Liang Wang Wang

US Patent:

8638334, Jan 28, 2014

Filed:

Nov 25, 2008

Appl. No.:

12/323242

Inventors:

Hailin Jin - San Jose CA, US
Liang Wang - Lexington KY, US

Assignee:

Adobe Systems Incorporated - San Jose CA

International Classification:

G06T 15/00

US Classification:

345520, 345419, 345582

Abstract:

Techniques for selectively displaying surfaces of an object model to a user are described. In one embodiment, a computer-implemented method may include, for a given one of a plurality of surfaces included in an object model that is representative of a physical object, determining a normal vector of the given surface. The method may also include determining an angle between the normal vector of the given surface and a current viewing direction of the model. The method may further include displaying the object model to a user without displaying the given surface to the user, dependent upon determining that the angle between the normal vector and the current viewing direction is greater than a threshold value.

US Patent:

20130126867, May 23, 2013

Filed:

May 2, 2012

Appl. No.:

13/462676

Inventors:

Liang Wang - Milpitas CA, US
Ilyas Mohammed - Santa Clara CA, US
Masud Beroz - Morrisville NC, US

Assignee:

INVENSAS CORPORATION - San Jose CA

International Classification:

H01L 29/06
H01L 29/04
H01L 29/12
H01L 33/08
H01L 21/20

US Classification:

257 52, 438 34, 438486, 257618, 257 76, 257E33002, 257E2109, 257E29022, 257E29068, 257E29003

Abstract:

High yield substrate assembly. In accordance with a first method embodiment, a plurality of piggyback substrates are attached to a carrier substrate. The edges of the plurality of the piggyback substrates are bonded to one another. The plurality of piggyback substrates are removed from the carrier substrate to form a substrate assembly. The substrate assembly is processed to produce a plurality of integrated circuit devices on the substrate assembly. The processing may use manufacturing equipment designed to process wafers larger than individual instances of the plurality of piggyback substrates.

US Patent:

20130126921, May 23, 2013

Filed:

Nov 18, 2011

Appl. No.:

13/299714

Inventors:

Ilyas Mohammed - San Clara CA, US
Masud Beroz - Apex NC, US
Liang Wang - Milpitas CA, US

Assignee:

INVENSAS CORPORATION - San Jose CA

International Classification:

H01L 33/58
H01L 33/62
H01L 33/08

US Classification:

257 98, 438 27, 438 29, 257E33056, 257E33073

Abstract:

Inverted optical device. In accordance with an embodiment of the present invention, a plurality of piggyback substrates are attached to a carrier wafer. The plurality of piggyback substrates are dissimilar in composition to the carrier wafer. The plurality of piggyback substrates are processed, while attached to the carrier wafer, to produce a plurality of integrated circuit devices. A flip wafer is attached to the plurality of light emitting diodes, away from the carrier wafer and the carrier wafer is removed. The plurality of light emitting diodes may be singulated to form individual light emitting diode devices.

US Patent:

20130127364, May 23, 2013

Filed:

Nov 18, 2011

Appl. No.:

13/299672

Inventors:

Ilyas Mohammed - San Clara CA, US
Masud Beroz - Apex NC, US
Liang Wang - Milpitas CA, US

Assignee:

INVENSAS CORPORATION - San Jose CA

International Classification:

H05B 37/02
H01L 33/62
H01L 33/38
H01L 21/78

US Classification:

315246, 438460, 438 33, 257 99, 257E33057, 257E33065, 257E21599

Abstract:

Front facing piggyback wafer assembly. In accordance with an embodiment of the present invention, a plurality of piggyback substrates are attached to a carrier wafer. The plurality of piggyback substrates are dissimilar in composition to the carrier wafer. The plurality of piggyback substrates are processed, while attached to the carrier wafer, to produce a plurality of integrated circuit devices. The plurality of integrated circuit devices are singulated to form individual integrated circuit devices. The carrier wafer may be processed to form integrated circuit structures prior to the attaching.

US Patent:

20130215121, Aug 22, 2013

Filed:

Feb 17, 2012

Appl. No.:

13/399952

Inventors:

Gabriel Z. Guevara - San Jose CA, US
Ilyas Mohammed - Santa Clara CA, US
Liang Wang - Milpitas CA, US

Assignee:

INVENSAS CORPORATION - San Jose CA

International Classification:

H05K 7/20
G06T 1/00
B05D 5/12
F21V 29/00

US Classification:

345501, 361720, 174252, 362382, 36224902, 427 58

Abstract:

Heat spreading substrate. In accordance with an embodiment of the present invention, an apparatus includes a thermally conductive, electrically insulating regular solid, a first electrically conductive coating mechanically coupled to a first edge of the regular solid and a second electrically conductive coating mechanically coupled to a second edge of the regular solid. The first and the second electrically conductive coatings are electrically isolated from one another and the faces of the first electrically conductive coating, the second electrically conductive coating and the regular solid are substantially co-planar. The primary and secondary surfaces of the regular solid may be free of electrically conductive materials.

US Patent:

20130288412, Oct 31, 2013

Filed:

Jun 3, 2013

Appl. No.:

13/908902

Inventors:

Liang WANG - Milpitas CA, US
Ilyas MOHAMMED - Santa Clara CA, US
Masud BEROZ - Morrisville NC, US

Assignee:

Invensas Corporation - San Jose CA

International Classification:

H01L 33/00

US Classification:

438 34

Abstract:

High yield substrate assembly. In accordance with a first method embodiment, a plurality of piggyback substrates are attached to a carrier substrate. The edges of the plurality of the piggyback substrates are bonded to one another. The plurality of piggyback substrates are removed from the carrier substrate to form a substrate assembly. The substrate assembly is processed to produce a plurality of integrated circuit devices on the substrate assembly. The processing may use manufacturing equipment designed to process wafers larger than individual instances of the plurality of piggyback substrates.

US Patent:

20140008607, Jan 9, 2014

Filed:

Jul 3, 2012

Appl. No.:

13/541559

Inventors:

Liang Wang - Milpitas CA, US
Ilyas Mohammed - Santa Clara CA, US
Masud Beroz - Apex NC, US

Assignee:

INVENSAS CORPORATION - San Jose CA

International Classification:

H01L 33/06

US Classification:

257 13, 438 28

Abstract:

Improved quantum efficiency of multiple quantum wells. In accordance with an embodiment of the present invention, an article of manufacture includes a p side for supplying holes and an n side for supplying electrons. The article of manufacture also includes a plurality of quantum well periods between the p side and the n side, each of the quantum well periods includes a quantum well layer and a barrier layer, with each of the barrier layers having a barrier height. The plurality of quantum well periods include different barrier heights.

US Patent:

20140008669, Jan 9, 2014

Filed:

Jul 6, 2012

Appl. No.:

13/543697

Inventors:

Ilyas Mohammed - Santa Clara CA, US
Liang Wang - Milpitas CA, US
Steven D. Gottke - Palo Alto CA, US

Assignee:

INVENSAS CORPORATION - San Jose CA

International Classification:

H01L 27/15
H01L 33/60

US Classification:

257 88, 438 27

Abstract:

Parallel plate slot emission array. In accordance with an embodiment of the present invention, an article of manufacture includes a side-emitting light emitting diode configured to emit light from more than two surfaces. The article of manufacture includes a first sheet electrically and thermally coupled to a first side of the light emitting diode, and a second sheet electrically and thermally coupled to a second side of the light emitting diode. The article of manufacture further includes a plurality of reflective surfaces configured to reflect light from all of the surfaces of the light emitting diode through holes in the first sheet. The light may be reflected via total internal reflection.