Leilei Zhang

US Patent:

8410604, Apr 2, 2013

Filed:

Oct 26, 2010

Appl. No.:

12/912519

Inventors:

Laurene Yip - San Francisco CA, US
Leilei Zhang - Sunnyvale CA, US
Kumar Nagarajan - San Jose CA, US

Assignee:

Xilinx, Inc. - San Jose CA

International Classification:

H01L 23/48
H01L 23/52
H01L 29/40
H01L 21/44
H01L 21/00

US Classification:

257738, 257E23069, 257739, 257778, 438108, 438613

Abstract:

A semiconductor device includes a semiconductor die and a plurality of lead-free solder bumps disposed on a surface of the semiconductor die. A substrate includes a plurality of metal layers and a plurality of dielectric layers. One of the metal layers includes a plurality of contact pads corresponding to the plurality of lead-free solder bumps, and one of the dielectric layers is an exterior dielectric layer having a plurality of respective openings for the contact pad. A plurality of respective copper posts is disposed on the contact pads. The respective copper post for each contact pad extends from the contact pad through the respective opening for the contact pad. The semiconductor die is mounted on the substrate with connections between the plurality of lead-free solder bumps and the plurality of copper posts.

US Patent:

6744131, Jun 1, 2004

Filed:

Apr 22, 2003

Appl. No.:

10/421486

Inventors:

Lan Hoang Hoang - Fremont CA
Hoa Lap Do - Herald CA
Leilei Zhang - Sunnyvale CA

Assignee:

Xilinx, Inc. - San Jose CA

International Classification:

H01L 2312

US Classification:

257704, 257778, 257723, 257724, 257786, 257693, 257678

Abstract:

An IC package provides structural rigidity to a flexible substrate, but still allows access to mounted capacitors after package assembly. In a flip chip package, the IC die is mounted face down on a flexible laminate substrate. A metal lid is mounted above and in contact with the die. The metal lid includes openings over portions of an outer region of the substrate to accommodate the capacitors. However, portions of the metal lid extend to the corners of the substrate to provide structural rigidity to the flexible substrate. Some embodiments are directed to packages configured as described above, but in which an IC die has yet to be mounted.