Leilei Zhang

age ~71

from Apex, NC

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Lead-Free Structures In A Semiconductor Device
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US Patent:

8410604, Apr 2, 2013
Filed:

Oct 26, 2010
Appl. No.:

12/912519
Inventors:

Laurene Yip - San Francisco CA, US
Leilei Zhang - Sunnyvale CA, US
Kumar Nagarajan - San Jose CA, US
Assignee:

Xilinx, Inc. - San Jose CA
International Classification:

H01L 23/48
H01L 23/52
H01L 29/40
H01L 21/44
H01L 21/00
US Classification:

257738, 257E23069, 257739, 257778, 438108, 438613
Abstract:

A semiconductor device includes a semiconductor die and a plurality of lead-free solder bumps disposed on a surface of the semiconductor die. A substrate includes a plurality of metal layers and a plurality of dielectric layers. One of the metal layers includes a plurality of contact pads corresponding to the plurality of lead-free solder bumps, and one of the dielectric layers is an exterior dielectric layer having a plurality of respective openings for the contact pad. A plurality of respective copper posts is disposed on the contact pads. The respective copper post for each contact pad extends from the contact pad through the respective opening for the contact pad. The semiconductor die is mounted on the substrate with connections between the plurality of lead-free solder bumps and the plurality of copper posts.

Flip Chip Integrated Circuit Packages Accommodating Exposed Chip Capacitors While Providing Structural Rigidity
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US Patent:

6744131, Jun 1, 2004
Filed:

Apr 22, 2003
Appl. No.:

10/421486
Inventors:

Lan Hoang Hoang - Fremont CA
Hoa Lap Do - Herald CA
Leilei Zhang - Sunnyvale CA
Assignee:

Xilinx, Inc. - San Jose CA
International Classification:

H01L 2312
US Classification:

257704, 257778, 257723, 257724, 257786, 257693, 257678
Abstract:

An IC package provides structural rigidity to a flexible substrate, but still allows access to mounted capacitors after package assembly. In a flip chip package, the IC die is mounted face down on a flexible laminate substrate. A metal lid is mounted above and in contact with the die. The metal lid includes openings over portions of an outer region of the substrate to accommodate the capacitors. However, portions of the metal lid extend to the corners of the substrate to provide structural rigidity to the flexible substrate. Some embodiments are directed to packages configured as described above, but in which an IC die has yet to be mounted.