Liqing A Wen from 3350 Jacinto Ave, Mesa, AZ 85204, age 61

Ultrapure Colloidal Silica For Use In Chemical Mechanical Polishing Applications
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US Patent:

20070075292, Apr 5, 2007
Filed:

Sep 22, 2006
Appl. No.:

11/526132
Inventors:

Deepak Mahulikar - Madison CT, US
Yuhu Wang - Santa Rosa CA, US
Ken Delbridge - Chandler AZ, US
Gert Moyaerts - Phoenix AZ, US
Saeed Mohseni - Sylvania OH, US
Nichole Koontz - Mess AZ, US
Bin Hu - Chandler AZ, US
Liqing Wen - Mesa AZ, US
International Classification:

C23F 1/14
C09K 13/00
US Classification:

252079100, 051308000, 216089000
Abstract:

A method of chemical mechanical polishing a surface of a substrate including the step of: contacting the substrate and a composition including a plurality of colloidal silica particles having less than 200 ppb of each trace metal impurity, excluding potassium and sodium, have less than 2 ppm residual alcohol and wherein the cumulative concentration of the trace metal, excluding potassium and sodium, is in the range from about 0.5 to about 5 ppm; and a medium for suspending the particles; wherein the composition is an ultrapure colloidal silica dispersion; and wherein the contacting is carried out at a temperature and for a period of time sufficient to planarize the substrate.

Ultrapure Colloidal Silica For Use In Chemical Mechanical Polishing Applications
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US Patent:

20070254964, Nov 1, 2007
Filed:

Jun 15, 2007
Appl. No.:

11/818730
Inventors:

Deepak Mahulikar - Madison CT, US
Yuhu Wang - Santa Rosa CA, US
Ken Delbridge - Chandler AZ, US
Gert Moyaerts - Phoenix AZ, US
Saeed Mohseni - Sylvania OH, US
Nichole Koontz - Mesa AZ, US
Bin Hu - Chandler AZ, US
Liqing Wen - Mesa AZ, US
International Classification:

B01F 3/12
B08B 7/00
US Classification:

516081000, 134007000, 051308000, 516086000
Abstract:

An ultrapure colloidal silica dispersion comprising colloidal silica particles having a mean or aggregate particle size from about 10 to about 200 nm, wherein the colloidal silica dispersion has less than 200 ppb of each trace metal impurity disposed therein, excluding potassium and sodium, and have less than 2 ppm residual alcohol.

Ultrapure Colloidal Silica For Use In Chemical Mechanical Polishing Applications
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US Patent:

20120145950, Jun 14, 2012
Filed:

Feb 24, 2012
Appl. No.:

13/405027
Inventors:

Deepak Mahulikar - Madison CT, US
Yuhu Wang - Santa Rosa CA, US
Ken A. Delbridge - Chandler AZ, US
Gert R.M. Moyaerts - Phoenix AZ, US
Saeed H. Mohseni - Sylvania OH, US
Nichole R. Koontz - Mesa AZ, US
Bin Hu - Chandler AZ, US
Liqing Wen - Mesa AZ, US
International Classification:

C09K 13/00
B82Y 30/00
US Classification:

252 791, 977895
Abstract:

An ultrapure colloidal silica dispersion comprising colloidal silica particles having a mean or aggregate particle size from about 10 to about 200 nm, wherein the colloidal silica dispersion has less than 200 ppb, of each trace metal impurity disposed therein, excluding potassium and sodium, and have less than 2 ppm residual alcohol. A method for producing and using the same is also disclosed.

Chemical Mechanical Polishing Compositions And Methods Of Use Thereof
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US Patent:

20220195241, Jun 23, 2022
Filed:

Dec 10, 2021
Appl. No.:

17/547352
Inventors:

- North Kingstown RI, US
Bin Hu - Chandler AZ, US
Ting-Kai Huang - Tainan City, TW
Shu-Wei Chang - Taoyuan District, TW
Liqing (Richard) Wen - Mesa AZ, US
Assignee:

FUJIFILM ELECTRIC MATERIALS U.S.A., INC. - North Kingstown RI
International Classification:

C09G 1/02
H01L 21/306
Abstract:

A polishing composition includes at least one abrasive, at least one organic acid, at least one anionic surfactant comprising at least a phosphate, at least one phosphonic acid compound having a molecular weight below 500 g/mol, at least one azole containing compound, at least one alkylamine compound having a 6-24 carbon alkyl chain, and an aqueous solvent, and optionally, a pH adjuster.

