Kurt R Grebe from 24 Van Nydeck Ave, Beacon, NY 12508, Phone: (845)8310726

Us Patents

Coated Means For Connecting A Chip And A Card
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US Patent:

6403892, Jun 11, 2002
Filed:

Jun 24, 1996
Appl. No.:

08/669598
Inventors:

Claudius Feger - Hopewell Junction NY
Teresita Ordonez Graham - Irvington NY
Kurt Rudolph Grebe - Beacon NY
Alphonso Philip Lanzetta - Marlboro NY
John Joseph Liutkus - Yorktown Heights NY
Linda Carolyn Matthew - Peekskill NY
Michael Jon Palmer - Walden NY
Nelson Russell Tanner - Harpursville NY
Ho-Ming Tong - Yorktown Heights NY
Charles Haile Wilson - Beckley WV
Helen Li Yeh - Katonah NY
Assignee:

International Business Machines Corporation - Armonk NY
International Classification:

H05K 100
US Classification:

174254, 174260, 361773, 361750
Abstract:

A flex or TAB product suitable for chip carrier applications wherein the flex reliability problems caused by copper dendrite growth and lead bending during power and thermal cycling are reduced by application of special coatings to lead areas of the flex tape.

Method For Bonding Two Surfaces Together
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US Patent:

54626285, Oct 31, 1995
Filed:

Apr 25, 1994
Appl. No.:

8/232417
Inventors:

Alfred Viehbeck - Stormville NY
Martin Goldberg - Mahopac NY
Stephen L. Tisdale - Vestal NY
Stephen L. Buchwalter - Wappingers Falls NY
Kurt R. Grebe - Beacon NY
Caroline A. Kovac - Ridgefield CT
Linda C. Matthew - Peekskill NY
Assignee:

International Business Machines Corporation - Armonk NY
International Classification:

B32B 3100
US Classification:

156281
Abstract:

Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material. The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons. The increased solubility allows openings to be etched in certain areas of the polymeric material that have been reduced, leaving other areas unchanged.

Hydraulic Manifold For Water Cooling Of Multi-Chip Electric Modules
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US Patent:

47594039, Jul 26, 1988
Filed:

Apr 30, 1986
Appl. No.:

6/858135
Inventors:

Ephraim B. Flint - Garrison NY
Kurt R. Grebe - Beacon NY
Assignee:

International Business Machines Corp. - Armonk NY
International Classification:

H05K 720
US Classification:

165 804
Abstract:

A manifold for conducting coolant to a set of heat exchangers mounted on individual electric circuit chips of a circuit module is formed of a solid body containing fluid passages terminating in apertures, the manifold being provided with a set of hollow flexible appendages connected to the apertures for conducting coolant to ports of the heat exchangers. The body is formed of two sections, one section having channels machined therein to serve as the fluid passages, and a second section having the apertures. The second section also is bounded by sidewalls which define a cavity. The appendages are formed by a lost wax molding operation wherein the wax is stored in the cavity, and milled to form a mold for the appendages. A plastic material is deposited on the wax mold and on the second section of the body to form the set of appendages, the plastic material being of a type which can be deposited by the process of chemical vapor deposition, thereby to provide a conformal deposition which imparts a water-tight characteristic to the manifold.

Electromagnetic Head With Separate Addressability Resolution And Imaging Resolution Functions
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US Patent:

47258500, Feb 16, 1988
Filed:

Mar 19, 1987
Appl. No.:

7/027710
Inventors:

Derek B. Dove - Mount Kisco NY
Kurt R. Grebe - Beacon NY
George E. Keefe - Montrose NY
Edward J. Yarmchuk - Mahopac NY
Assignee:

International Business Machines Corporation - Armonk NY
International Classification:

G01D 1500
US Classification:

346 745
Abstract:

An electromagnetic printhead is fabricated with a common flux returning backplate and an array of writing elements extending from the common backplate. The writing elements consist of large pedestals and small pedestals. The placement of the large pedestals provides addressability resolution; the small pedestals provide imaging resolution. The large pedestals accept electromagnetic flux from addressing conductors and transfer the flux through the respectively related small pedestals to an image receptor. There are several fabrication techniques which are eased by the separation of addressability resolution and imaging resolution, primarily because the wide separation of the large pedestals required for the addressing conductors mandate relatively massive removal of material and thus suggest relatively low precision machining techniques. The imaging resolution requires both high spacial precision and accurate dimension control, normally achievable by relatively high precision techniques. With the functions addressability resolution and imaging resolution functions separately provided, the best and most economical techniques may be used for each.

