Lawrence Richard Ragan

US Patent:

6877209, Apr 12, 2005

Filed:

Aug 28, 2002

Appl. No.:

10/231356

Inventors:

Gregory D. Miller - Foster City CA, US
Mike Bruner - Saratoga CA, US
Lawrence Henry Ragan - Austin TX, US
Gary Green - Pleasanton CA, US

Assignee:

Silicon Light Machines, Inc. - Sunnyvale CA

International Classification:

H04R031/00

US Classification:

29594, 29 2535, 29597, 296021, 296095, 310313 B, 310313 R, 428619

Abstract:

One embodiment disclosed relates to a method for sealing an active area of a surface acoustic wave (SAW) device on a wafer. The method includes providing a sacrificial material over at least the active area of the SAW device, depositing a seal coating over the wafer so that the seal coating covers the sacrificial material, and replacing the sacrificial material with a target atmosphere. Another embodiment disclosed relates to an SAW device sealed at the wafer level (i. e. prior to separation of the die from the wafer). The device includes an active area to be protected, an electrical contact area, and a lithographically-formed structure sealing at least the active area and leaving at least a portion of the electrical contact area exposed.

US Patent:

20040187292, Sep 30, 2004

Filed:

Apr 9, 2004

Appl. No.:

10/821357

Inventors:

Gregory Miller - Foster City CA, US
Mike Bruner - Saratoga CA, US
Lawrence Ragan - Austin TX, US
Gary Green - Pleasanton CA, US

International Classification:

H01L021/301

US Classification:

029/594000, 029/595000

Abstract:

One embodiment disclosed relates to a method for sealing an active area of a surface acoustic wave (SAW) device on a wafer. The method includes providing a sacrificial material over at least the active area of the SAW device, depositing a seal coating over the wafer so that the seal coating covers the sacrificial material, and replacing the sacrificial material with a target atmosphere. Another embodiment disclosed relates to an SAW device sealed at the wafer level (i.e. prior to separation of the die from the wafer). The device includes an active area to be protected, an electrical contact area, and a lithographically-formed structure sealing at least the active area and leaving at least a portion of the electrical contact area exposed.