Polishing Compositions And Methods Of Use Thereof
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US Patent:

20210301177, Sep 30, 2021
Filed:

Mar 29, 2021
Appl. No.:

17/214987
Inventors:

- N. Kingstown RI, US
Ting-Kai Huang - Tainan City, TW
Yannan Liang - Gilbert AZ, US
Shu-Wei Chang - Taoyuan City, TW
Sung Tsai Lin - Taoyuan City, TW
Liqing Wen - Mesa AZ, US
International Classification:

C09G 1/02
H01L 21/321
Abstract:

This disclosure features a polishing composition that includes at least one abrasive; at least one first corrosion inhibitor that includes a phosphate or a phosphonate group; at least one complexing agent; at least one second corrosion inhibitor that is at least one azole compound; and optionally a pH adjuster.

Barrier Ruthenium Chemical Mechanical Polishing Slurry
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US Patent:

20210261822, Aug 26, 2021
Filed:

May 12, 2021
Appl. No.:

17/318011
Inventors:

- North Kingstown RI, US
Bin Hu - Chandler AZ, US
Liqing (Richard) Wen - Mesa AZ, US
Yannan Liang - Gilbert AZ, US
Ting-Kai Huang - Taiwan (ROC), CN
Assignee:

FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. - Rehovot
International Classification:

C09G 1/02
H01L 21/321
C09K 3/14
C09G 1/06
C09K 13/06
C09G 1/04
B24B 1/00
C09G 1/00
B24B 37/04
H01L 21/306
Abstract:

A slurry for polishing surfaces or substrates that at least partially comprise ruthenium and copper, wherein the slurry includes an alkali hydroxide, oxygenated halogen compound, and a halogen alkyl benzotriazole. The slurry may further include abrasive, acid(s), and, optionally, an alkoxylated alcohol. With these components, the slurry exhibits a high ruthenium to copper removal rate ratio.

Polishing Compositions And Methods Of Use Thereof
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US Patent:

20210253903, Aug 19, 2021
Filed:

Feb 8, 2021
Appl. No.:

17/169676
Inventors:

- N. Kingstown RI, US
Tawei Lin - Chandler AZ, US
Bin Hu - Chandler AZ, US
Liqing Wen - Mesa AZ, US
Yannan Liang - Gilbert AZ, US
International Classification:

C09G 1/02
C09K 15/30
H01L 21/321
Abstract:

A polishing composition includes an abrasive; a pH adjuster; a barrier film removal rate enhancer; a low-k removal rate inhibitor; an azole-containing corrosion inhibitor; and a hard mask removal rate enhancer. A method of polishing a substrate includes the steps of: applying the polishing composition described herein to a surface of a substrate, wherein the surface comprises ruthenium or a hard mask material; and bringing a pad into contact with the surface of the substrate and moving the pad in relation to the substrate.

Polishing Compositions And Methods Of Use Thereof
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US Patent:

20210253904, Aug 19, 2021
Filed:

Feb 8, 2021
Appl. No.:

17/169685
Inventors:

- N. Kingstown RI, US
Tawei Lin - Chandler AZ, US
Bin Hu - Chandler AZ, US
Liqing Wen - Mesa AZ, US
Yannan Liang - Gilbert AZ, US
International Classification:

C09G 1/02
B24B 37/04
Abstract:

A polishing composition, includes an abrasive; a pH adjuster; a barrier film removal rate enhancer; a low-k removal rate inhibitor; an azole-containing corrosion inhibitor; and a ruthenium removal rate enhancer. A method of polishing a substrate includes the steps of: applying the polishing composition described herein to a surface of a substrate, wherein the surface comprises ruthenium or a hard mask material; and bringing a pad into contact with the surface of the substrate and moving the pad in relation to the substrate.