Gundersen Lutheran ClinicGundersen Health System 1830 State Hwy 9, Decorah, IA 52101 (563)3823140 (phone), (563)3826140 (fax)
Education:
Medical School Midwestern University/ Chicago College of Osteopathic Medicine Graduated: 1995
Languages:
English Spanish
Description:
Dr. Swanson graduated from the Midwestern University/ Chicago College of Osteopathic Medicine in 1995. He works in Decorah, IA and specializes in Family Medicine. Dr. Swanson is affiliated with Gundersen Health System.
- Hutchinson MN, US Kurt C. Swanson - Chippewa Falls WI, US Peter F. Ladwig - Hutchinson MN, US Matthew S. Lang - Excelsior MN, US Paul V. Pesavento - Hutchinson MN, US Joseph D. Starkey - Cologne MN, US
International Classification:
H01F 27/28 H01F 5/00 C25D 7/00 C25D 5/02
Abstract:
A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.
High Aspect Ratio Electroplated Structures And Anisotropic Electroplating Processes
- Hutchinson MN, US Kurt C. Swanson - Chippewa Falls WI, US Peter F. Ladwig - Hutchinson MN, US
International Classification:
C25D 5/02 H05K 3/24 C25D 5/18 H05K 3/10 C25D 7/00
Abstract:
Devices including high-aspect ratio electroplated structures and methods of forming high-aspect ratio electroplated structures are described. A method for manufacturing metal structures includes providing a substrate having a metal base characterized by a height to width aspect ratio A/B and electroplating a metal crown on the base to form the metal structure with a height to width aspect ratio A/S greater than the aspect ratio A/B of the base.
- Hutchinson MN, US Peter F. Ladwig - Hutchinson MN, US Michael W. Davis - Rockford MN, US John A. Theget - Hutchinson MN, US Kurt C. Swanson - Chippewa Falls WI, US Joel B. Michaletz - Litchfield MN, US Philip W. Anderson - Dassel MN, US Timothy A. McDaniel - Hutchinson MN, US Patrick R. LaLonde - Waite Park MN, US
International Classification:
B26D 1/00 B26B 9/02 C23F 1/04 B26B 9/00
Abstract:
A chemically etched needle is provided herein. The chemically etched needle includes a metal base having a first side and a second side. The chemically etched needle also includes a chemically etched blade at one end of the metal base and formed at an intersection of a distal diverging surface and a proximal diverging surface, at least one of the diverging surfaces slopes inward towards the second side.
- Hutchinson MN, US Peter F. Ladwig - Hutchinson MN, US Michael W. Davis - Rockford MN, US John A. Theget - Hutchinson MN, US Kurt C. Swanson - Chippewa Falls WI, US Joel B. Michaletz - Litchfield MN, US Philip W. Anderson - Dassel MN, US Timothy A. McDaniel - Hutchinson MN, US
International Classification:
B26D 1/00 B26B 9/02 C23F 1/04 B26B 9/00
Abstract:
A method for forming a cutting tool includes masking a metal base with one or more masks, the one or more masks including at least one variable permeability mask, and chemically etching the masked metal base to form a blade of the cutting tool.
High-Aspect Ratio Electroplated Structures And Anisotropic Electroplating Processes
- Hutchinson MN, US Kurt C. Swanson - Chippewa Falls WI, US Peter F. Ladwig - Hutchinson MN, US Matthew S. Lang - Excelsior MN, US Paul V. Pesavento - Hutchinson MN, US Joseph D. Starkey - Cologne MN, US
International Classification:
H01F 27/28 C25D 5/02 C25D 7/00 H01F 5/00
Abstract:
A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.
- Hutchinson MN, US Peter F. Ladwig - Hutchinson MN, US Michael W. Davis - Rockford MN, US John A. Theget - Hutchinson MN, US Kurt C. Swanson - Chippewa Falls WI, US Joel B. Michaletz - Litchfield MN, US Philip W. Anderson - Dassel MN, US Timothy A. McDaniel - Hutchinson MN, US Patrick R. LaLonde - Waite Park MN, US
International Classification:
B26D 1/00 B26B 9/02 C23F 1/04 B26B 9/00
Abstract:
A method for forming a cutting tool includes masking a metal base with one or more masks, the one or more masks including at least one variable permeability mask, and chemically etching the masked metal base to form a blade of the cutting tool.
High Aspect Ratio Electroplated Structures And Anisotropic Electroplating Processes
- Hutchinson MN, US Kurt C. Swanson - Chippewa Falls WI, US Peter F. Ladwig - Hutchinson MN, US
International Classification:
C25D 5/02 C25D 7/00
Abstract:
Devices including high-aspect ratio electroplated structures and methods of forming high-aspect ratio electroplated structures are described. A method for manufacturing metal structures includes providing a substrate having a metal base characterized by a height to width aspect ratio A/B and electroplating a metal crown on the base to form the metal structure with a height to width aspect ratio A/S greater than the aspect ratio A/B of the base.
- Hutchinson MN, US Peter F. Ladwig - Hutchinson MN, US Michael W. Davis - Rockford MN, US John A. Theget - Hutchinson MN, US Kurt C. Swanson - Chippewa Falls WI, US Joel B. Michaletz - Litchfield MN, US Philip W. Anderson - Dassel MN, US Timothy A. McDaniel - Hutchinson MN, US
International Classification:
B26D 1/00 C23F 1/04 B26B 9/00 B26B 9/02
Abstract:
A method for forming a cutting tool includes masking a metal base with one or more masks, the one or more masks including at least one variable permeability mask, and chemically etching the masked metal base to form a blade of the cutting tool.
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