Method Of Fabricating A Reworkable Module
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US Patent:

52749134, Jan 4, 1994
Filed:

Oct 25, 1991
Appl. No.:

7/782701
Inventors:

Kurt R. Grebe - Beacon NY
Jack M. McCreary - Fayetteville GA
Darbha Suryanarayana - Vestal NY
Ho-Ming Tong - Yorktown Heights NY
Assignee:

International Business Machines Corporation - Armonk NY
International Classification:

H05K 334
US Classification:

29840
Abstract:

Disclosed is a reworkable circuit. package formed by controlled collapse chip connection ("C4") bonding of integrated circuit chips to circuit cards and boards, and direct chip attachment ("DCA") where an encapsulant is disposed under the chip. The encapsulant offers protection of the C4 connections and a thermal expansion matched to that of the C4 joints. However, most encapsulants interfere with reworkability. The disclosed circuit package overcomes this problem by the provision of a passivating layer of Parylene is reworkable, dry processable, uniformly depositable by vapor phase deposition, forming thin films on facing surfaces at the 3-5 micron film thickness corresponding to the C4 lift-off distance.

Flex Tape Protective Coating
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US Patent:

53609468, Nov 1, 1994
Filed:

Sep 17, 1991
Appl. No.:

7/761182
Inventors:

Claudius Feger - Hopewell Junction NY
Teresita O. Graham - Irvington NY
Kurt R. Grebe - Beacon NY
Alphonso P. Lanzetta - Marlboro NY
John J. Liutkus - Yorktown Heights NY
Linda C. Matthew - Peekskill NY
Michael J. Palmer - Walden NY
Nelson R. Tanner - Harpursville NY
Ho-Ming Tong - Yorktown Heights NY
Charles H. Wilson - Beckley WV
Helen L. Yeh - Katonah NY
Assignee:

International Business Machines Corporation - Armonk NY
International Classification:

H01R 909
US Classification:

174261
Abstract:

The present invention relates to an improved flex (or TAB) product suitable for silicon carrier or other types of chip carrier applications, wherein the flex reliability problems caused for example by Cu thermal cycling are substantially reduced or eliminated. More particularly, the invention embodies a number of coatings for use in such products and diverse methods of making and using same.

Composition And Coating To Prevent Current Induced Electrochemical Dendrite Formation Between Conductors On Dielectric Substrate
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US Patent:

50381954, Aug 6, 1991
Filed:

Feb 9, 1990
Appl. No.:

7/477705
Inventors:

William D. Brewer - Berlin, DE
Kurt R. Grebe - Beacon NY
Raymond R. Horton - Dover Plains NY
Linda C. Matthew - Peekskill NY
Ismail C. Noyan - Peekskill NY
Michael J. Palmer - Walden NY
Sampath Purushothaman - Yorktown Heights NY
David L. Rath - Stormville NY
Assignee:

IBM - Yorktown Heights NY
International Classification:

M01L 2348
US Classification:

357 70
Abstract:

The present invention comprises the use of a copper/nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads.

Method For Conditioning An Organic Polymeric Material
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US Patent:

52427137, Sep 7, 1993
Filed:

Dec 23, 1988
Appl. No.:

7/290486
Inventors:

Alfred Viehbeck - Stormville NY
Stephen L. Buchwalter - Wappingers Falls NY
William A. Donson - Endicott NY
John J. Glenning - Vestal NY
Martin J. Goldberg - Mahopac NY
Kurt R. Grebe - Beacon NY
Caroline A. Kovac - Ridgefield CT
Linda C. Matthew - Peekskill NY
Walter P. Pawlowski - Endicott NY
Mark J. Schadt - Vestal NY
Michael R. Scheuermann - Katonah NY
Stephen L. Tisdale - Vestal NY
Assignee:

International Business Machines Corporation
International Classification:

C23C 2600
US Classification:

427304
Abstract:

Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons. The increased solubility allows openings to be etched in certain areas of the polymeric material that have been reduced, leaving other areas unchanged.