Liang Wang

US Patent:

20130126921, May 23, 2013

Filed:

Nov 18, 2011

Appl. No.:

13/299714

Inventors:

Ilyas Mohammed - San Clara CA, US
Masud Beroz - Apex NC, US
Liang Wang - Milpitas CA, US

Assignee:

INVENSAS CORPORATION - San Jose CA

International Classification:

H01L 33/58
H01L 33/62
H01L 33/08

US Classification:

257 98, 438 27, 438 29, 257E33056, 257E33073

Abstract:

Inverted optical device. In accordance with an embodiment of the present invention, a plurality of piggyback substrates are attached to a carrier wafer. The plurality of piggyback substrates are dissimilar in composition to the carrier wafer. The plurality of piggyback substrates are processed, while attached to the carrier wafer, to produce a plurality of integrated circuit devices. A flip wafer is attached to the plurality of light emitting diodes, away from the carrier wafer and the carrier wafer is removed. The plurality of light emitting diodes may be singulated to form individual light emitting diode devices.

US Patent:

20130127364, May 23, 2013

Filed:

Nov 18, 2011

Appl. No.:

13/299672

Inventors:

Ilyas Mohammed - San Clara CA, US
Masud Beroz - Apex NC, US
Liang Wang - Milpitas CA, US

Assignee:

INVENSAS CORPORATION - San Jose CA

International Classification:

H05B 37/02
H01L 33/62
H01L 33/38
H01L 21/78

US Classification:

315246, 438460, 438 33, 257 99, 257E33057, 257E33065, 257E21599

Abstract:

Front facing piggyback wafer assembly. In accordance with an embodiment of the present invention, a plurality of piggyback substrates are attached to a carrier wafer. The plurality of piggyback substrates are dissimilar in composition to the carrier wafer. The plurality of piggyback substrates are processed, while attached to the carrier wafer, to produce a plurality of integrated circuit devices. The plurality of integrated circuit devices are singulated to form individual integrated circuit devices. The carrier wafer may be processed to form integrated circuit structures prior to the attaching.

US Patent:

20160204091, Jul 14, 2016

Filed:

Mar 21, 2016

Appl. No.:

15/075899

Inventors:

- San Jose CA, US
Masud Beroz - Morrisville NC, US
Liang Wang - Milpitas CA, US

International Classification:

H01L 25/16
H01L 33/32
H01L 33/62
H01L 33/60
H01L 33/58
H01L 33/06
H01L 33/22

Abstract:

Inverted optical device. In accordance with an embodiment of the present invention, a plurality of piggyback substrates are attached to a carrier wafer. The plurality of piggyback substrates are dissimilar in composition to the carrier wafer. The plurality of piggyback substrates are processed, while attached to the carrier wafer, to produce a plurality of integrated circuit devices. A flip wafer is attached to the plurality of light emitting diodes, away from the carrier wafer and the carrier wafer is removed. The plurality of light emitting diodes may be singulated to form individual light emitting diode devices.

US Patent:

20150228633, Aug 13, 2015

Filed:

Dec 15, 2014

Appl. No.:

14/570570

Inventors:

- San Jose CA, US
Masud Beroz - Morrisville NC, US
Liang Wang - Milpitas CA, US

International Classification:

H01L 25/16
H01L 33/64
H01L 33/62

Abstract:

Front facing piggyback wafer assembly. In accordance with an embodiment of the present invention, a plurality of piggyback substrates are attached to a carrier wafer. The plurality of piggyback substrates are dissimilar in composition to the carrier wafer. The plurality of piggyback substrates are processed, while attached to the carrier wafer, to produce a plurality of integrated circuit devices. The plurality of integrated circuit devices are singulated to form individual integrated circuit devices. The carrier wafer may be processed to form integrated circuit structures prior to the attaching.