Kurt R Grebe

US Patent:

6403892, Jun 11, 2002

Filed:

Jun 24, 1996

Appl. No.:

08/669598

Inventors:

Claudius Feger - Hopewell Junction NY
Teresita Ordonez Graham - Irvington NY
Kurt Rudolph Grebe - Beacon NY
Alphonso Philip Lanzetta - Marlboro NY
John Joseph Liutkus - Yorktown Heights NY
Linda Carolyn Matthew - Peekskill NY
Michael Jon Palmer - Walden NY
Nelson Russell Tanner - Harpursville NY
Ho-Ming Tong - Yorktown Heights NY
Charles Haile Wilson - Beckley WV
Helen Li Yeh - Katonah NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 100

US Classification:

174254, 174260, 361773, 361750

Abstract:

A flex or TAB product suitable for chip carrier applications wherein the flex reliability problems caused by copper dendrite growth and lead bending during power and thermal cycling are reduced by application of special coatings to lead areas of the flex tape.

US Patent:

54626285, Oct 31, 1995

Filed:

Apr 25, 1994

Appl. No.:

8/232417

Inventors:

Alfred Viehbeck - Stormville NY
Martin Goldberg - Mahopac NY
Stephen L. Tisdale - Vestal NY
Stephen L. Buchwalter - Wappingers Falls NY
Kurt R. Grebe - Beacon NY
Caroline A. Kovac - Ridgefield CT
Linda C. Matthew - Peekskill NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B32B 3100

US Classification:

156281

Abstract:

Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material. The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons. The increased solubility allows openings to be etched in certain areas of the polymeric material that have been reduced, leaving other areas unchanged.

US Patent:

47594039, Jul 26, 1988

Filed:

Apr 30, 1986

Appl. No.:

6/858135

Inventors:

Ephraim B. Flint - Garrison NY
Kurt R. Grebe - Beacon NY

Assignee:

International Business Machines Corp. - Armonk NY

International Classification:

H05K 720

US Classification:

165 804

Abstract:

A manifold for conducting coolant to a set of heat exchangers mounted on individual electric circuit chips of a circuit module is formed of a solid body containing fluid passages terminating in apertures, the manifold being provided with a set of hollow flexible appendages connected to the apertures for conducting coolant to ports of the heat exchangers. The body is formed of two sections, one section having channels machined therein to serve as the fluid passages, and a second section having the apertures. The second section also is bounded by sidewalls which define a cavity. The appendages are formed by a lost wax molding operation wherein the wax is stored in the cavity, and milled to form a mold for the appendages. A plastic material is deposited on the wax mold and on the second section of the body to form the set of appendages, the plastic material being of a type which can be deposited by the process of chemical vapor deposition, thereby to provide a conformal deposition which imparts a water-tight characteristic to the manifold.

US Patent:

47258500, Feb 16, 1988

Filed:

Mar 19, 1987

Appl. No.:

7/027710

Inventors:

Derek B. Dove - Mount Kisco NY
Kurt R. Grebe - Beacon NY
George E. Keefe - Montrose NY
Edward J. Yarmchuk - Mahopac NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01D 1500

US Classification:

346 745

Abstract:

An electromagnetic printhead is fabricated with a common flux returning backplate and an array of writing elements extending from the common backplate. The writing elements consist of large pedestals and small pedestals. The placement of the large pedestals provides addressability resolution; the small pedestals provide imaging resolution. The large pedestals accept electromagnetic flux from addressing conductors and transfer the flux through the respectively related small pedestals to an image receptor. There are several fabrication techniques which are eased by the separation of addressability resolution and imaging resolution, primarily because the wide separation of the large pedestals required for the addressing conductors mandate relatively massive removal of material and thus suggest relatively low precision machining techniques. The imaging resolution requires both high spacial precision and accurate dimension control, normally achievable by relatively high precision techniques. With the functions addressability resolution and imaging resolution functions separately provided, the best and most economical techniques may be used for each.

US Patent:

52749134, Jan 4, 1994

Filed:

Oct 25, 1991

Appl. No.:

7/782701

Inventors:

Kurt R. Grebe - Beacon NY
Jack M. McCreary - Fayetteville GA
Darbha Suryanarayana - Vestal NY
Ho-Ming Tong - Yorktown Heights NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 334

US Classification:

29840

Abstract:

Disclosed is a reworkable circuit. package formed by controlled collapse chip connection ("C4") bonding of integrated circuit chips to circuit cards and boards, and direct chip attachment ("DCA") where an encapsulant is disposed under the chip. The encapsulant offers protection of the C4 connections and a thermal expansion matched to that of the C4 joints. However, most encapsulants interfere with reworkability. The disclosed circuit package overcomes this problem by the provision of a passivating layer of Parylene is reworkable, dry processable, uniformly depositable by vapor phase deposition, forming thin films on facing surfaces at the 3-5 micron film thickness corresponding to the C4 lift-off distance.

US Patent:

53609468, Nov 1, 1994

Filed:

Sep 17, 1991

Appl. No.:

7/761182

Inventors:

Claudius Feger - Hopewell Junction NY
Teresita O. Graham - Irvington NY
Kurt R. Grebe - Beacon NY
Alphonso P. Lanzetta - Marlboro NY
John J. Liutkus - Yorktown Heights NY
Linda C. Matthew - Peekskill NY
Michael J. Palmer - Walden NY
Nelson R. Tanner - Harpursville NY
Ho-Ming Tong - Yorktown Heights NY
Charles H. Wilson - Beckley WV
Helen L. Yeh - Katonah NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 909

US Classification:

174261

Abstract:

The present invention relates to an improved flex (or TAB) product suitable for silicon carrier or other types of chip carrier applications, wherein the flex reliability problems caused for example by Cu thermal cycling are substantially reduced or eliminated. More particularly, the invention embodies a number of coatings for use in such products and diverse methods of making and using same.

US Patent:

50381954, Aug 6, 1991

Filed:

Feb 9, 1990

Appl. No.:

7/477705

Inventors:

William D. Brewer - Berlin, DE
Kurt R. Grebe - Beacon NY
Raymond R. Horton - Dover Plains NY
Linda C. Matthew - Peekskill NY
Ismail C. Noyan - Peekskill NY
Michael J. Palmer - Walden NY
Sampath Purushothaman - Yorktown Heights NY
David L. Rath - Stormville NY

Assignee:

IBM - Yorktown Heights NY

International Classification:

M01L 2348

US Classification:

357 70

Abstract:

The present invention comprises the use of a copper/nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads.

US Patent:

52427137, Sep 7, 1993

Filed:

Dec 23, 1988

Appl. No.:

7/290486

Inventors:

Alfred Viehbeck - Stormville NY
Stephen L. Buchwalter - Wappingers Falls NY
William A. Donson - Endicott NY
John J. Glenning - Vestal NY
Martin J. Goldberg - Mahopac NY
Kurt R. Grebe - Beacon NY
Caroline A. Kovac - Ridgefield CT
Linda C. Matthew - Peekskill NY
Walter P. Pawlowski - Endicott NY
Mark J. Schadt - Vestal NY
Michael R. Scheuermann - Katonah NY
Stephen L. Tisdale - Vestal NY

Assignee:

International Business Machines Corporation

International Classification:

C23C 2600

US Classification:

427304

Abstract:

Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons. The increased solubility allows openings to be etched in certain areas of the polymeric material that have been reduced, leaving other areas unchanged.