Laurence C Dulmage

US Patent:

20050194096, Sep 8, 2005

Filed:

Aug 27, 2004

Appl. No.:

10/927703

Inventors:

Jed Keller - Los Gatos CA, US
Laurence Dulmage - Nevada City CA, US
David Cheng - Sunnyvale CA, US

International Classification:

C23F001/00

US Classification:

156345310, 118719000, 156345320

Abstract:

A method and apparatus for semiconductor processing is disclosed. In one embodiment, a method of transporting a wafer within a cluster tool, comprises placing the wafer into a first segment of a vacuum enclosure, the vacuum enclosure being attached to a processing chamber and a factory interface. The wafer is transported to a second segment of the vacuum enclosure using a vertical transport mechanism, wherein the second segment is above or below the first segment.

US Patent:

20080073031, Mar 27, 2008

Filed:

Oct 30, 2007

Appl. No.:

11/929230

Inventors:

Jed Keller - Los Gatos CA, US
Laurence Dulmage - Nevada City CA, US
David Cheng - Sunnyvale CA, US

International Classification:

H01L 21/67
H01L 21/00

US Classification:

156345320, 118719000

Abstract:

A method and apparatus for semiconductor processing is disclosed. In one embodiment, a method of transporting a wafer within a cluster tool, comprises placing the wafer into a first segment of a vacuum enclosure, the vacuum enclosure being attached to a processing chamber and a factory interface. The wafer is transported to a second segment of the vacuum enclosure using a vertical transport mechanism, wherein the second segment is above or below the first segment.

US Patent:

20080089774, Apr 17, 2008

Filed:

Oct 30, 2007

Appl. No.:

11/929357

Inventors:

Jed Keller - Los Gatos CA, US
Laurence Dulmage - Nevada City CA, US
David Cheng - Sunnyvale CA, US

International Classification:

H01L 21/677

US Classification:

414805000

Abstract:

A method and apparatus for semiconductor processing is disclosed. In one embodiment, a method of transporting a wafer within a cluster tool, comprises placing the wafer into a first segment of a vacuum enclosure, the vacuum enclosure being attached to a processing chamber and a factory interface. The wafer is transported to a second segment of the vacuum enclosure using a vertical transport mechanism, wherein the second segment is above or below the first segment.

US Patent:

20080232934, Sep 25, 2008

Filed:

Mar 24, 2008

Appl. No.:

12/054160

Inventors:

Jed Keller - Los Gatos CA, US
Laurence Dulmage - Nevada City CA, US
David Adams - Belmont CA, US
Eric Winger - Campbell CA, US
Lawrence Wise - Mountain View CA, US

International Classification:

H01L 21/677

US Classification:

414217, 901 50

Abstract:

A modular cluster tool is disclosed. According to one embodiment, a system, comprises a wafer transfer station that includes a first vacuum chamber that stores a plurality of semiconductor wafers. The system also includes an equipment front end module interface, and two or more shuttle lock interfaces.

US Patent:

20100221915, Sep 2, 2010

Filed:

May 7, 2010

Appl. No.:

12/776235

Inventors:

Jed Keller - Los Gatos CA, US
Laurence Dulmage - Nevada City CA, US
David Cheng - Sunnyvale CA, US

International Classification:

H01L 21/677
H01L 21/465

US Classification:

438689, 15634532, 257E21485

Abstract:

A method and apparatus for semiconductor processing is disclosed. In one embodiment, a method of transporting a wafer within a cluster tool, comprises placing the wafer into a first segment of a vacuum enclosure, the vacuum enclosure being attached to a processing chamber and a factory interface. The wafer is transported to a second segment of the vacuum enclosure using a vertical transport mechanism, wherein the second segment is above or below the first segment.