Lingyi Y Zheng

US Patent:

8384192, Feb 26, 2013

Filed:

Mar 14, 2011

Appl. No.:

13/047430

Inventors:

Lingyi A. Zheng - Manassas VA, US
Trung T. Doan - Vallejo CA, US
Lyle D. Breiner - Meridian ID, US
Er-Xuan Ping - Meridian ID, US
Kevin L. Beaman - Boise ID, US
Ronald A. Weimer - Boise ID, US
Cem Basceri - Cary NC, US
David J. Kubista - Nampa ID, US

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H01L 21/02

US Classification:

257534, 257301, 257E29342

Abstract:

The present disclosure provides small scale capacitors (e. g. , DRAM capacitors) and methods of forming such capacitors. One exemplary implementation provides a method of fabricating a capacitor that includes sequentially forming a first electrode, a dielectric layer, and a second electrode. At least one of the electrodes may be formed by a) reacting two precursors to deposit a first conductive layer at a first deposition rate, and b) depositing a second conductive layer at a second, lower deposition rate by depositing a precursor layer of one precursor at least one monolayer thick and exposing that precursor layer to another precursor to form a nanolayer reaction product. The second conductive layer may be in contact with the dielectric layer and have a thickness of no greater than about 50 Å.

US Patent:

20060198955, Sep 7, 2006

Filed:

May 3, 2006

Appl. No.:

11/416866

Inventors:

Lingyi Zheng - Manassas VA, US
Trung Doan - Vallejo CA, US
Lyle Breiner - Meridian ID, US
Er-Xuan Ping - Meridian ID, US
Ronald Weimer - Boise ID, US
David Kubista - Nampa ID, US
Kevin Beaman - Boise ID, US
Cem Basceri - Reston VA, US

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

C23C 16/00

US Classification:

427248100, 118715000, 118728000

Abstract:

The present disclosure describes apparatus and methods for processing microfeature workpieces, e.g., by depositing material on a microelectronic semiconductor using atomic layer deposition. Some of these apparatus include microfeature workpiece holders that include gas distributors. One exemplary implementation provides a microfeature workpiece holder adapted to hold a plurality of microfeature workpieces. This workpiece holder includes a plurality of workpiece supports and a gas distributor. The workpiece supports are adapted to support a plurality of microfeature workpieces in a spaced-apart relationship to define a process space adjacent a surface of each microfeature workpiece. The gas distributor includes an inlet and a plurality of outlets, with each of the outlets positioned to direct a flow of process gas into one of the process spaces.

US Patent:

20060205187, Sep 14, 2006

Filed:

May 9, 2006

Appl. No.:

11/430492

Inventors:

Lingyi Zheng - Manassas VA, US
Trung Doan - Vallejo CA, US
Lyle Breiner - Meridian ID, US
Er-Xuan Ping - Meridian ID, US
Kevin Beaman - Boise ID, US
Ronald Weimer - Boise ID, US
David Kubista - Nampa ID, US
Cem Basceri - Reston VA, US

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H01L 21/20

US Classification:

438478000

Abstract:

The present disclosure suggests several systems and methods for batch processing of microfeature workpieces, e.g., semiconductor wafers or the like. One exemplary implementation provides a method of depositing a reaction product on each of a batch of workpieces positioned in a process chamber in a spaced-apart relationship. A first gas may be delivered to an elongate first delivery conduit that includes a plurality of outlets spaced along a length of the conduit. A first gas flow may be directed by the outlets to flow into at least one of the process spaces between adjacent workpieces along a first vector that is transverse to the direction in which the workpieces are spaced. A second gas may be delivered to an elongate second delivery conduit that also has outlets spaced along its length. A second gas flow of the second gas may be directed by the outlets to flow into the process spaces along a second vector that is transverse to the first direction.

US Patent:

20060213440, Sep 28, 2006

Filed:

May 9, 2006

Appl. No.:

11/430328

Inventors:

Lingyi Zheng - Manassas VA, US
Trung Doan - Vallejo CA, US
Lyle Breiner - Meridian ID, US
Er-Xuan Ping - Meridian ID, US
Kevin Beaman - Boise ID, US
Ronald Weimer - Boise ID, US
David Kubista - Nampa ID, US
Cem Basceri - Reston VA, US

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

C23C 16/00

US Classification:

118715000

Abstract:

The present disclosure suggests several systems and methods for batch processing of microfeature workpieces, e.g., semiconductor wafers or the like. One exemplary implementation provides a method of depositing a reaction product on each of a batch of workpieces positioned in a process chamber in a spaced-apart relationship. A first gas may be delivered to an elongate first delivery conduit that includes a plurality of outlets spaced along a length of the conduit. A first gas flow may be directed by the outlets to flow into at least one of the process spaces between adjacent workpieces along a first vector that is transverse to the direction in which the workpieces are spaced. A second gas may be delivered to an elongate second delivery conduit that also has outlets spaced along its length. A second gas flow of the second gas may be directed by the outlets to flow into the process spaces along a second vector that is transverse to the first direction.