Ling Zheng from Chandler, AZ

Us Patents

Packed Interconnect Structure With Reduced Cross Coupled Noise
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US Patent:

20190043796, Feb 7, 2019
Filed:

Jun 25, 2018
Appl. No.:

16/017710
Inventors:

- Santa Clara CA, US
Jun LIAO - Hillsboro OR, US
Xiang LI - Portland OR, US
Kevin STONE - Hillsboro OR, US
Tom DU - Beaverton OR, US
Tae-Young YANG - Portland OR, US
Ling ZHENG - Chandler AZ, US
James A. McCALL - Portland OR, US
International Classification:

H01L 23/498
H01R 12/71
H01R 12/52
H01R 43/20
H01R 43/16
H01R 12/57
Abstract:

An apparatus is described. The apparatus includes an electro-mechanical interface having angled signal interconnects, wherein, the angling of the signal interconnects is to reduce noise coupling between the angled signal interconnects.

Resumes

Reliability Engineer, Quality And Reliability Department

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Location:

San Diego, CA

Industry:

Semiconductors

Work:

Qualcomm
Reliability Engineer, Quality and Reliability Department
Intel Corporation
Platform Design Integrator, Technical Program Manager
Intel Corporation Oct 2008 - May 2014
Senior Mechanical Engineer

Education:

Caltech 2005 - 2008
Caltech 2004 - 2005
Master of Science, Masters, Mechanical Engineering University of Wisconsin - Madison 2003 - 2004
Tsinghua University 1999 - 2003
Bachelors, Mechanical Engineering Tianjin No.1 Middle School
Tianjin No.1 High School

Skills:

Design of Experiments
Matlab
Engineering
Finite Element Analysis
Solid Mechanics
Abaqus
Simulation
Mathematica
Solidworks
Semiconductor Manufacturing
Jmp
Design For Manufacturing
Program Management
Geometric Dimensioning and Tolerancing
Fmea
Supplier Management

Languages:

English
Mandarin