Liang Wang

US Patent:

8048689, Nov 1, 2011

Filed:

Sep 25, 2008

Appl. No.:

12/237568

Inventors:

Liang Wang - Austin TX, US
Michael R. Bruce - Austin TX, US

Assignee:

Globalfoundries Inc. - Grand Cayman

International Classification:

H01L 21/44
H01L 21/66

US Classification:

438 14, 438652, 438 10, 438462, 438597, 438621, 438637, 438672, 438700, 438706, 438704, 438743, 257E21219, 257E21252, 257E21309, 257E21347

Abstract:

Various semiconductor devices and methods of testing such devices are disclosed. In one aspect, a method of manufacturing is provided that includes forming a bore from a backside of a semiconductor chip through a buried insulating layer and to a semiconductor device layer of the semiconductor chip. A conductor structure is formed in the bore to establish an electrically conductive pathway between the semiconductor device layer and the conductor structure. The conductor structure may provide a diagnostic pathway.

US Patent:

8142704, Mar 27, 2012

Filed:

Oct 8, 2009

Appl. No.:

12/575907

Inventors:

Liang Wang - Austin TX, US
Byung-Jin Choi - Austin TX, US

Assignee:

Molecular Imprints, Inc. - Austin TX

International Classification:

B29C 59/00

US Classification:

264293, 264 124, 264 401, 264319, 425385

Abstract:

A loading unit, surface scanning module, and an imprint module may be integrated into a single tool. Template may be loaded on loading unit and positioned within imprint module. Substrate may then be loaded on loading unit and scanned defects using surface scanning module. If substrate passes inspection by surface scanning module, substrate may be positioned imprint module where formable material may be dispensed thereon and imprinted. The imprinted substrate may then be unloaded from imprinting module.

US Patent:

8237133, Aug 7, 2012

Filed:

Jul 29, 2009

Appl. No.:

12/511593

Inventors:

Mahadevan Ganapathisubramanian - Austin TX, US
Byung-Jin Choi - Austin TX, US
Liang Wang - Austin TX, US
Alex Ruiz - Spicewood TX, US

Assignee:

Molecular Imprints, Inc. - Austin TX

International Classification:

G21K 5/00

US Classification:

25049221, 2504921, 2504922, 25045311, 25045511, 250504 R

Abstract:

Energy sources and methods for curing in an imprint lithography system are described. The energy sources may include one or more energy elements positioned outside of the viewing range of an imaging unit monitoring elements of the imprint lithography system. Each energy source is configured to provide energy along a path to solidify polymerizable material on a substrate.

US Patent:

8519391, Aug 27, 2013

Filed:

Sep 22, 2011

Appl. No.:

13/239872

Inventors:

Liang Wang - Austin TX, US
Michael R. Bruce - Austin TX, US

Assignee:

GLOBALFOUNDRIES Inc. - Grand Cayman

International Classification:

H01L 23/544

US Classification:

257 48, 257507, 257E23179

Abstract:

Various semiconductor devices and methods of testing such devices are disclosed. In one aspect, a method of manufacturing is provided that includes forming a bore from a backside of a semiconductor chip through a buried insulating layer and to a semiconductor device layer of the semiconductor chip. A conductor structure is formed in the bore to establish an electrically conductive pathway between the semiconductor device layer and the conductor structure. The conductor structure may provide a diagnostic pathway.

US Patent:

8638334, Jan 28, 2014

Filed:

Nov 25, 2008

Appl. No.:

12/323242

Inventors:

Hailin Jin - San Jose CA, US
Liang Wang - Lexington KY, US

Assignee:

Adobe Systems Incorporated - San Jose CA

International Classification:

G06T 15/00

US Classification:

345520, 345419, 345582

Abstract:

Techniques for selectively displaying surfaces of an object model to a user are described. In one embodiment, a computer-implemented method may include, for a given one of a plurality of surfaces included in an object model that is representative of a physical object, determining a normal vector of the given surface. The method may also include determining an angle between the normal vector of the given surface and a current viewing direction of the model. The method may further include displaying the object model to a user without displaying the given surface to the user, dependent upon determining that the angle between the normal vector and the current viewing direction is greater than a threshold value.

US Patent:

20110277827, Nov 17, 2011

Filed:

May 11, 2011

Appl. No.:

13/105422

Inventors:

Shuqiang Yang - Austin TX, US
Michael N. Miller - Austin TX, US
Mohamed M. Hilali - Austin TX, US
Fen Wan - Austin TX, US
Gerard M. Schmid - Austin TX, US
Liang Wang - Austin TX, US
Sidlgata V. Sreenivasan - Austin TX, US
Frank Y. Xu - Round Rock TX, US

Assignee:

BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM - Austin TX
MOLECULAR IMPRINTS, INC. - Austin TX

International Classification:

H01L 31/06
H01L 31/0216
H01L 31/0236
B82Y 99/00

US Classification:

136255, 438 71, 438 98, 977948, 257E3113, 257E31119

Abstract:

Systems and methods for fabrication of nanostructured solar cells having arrays of nanostructures are described, including nanostructured solar cells having a repeating pattern of pyramid nanostructures, providing for low cost thin-film solar cells with improved PCE.

US Patent:

20130126867, May 23, 2013

Filed:

May 2, 2012

Appl. No.:

13/462676

Inventors:

Liang Wang - Milpitas CA, US
Ilyas Mohammed - Santa Clara CA, US
Masud Beroz - Morrisville NC, US

Assignee:

INVENSAS CORPORATION - San Jose CA

International Classification:

H01L 29/06
H01L 29/04
H01L 29/12
H01L 33/08
H01L 21/20

US Classification:

257 52, 438 34, 438486, 257618, 257 76, 257E33002, 257E2109, 257E29022, 257E29068, 257E29003

Abstract:

High yield substrate assembly. In accordance with a first method embodiment, a plurality of piggyback substrates are attached to a carrier substrate. The edges of the plurality of the piggyback substrates are bonded to one another. The plurality of piggyback substrates are removed from the carrier substrate to form a substrate assembly. The substrate assembly is processed to produce a plurality of integrated circuit devices on the substrate assembly. The processing may use manufacturing equipment designed to process wafers larger than individual instances of the plurality of piggyback substrates.

US Patent:

20130126921, May 23, 2013

Filed:

Nov 18, 2011

Appl. No.:

13/299714

Inventors:

Ilyas Mohammed - San Clara CA, US
Masud Beroz - Apex NC, US
Liang Wang - Milpitas CA, US

Assignee:

INVENSAS CORPORATION - San Jose CA

International Classification:

H01L 33/58
H01L 33/62
H01L 33/08

US Classification:

257 98, 438 27, 438 29, 257E33056, 257E33073

Abstract:

Inverted optical device. In accordance with an embodiment of the present invention, a plurality of piggyback substrates are attached to a carrier wafer. The plurality of piggyback substrates are dissimilar in composition to the carrier wafer. The plurality of piggyback substrates are processed, while attached to the carrier wafer, to produce a plurality of integrated circuit devices. A flip wafer is attached to the plurality of light emitting diodes, away from the carrier wafer and the carrier wafer is removed. The plurality of light emitting diodes may be singulated to form individual light emitting diode devices.