Kurt I Swanson

US Patent:

7832082, Nov 16, 2010

Filed:

Oct 10, 2006

Appl. No.:

11/548177

Inventors:

Reed T. Hentges - Buffalo MN, US
Kurt C. Swanson - Hutchinson MN, US
Peter F. Ladwig - Hutchinson MN, US

Assignee:

Hutchinson Technology Incorporated - Hutchinson MN

International Classification:

G11B 5/127
H04R 31/00

US Classification:

2960303, 2960304, 2960306, 2960307, 216 62, 216 65, 216 66, 3602442, 3602448, 3602452, 3602454, 3602944

Abstract:

A method for manufacturing an integrated lead suspension component. One or more first conductive ground planes are formed on a stainless steel base layer. One or more second conductive ground planes, including portions on the surface of the first conductive ground planes, are formed at void portions and backed portions of the stainless steel base layer. The material of the second conductive ground planes is non-reactive to a first etchant. An insulating layer is formed on the second ground planes on the side opposite the stainless steel base layer and on the stainless steel base layer. Traces are formed on the insulating layer. Voids are formed in void portions of the stainless steel base layer using the first etchant and the second conductive ground planes at the void portions as etch stops.

US Patent:

7929252, Apr 19, 2011

Filed:

Mar 2, 2007

Appl. No.:

11/681402

Inventors:

Reed T. Hentges - Buffalo MN, US
Kurt C. Swanson - Hutchinson MN, US
Peter F. Ladwig - Hutchinson MN, US
Lance Nevala - Tainan, TW

Assignee:

Hutchinson Technology Incorporated - Hutchinson MN

International Classification:

G11B 5/48

US Classification:

3602459

Abstract:

Multi-layer ground plane structures and methods of manufacture for integrated lead suspension flexures. A flexure in accordance with one embodiment of the invention includes an insulating layer, a plurality of traces on the insulating layer and a stainless steel base layer on the side of the insulating layer opposite the traces. The stainless steel base layer includes one or more void portions with voids in the base layer opposite the insulating layer from the traces and one or more backed portions with the base layer backing the traces. A plurality of patterned and transversely-spaced first conductive ground planes are located opposite the insulating layer from the traces at the void portions and backed portions of the stainless steel base layer. A continuous gold second conductive ground plane is located opposite the insulating layer and the first ground planes from the side of the insulating layer adjacent to the traces at the void portions and backed portions of the stainless steel base layer. The gold ground plane can be used as an etch stop during formation of the voids in the base layer.

US Patent:

8144430, Mar 27, 2012

Filed:

Oct 11, 2010

Appl. No.:

12/901771

Inventors:

Reed T. Hentges - Buffalo MN, US
Kurt C. Swanson - Hutchinson MN, US
Peter F. Ladwig - Hutchinson MN, US

Assignee:

Hutchinson Technology Incorporated - Hutchinson MN

International Classification:

G11B 5/127

US Classification:

3602459

Abstract:

Multi-layer ground plane structures and methods of manufacture for integrated lead suspension flexures. A flexure in accordance with one embodiment of the invention includes an insulating layer, a plurality of traces on the insulating layer and a stainless steel base layer on the side of the insulating layer opposite the traces. The stainless steel base layer includes one or more void portions with voids in the base layer opposite the insulating layer from the traces and one or more backed portions with the base layer backing the traces. A plurality of first conductive ground planes are located between the stainless steel base layer and the insulating layer opposite the insulating layer from the traces at the backed portions of the stainless steel base layer. A continuous second conductive ground plane is located opposite the insulating layer from the traces at the void portions and backed portions of the stainless steel base layer.

US Patent:

8296929, Oct 30, 2012

Filed:

Mar 18, 2011

Appl. No.:

13/051258

Inventors:

Reed T. Hentges - Buffalo MN, US
Kurt C. Swanson - Hutchinson MN, US
Peter F. Ladwig - Hutchinson MN, US
Lance Nevala - Tainan, TW

Assignee:

Hutchinson Technology Incorporated - Hutchinson MN

International Classification:

G11B 5/127
H04R 31/00

US Classification:

2960304, 2960303, 2960306, 2960307, 216 62, 216 65, 216 66, 3602442, 3602448, 3602452, 3602454, 451 5, 451 41

Abstract:

Multi-layer ground plane structures and methods of manufacture for integrated lead suspension flexures. A flexure in accordance with one embodiment of the invention includes an insulating layer, a plurality of traces on the insulating layer and a stainless steel base layer on the side of the insulating layer opposite the traces. The stainless steel base layer includes one or more void portions with voids in the base layer opposite the insulating layer from the traces and one or more backed portions with the base layer backing the traces. A plurality of patterned and transversely-spaced first conductive ground planes are located opposite the insulating layer from the traces at the void portions and backed portions of the stainless steel base layer. A continuous gold second conductive ground plane is located opposite the insulating layer and the first ground planes from the side of the insulating layer adjacent to the traces at the void portions and backed portions of the stainless steel base layer. The gold ground plane can be used as an etch stop during formation of the voids in the base layer.