a manner that supports existing MMC and SD form factors, and also supports a combination SD/MMC flash memory card. The combination memory card includes a PCB assembly that is consistent with existing 13-pad MMC mechanical form factors, and a housing that is consistent with the SD mechanical form factor, thereby providing a single PCBA and housing arrangement that can be used to produce both MMC and SD memory cards. The thirteen contact pads support all MMC and SD contact pad patterns, but are modified to facilitate a write protect switch. The contacts springs of the socket are arranged to make contact with the modified pad pattern, but to also be backward compatible with existing SD and MMC form factors. A system including the socket and combination SD/MMC flash memory card is also disclosed.

US Patent:

7032827, Apr 25, 2006

Filed:

Jun 18, 2004

Appl. No.:

10/871741

Inventors:

Kuang-Yu Wang - Saratoga CA, US
Jim Ni - San Jose CA, US

Assignee:

Super Talent Electronics, Inc. - San Jose CA

International Classification:

G06K 19/06

US Classification:

235492, 235441

Abstract:

A memory card including a PCB assembly that is consistent with existing 13-pad MMC mechanical form factors, and a housing that is consistent with the SD mechanical form factor, thereby providing a single PCBA and housing arrangement that can be used to produce both MMC and SD memory cards. The thirteen contact pads support all MMC and SD contact pad patterns, but are modified to facilitate a write protect switch. The housing includes an enlarged window (or windows) that exposes two or more contact pads in each of the multiple rows, thereby facilitating slidable insertion of the memory card into a socket of a host system. Alignment notches are formed in the side edges of the PCB, and/or alignment pins are utilized for properly aligning the PCBA within the housing.

US Patent:

7035110, Apr 25, 2006

Filed:

Oct 12, 2004

Appl. No.:

10/964412

Inventors:

Kuang-Yu Wang - Saratoga CA, US
Jim Ni - San Jose CA, US
Edward W. Lee - Mountain View CA, US

Assignee:

Super Talent Electronics, Inc. - San Jose CA

International Classification:

H05K 5/02

US Classification:

361737, 361752

Abstract:

A computer peripheral device including a USB plug connector in which a reinforced connecting ring is mounted over the front flange of a two-part housing, and includes an opening through which the USB plug connector protrudes. The connecting ring includes a collar that is sized to mount over the front flange using an interference fit. The connecting ring also includes a front plate that protects a front of the housing from damage during use. An optional rear connecting ring is used to further secure the housing together.

US Patent:

7104807, Sep 12, 2006

Filed:

Jul 9, 2004

Appl. No.:

10/888105

Inventors:

Kuang-Yu Wang - Saratoga CA, US
Edward W. Lee - Mountain View CA, US

Assignee:

Super Talent Electronics, Inc. - San Jose CA

International Classification:

H01R 12/00
H05K 5/14

US Classification:

439 761, 439660, 439638, 361737, 361785

Abstract:

A plug for coupling with an industry-standard EXPRESSCARD™ receptacle is described. The plug includes a plurality of plug-side metal contacts disposed on a bottom substrate. The plurality of plug-side metal contacts is configured to electrically couple with receptacle-side metal contacts in the industry-standard EXPRESSCARD™ receptacle. When the plug is disconnected from the industry-standard EXPRESSCARD™ receptacle, the surfaces of the plurality plug-side metal contacts are exposed by not being covered by a top housing.

US Patent:

7173826, Feb 6, 2007

Filed:

Mar 8, 2004

Appl. No.:

10/796311

Inventors:

Edward W. Lee - Mountain View CA, US
Kuang-Yu Wang - Saratoga CA, US

Assignee:

Super Talent Electronics, Inc. - San Jose CA

International Classification:

H05K 1/14

US Classification:

361737, 361715, 361790, 361801, 361802

Abstract:

A PC card frame kit for housing a printed circuit board assembly (PCBA) including a board (PCB) and a connector mounted on a back edge of the PCB. The frame kit includes a frame including first and second parallel side rails and an end rail extending between first ends of the first and second side rails. The frame defines an open end and a longitudinal slot for slidably receiving the PCB. Side panels of the PC card frame kit are then snap-coupled onto the frame.

US Patent:

7174628, Feb 13, 2007

Filed:

Mar 3, 2005

Appl. No.:

11/071289

Inventors:

Kuang-Yu Wang - Saratoga CA, US
Jim Ni - San Jose CA, US
Paul Hsueh - Concord CA, US

Assignee:

Super Talent Electronics, Inc. - San Jose CA

International Classification:

H05K 3/30

US Classification:

29841, 29830, 29832, 29840

Abstract:

Secure-digital (SD) type memory cards are produced using one or more prefabricated cover portions and a molded casing portion. A sub-assembly is formed by mounting a printed circuit board assembly (PCBA) onto the cover portion such that the contact pads of the PCBA are exposed through associated windows defined in the cover. The sub-assembly is placed into a cavity formed in a mold assembly, and molten thermoplastic material is then injected into each cavity of the mold assembly under heat and pressure using known injection molding techniques, thereby forming a molded plastic casing portion that secures the PCBA to the cover and completes the memory card housing.

US Patent:

7215551, May 8, 2007

Filed:

Sep 29, 2004

Appl. No.:

10/956893

Inventors:

Kuang-Yu Wang - Saratoga CA, US
Jim Ni - San Jose CA, US

Assignee:

Super Talent Electronics, Inc. - San Jose CA

International Classification:

H05K 7/20
H01L 23/36

US Classification:

361707, 257707

Abstract:

A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e. g. , memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive.

US Patent:

7235423, Jun 26, 2007

Filed:

Nov 5, 2004

Appl. No.:

10/982216

Inventors:

Kuang-Yu Wang - Saratoga CA, US
Jim Ni - San Jose CA, US
Paul Hsueh - Concord CA, US

Assignee:

Super Talent Electronics, Inc. - San Jose CA

International Classification:

H01L 21/98

US Classification:

438107, 438126, 257E217

Abstract:

Plastic casings are simultaneously molded onto several PCBAs attached to a carrier in a closely-spaced arrangement. All edges of each PCBA have integral connecting segments that extend through grooves formed in the associated mold assembly, and are pinched when the molds assembly is closed to precisely and reliably position the PCBA inside of an associated cavity during the molding process. In one embodiment, the PCB substrate is positioned in a bent arrangement to accommodate the use of inexpensive memory devices. Write-protect switches are provided.