Lionel Bruce Fullwood

US Patent:

20100195084, Aug 5, 2010

Filed:

Feb 3, 2009

Appl. No.:

12/322505

Inventors:

Lionel Fullwood - St George UT, US
Greg Baxter - Palm Desert CA, US
John H. Hart - Woodland Hills CA, US
Raja D. Singh - Claremont CA, US

International Classification:

G03B 27/60
G03B 27/32

US Classification:

355 73, 355 77

Abstract:

A substrate holding platen has a top surface having a plurality of openings, an enclosed plenum area below the top surface, and a large orifice valve connecting the plenum area to a high flow vacuum pump. The plurality of openings may include snubber slots on the top surface, and/or openings for automatic shims. The high flow vacuum pump preferably pulls between 100-150 cubic feet per minute (cfm) of air from the plenum through the large orifice valve.

US Patent:

20100194009, Aug 5, 2010

Filed:

Feb 3, 2009

Appl. No.:

12/322504

Inventors:

Lionel Fullwood - St. George UT, US
Greg Baxter - Palm Desert CA, US
John H. Hart - Woodland Hills CA, US
Raja D. Singh - Claremont CA, US

International Classification:

H01L 21/687

US Classification:

269 9, 269903, 269329

Abstract:

A panel platen for holding substrates such as PCBs has an automatic shimming mechanism to provide shims for panels of varying sizes and/or thicknesses. A platen includes a top surface, and a plurality of adjustable shims located below the top surface and around an edge of the platen, wherein the adjustable shims can be raised and lowered to a desired height to compensate for different sizes or thicknesses of substrates. A platen may include a top surface, a plurality of adjustable height pads located around an edge of the top surface, and a motorized control mechanism located below the top surface and configured to raise and lower the plurality of adjustable height pads. A method of automatically shimming different sized substrates on a platen includes providing a plurality of motorized shims under a top surface of the platen, and raising and lowering the motorized shims based on a size or thickness of a substrate.