Richard A. Kennish - Beaverton OR Leslie S. Polaski - Beaverton OR
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 100
US Classification:
174261
Abstract:
The formation of solder bridges between pads on circuit boards is minimized by a process and structure for wicking excess solder deposited during a wave soldering process. Solder thieves are placed adjacent to a last pad of a series of pads and are approximately the same width and twice the length as the pad in order to provide sufficient wicking of solder. Thus, the excess solder is formed on the solder thieves and solder bridges are prevented.
Leslie Polaski 2006 graduate of Whitmer High School in Toledo, OH is on Classmates.com. See pictures, plan your class reunion and get caught up with Leslie and other high school ...
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